A contactless readable programmable transponder to monitor chip join and method of use are disclosed. The method includes reading a frequency of an oscillator associated with a chip module. The method further includes correlating the frequency with a bond quality of the chip module.

Embodiments relate to current sensors and methods. In an embodiment, a current sensor comprises a leadframe; a semiconductor die coupled to the leadframe; a conductor comprising a metal layer on the semiconductor die, the conductor comprising at least one bridge portion and at least two slots, a first slot having a first tip and a second slot having a second tip, a distance between the first and second tips defining a width of one of the at least one bridge portion, wherein the conductor is separated from the leadframe by at least a thickness of the semiconductor die, and the thickness is about 0.2 millimeters (mm) to about 0.7 mm; and at least one magnetic sensor element arranged on the die relative to and spaced apart from the one of the at least one bridge portion and more proximate the conductor than the leadframe.

A device for attaching a sensor to a lug has an inert resilient plastic frame which encircles the top surface of a lug and is held in place by snaps which engage the cable bore of the lug. A resilient retainer for holding a sensor extends from the frame.

A device for attaching a sensor to a lug has an inert resilient plastic frame which encircles the top surface of a lug and is held in place by snaps which engage the cable bore of the lug. A resilient retainer for holding a sensor extends from the frame.

A solid state impedance tuner or impedance tuner system including a housing structure and at least two solid state tuner modules electrically combined and disposed in one package within the housing structure. Each tuner module includes at least one solid state control element.

Another embodiment is directed to an impedance tuner module card configured in a standardized system architecture. The card includes a chassis board, and at least one solid state tuner module integrated on the card and supported on or by the chassis board, each module including at least one solid state control element.

Methods for calibrating a solid state impedance tuner that includes at least two solid state tuner modules combined in one package are disclosed.

A power monitoring system includes a plurality of current sensors suitable to sense respective changing electrical current within a respective conductor to a respective load and a conductor sensing a respective voltage potential provided to the respective load. A power monitors determines a type of circuit based upon a signal from at least one of the current sensors and a signal from the conductor, wherein the type of circuit includes at least one of a single phase circuit, a two phase circuit, and a three phase circuit. The power meter configures a set of registers corresponding to the determined type of circuit in a manner such that the configuring is different based upon each of the single phase circuit, two phase circuit, and three phase circuit suitable to provide data corresponding to the determined type of circuit.

An arrangement for use in a utility meter includes at least one circuit path, a three phase service switch, and a three phase monitoring unit. The at least one circuit path operably couples a source of electrical energy to a load. The service switch is operably coupled to the at least one circuit path and is configurable in an open state and a closed state. The monitoring unit is operably coupled to the at least one circuit path between the load and the service switch and is configured to detect a presence and an absence of line voltage on the load. The monitoring unit is further configured (i) to generate an open circuit signal responsive to the detection of the absence of line voltage on the load, and (ii) to generate a closed circuit signal responsive to the detection of the presence of line voltage on the load.

A method for detecting a fault condition of an operational amplifier of an integrated circuit during operation includes operating an integrated circuit which includes an operational amplifier (op-amp) having a V+ input, a V input and an op-amp output and an on-line fault detector electrically coupled to the V+ input and the V input of the op-amp of the on-line fault detector, monitoring an operation of the op-amp with the on-line fault detector, and developing a fault signal at a fault detector output if the op-amp is in a fault condition as determined by the on-line fault detector.

The invention relates to a system comprising a probe and a measuring device, wherein the probe is connected to an input of the measuring device, and wherein an analog-digital converter is connected downstream of the input of the measuring device. The probe provides an analog-digital converter for the generation of a value-discrete and/or time-discrete signal from an analog input signal, wherein the value-discrete and/or time-discrete signal is supplied to the analog-digital converter of the measuring device. The invention further relates to a method for the registration of an analog signal by means of a system comprising a probe and a measuring device.

In some embodiments, a magnetometer mounting apparatus and system may reduce noise and magnetic flux interference by mounting the magnetometer inside a cavity in a collar that fits around a tool insert. The cavity may be sealed with a hatch cover/outsert. Another embodiment mounts a plurality of magnetometers around the periphery of a mounting ring that is coupled to the insert. Yet another embodiment mounts the magnetometers in a gap sub in the BHA. Still another embodiment longitudinally mounts the magnetometers on the insert such that a diagonal distance between two magnetometers is the greatest possible on the insert.