A contact probe includes a shell having a first end and an opposed second end. The shell defines an interior chamber therein and a longitudinal axis extending through the first end and the second end. The contact probe further includes a plunger partially received within the interior chamber and extending longitudinally outward of the first end. The plunger includes a tip for electrically connecting the contact probe to an external chip. The contact probe further includes a stepped collar coupled to the shell. The stepped collar includes a first step and a second step. The second step extends about the shell and the first step extends around the plunger longitudinally between the second step and the tip.

A probe cleaning sheet for preventing a probe pin damage and manufacturing method thereof, during the process of a probe pin puncturing the cleaning layer, the material of the cleaning layer and the plurality of high and low density cleaning particles of abrasive material contained in the high density cleaning material and the low density cleaning material are able to efficiently scrape away foreign material from the surface of the probe pin. In addition, the negative charge carried by the silicone itself and its lipophilic characteristics are used to transfer the foreign material on the probe pin to the cleaning layer, and the protective layer is used to prevent overpressure from the probe pin directly impacting the substrate and causing damage to the tips of the probe pin.

A probe cleaning sheet for preventing a probe pin damage and manufacturing method thereof, during the process of a probe pin puncturing the cleaning layer, the material of the cleaning layer and the plurality of high and low density cleaning particles of abrasive material contained in the high density cleaning material and the low density cleaning material are able to efficiently scrape away foreign material from the surface of the probe pin. In addition, the negative charge carried by the silicone itself and its lipophilic characteristics are used to transfer the foreign material on the probe pin to the cleaning layer, and the protective layer is used to prevent overpressure from the probe pin directly impacting the substrate and causing damage to the tips of the probe pin.

A contact, an inspection jig using the contact, an inspection device, and a method of manufacturing the contact are provided. A contact includes a coil spring including a slit formed in a cylindrical body and first and second conductors. A bottom wall portion, a first side wall portion, a second side wall portion, and a top wall portion are configured so a cross-sectional shape of the cylindrical body as viewed in the axial direction is rectangular, the slit includes a first slit, a second slit, a third slit, and a fourth slit, the third slit is continuous with the first slit and the second slit, the fourth slit is continuous with the second slit, the first slit and the second slit are rectangular in a side view of the cylindrical body, the first and second conductors respectively connected to first and second end portions of the cylindrical body.

A contact, an inspection jig using the contact, an inspection device, and a method of manufacturing the contact are provided. A contact includes a coil spring including a slit formed in a cylindrical body and first and second conductors. A bottom wall portion, a first side wall portion, a second side wall portion, and a top wall portion are configured so a cross-sectional shape of the cylindrical body as viewed in the axial direction is rectangular, the slit includes a first slit, a second slit, a third slit, and a fourth slit, the third slit is continuous with the first slit and the second slit, the fourth slit is continuous with the second slit, the first slit and the second slit are rectangular in a side view of the cylindrical body, the first and second conductors respectively connected to first and second end portions of the cylindrical body.

An example test fixture, which interfaces a tester and a unit under test (UUT), includes the following: first electrical contacts that face the tester; second electrical contacts that face the UUT; a substrate made of sections of printed first material, with the first material being electrically non-conductive, and with the substrate being between the first electrical contacts and the second electrical contacts; and structures through the substrate, with the structures including sections of second material, with the second material being electrically conductive, and with at least one of the structures electrically connecting a first electrical contact and a second electrical contact.

Embodiments of the invention is based on a device for testing electronic components with at least one test socket with test contacts, with a nest, in which at least one electronic component can be placed, and with at least one cleaning unit for the test contacts of the test socket, wherein by means of a relative movement, which can be carried out as a test stroke, between the test socket and nest the electronic component can be pressed against, and lifted from, the test contacts of the test socket. According to embodiments of the invention the at least one cleaning unit is designed in such a manner that during each test stroke the test contacts come into contact with the at least one cleaning unit.

Embodiments of the invention is based on a device for testing electronic components with at least one test socket with test contacts, with a nest, in which at least one electronic component can be placed, and with at least one cleaning unit for the test contacts of the test socket, wherein by means of a relative movement, which can be carried out as a test stroke, between the test socket and nest the electronic component can be pressed against, and lifted from, the test contacts of the test socket. According to embodiments of the invention the at least one cleaning unit is designed in such a manner that during each test stroke the test contacts come into contact with the at least one cleaning unit.

A sensor system with performance compensation testing capability includes a sensor device, a resistance bridge, a signal conditioning circuit, a first test connector, and a second test connector. The resistance bridge circuit is disposed on the sensor device and includes an excitation terminal, a circuit common terminal, and two output terminals, and is configured, upon being energized, to supply a bridge output voltage across the two output terminals. The signal conditioning circuit is electrically coupled to the excitation terminal, the circuit common terminal, and the two output terminals, and is configured to supply a sensor output signal representative of bridge output voltage. The first test connector is electrically coupled to one of the two output terminals and is configured to be coupled to an impedance test device. The second test connector is electrically coupled to the circuit common terminal and is configured to be coupled to the impedance test device.

A sensor system with performance compensation testing capability includes a sensor device, a resistance bridge, a signal conditioning circuit, a first test connector, and a second test connector. The resistance bridge circuit is disposed on the sensor device and includes an excitation terminal, a circuit common terminal, and two output terminals, and is configured, upon being energized, to supply a bridge output voltage across the two output terminals. The signal conditioning circuit is electrically coupled to the excitation terminal, the circuit common terminal, and the two output terminals, and is configured to supply a sensor output signal representative of bridge output voltage. The first test connector is electrically coupled to one of the two output terminals and is configured to be coupled to an impedance test device. The second test connector is electrically coupled to the circuit common terminal and is configured to be coupled to the impedance test device.