An inspection apparatus, including an extendable structure, an inspection probe, a drive, a sensor, and a processor. The extendable structure includes an end fixed to the inspection probe and insertable into a gap defined between a first surface and a second surface. The extendable structure is configured to maintain physical contact with the first surface as the end transitions across the first surface. The drive is configured to position the inspection probe. The current sensor is coupled to the drive and configured to measure a drive load over a period of time the inspection probe transitions across the first surface. The processor is coupled to the sensor and is configured to receive a signal associated with the drive load corresponding to movement of the inspection probe, and determine an operating condition of the extendable structure based on the drive load signal.

An inspection apparatus, including an extendable structure, an inspection probe, a drive, a sensor, and a processor. The extendable structure includes an end fixed to the inspection probe and insertable into a gap defined between a first surface and a second surface. The extendable structure is configured to maintain physical contact with the first surface as the end transitions across the first surface. The drive is configured to position the inspection probe. The current sensor is coupled to the drive and configured to measure a drive load over a period of time the inspection probe transitions across the first surface. The processor is coupled to the sensor and is configured to receive a signal associated with the drive load corresponding to movement of the inspection probe, and determine an operating condition of the extendable structure based on the drive load signal.

Apparatuses and methods of distinguishing between a finger and stylus proximate to a touch surface are described. One apparatus includes a first circuit to obtain capacitance measurements of sense elements when a conductive object is proximate to a touch surface. The apparatus also includes a second circuit coupled to the first circuit. The second circuit is operable to detect whether the conductive object activates the first sense element, second sense element, or both, in view of the capacitance measurements. To distinguish between a stylus and a finger as the conductive object, the second circuit determines the conductive object as being the stylus when the second sense element is activated and the first sense element is not activated and determines the conductive object as being the finger when the first sense element and the second sense element are activated.

A probe tip structure that decreases the accumulation rate of Sn particles to the probe tip and enables considerably more efficient and complete laser cleaning is disclosed. In an embodiment, the probe structure includes an array of probe tips, each probe tip having an inner core; an interfacial layer bonded to the inner core; and an outer layer bonded to the interfacial layer, wherein the outer layer is resistant to adherence of the solder of the ball grid array package.

A probe tip structure that decreases the accumulation rate of Sn particles to the probe tip and enables considerably more efficient and complete laser cleaning is disclosed. In an embodiment, the probe structure includes an array of probe tips, each probe tip having an inner core; an interfacial layer bonded to the inner core; and an outer layer bonded to the interfacial layer, wherein the outer layer is resistant to adherence of the solder of the ball grid array package.

A test probe structure having a planar surface and contact locations matched to test hardware is provided. The fabrication of the test probe structure addresses problems related to the possible deformation of base substrates during manufacture. Positional accuracy of contact locations and planarity of base substrates is achieved using dielectric layers, laser ablation, injection molded solder or redistribution layer wiring, and planarization techniques.

Embodiments relate to the formation of test probes. One method includes providing a bulk sheet of an electrically conductive material. A laser is used to cut through the bulk sheet in a predetermined pattern to form a test probe. Other embodiments are described and claimed.

Embodiments relate to the formation of test probes. One method includes providing a bulk sheet of an electrically conductive material. A laser is used to cut through the bulk sheet in a predetermined pattern to form a test probe. Other embodiments are described and claimed.

Methods of fabricating a plurality of carbon nanotube-bundle probes on a substrate are disclosed. In some embodiments, the method includes the following: providing a substrate having a top surface and a bottom surface; forming an array of electrically conductive pads on the top surface, the array of electrically conductive pads being formed to mirror an array of pads on an integrated circuit that is to be tested; applying a catalyst for promoting growth of carbon nanotubes on each of the array of electrically conductive pads; heating the substrate in a carbon-rich environment thereby growing nanotubes extending upwardly from each of the array of electrically conductive pads and above the top surface of the substrate thereby forming a plurality of carbon nanotube-bundle probes extending upwardly above the top surface of the substrate; and capping each of the plurality of carbon nanotube-bundle probes with an electrically conductive material.

Devices and methods for well logging using a wear resistant electrode are provided. A downhole device may include a drill bit, a gauge pad mounted on the drill bit, and a first electrode mounted in the gauge pad. An insulating polycrystalline diamond (PCD) material may surround at least a portion of the first electrode. Additionally, the first electrode may include an electrically conductive wear resistant contact point that maintains constant contact with a wall of a wellbore. Additionally, the first electrode may measure an impedance of a geological formation during a drilling operation.