Devices and methods for well logging using a wear resistant electrode are provided. A downhole device may include a drill bit, a gauge pad mounted on the drill bit, and a first electrode mounted in the gauge pad. An insulating polycrystalline diamond (PCD) material may surround at least a portion of the first electrode. Additionally, the first electrode may include an electrically conductive wear resistant contact point that maintains constant contact with a wall of a wellbore. Additionally, the first electrode may measure an impedance of a geological formation during a drilling operation.

Embodiments are directed to the formation micro-scale or millimeter scale structures or methods of making such structures wherein the structures are formed from at least one sheet structural material and may include additional sheet structural materials or deposited structural materials wherein all or a portion of the patterning of the structural materials occurs via laser cutting. In some embodiments, selective deposition is used to provide a portion of the patterning. In some embodiments the structural material or structural materials are bounded from below by a sacrificial bridging material (e.g. a metal) and possibly from above by a sacrificial capping material (e.g. a metal).

A method of making a cantilever MEMS probe module includes the steps of forming a cantilever MEMS probe on a first surface of a circuit substrate by a MEMS fabrication process in a way that the cantilever MEMS probe has a support post electrically and mechanically connected with an electric contact of the first surface, a cantilever arm connected with the support post, and a needle connected with the cantilever arm, and forming a through hole penetrating through the first surface and a second surface opposite to the first surface of the circuit substrate and corresponding in position to the needle and a part of the cantilever arm by using a cutting tool to cut the circuit substrate from the second surface toward the first surface of the circuit substrate. A probe module made by the method is disclosed too.

A method of making a cantilever MEMS probe module includes the steps of forming a cantilever MEMS probe on a first surface of a circuit substrate by a MEMS fabrication process in a way that the cantilever MEMS probe has a support post electrically and mechanically connected with an electric contact of the first surface, a cantilever arm connected with the support post, and a needle connected with the cantilever arm, and forming a through hole penetrating through the first surface and a second surface opposite to the first surface of the circuit substrate and corresponding in position to the needle and a part of the cantilever arm by using a cutting tool to cut the circuit substrate from the second surface toward the first surface of the circuit substrate. A probe module made by the method is disclosed too.

A probe card assembly and associated processes of forming them may include a wiring substrate with a first surface and an opposite surface, an electrically conductive first via comprising electrically conductive material extending into the wiring substrate from the opposite surface and ending before reaching the first surface, and a plurality of electrically conductive second vias, and a custom electrically conductive terminal disposed on the first surface such that said custom terminal covers the first via and contacts one of the second vias adjacent to said first via without electrically contacting the first via. Each of the second vias may be electrically conductive from the first surface to the opposite surface. The first via may include electrically insulating material disposed within a hole in the first via.

A probe card assembly and associated processes of forming them may include a wiring substrate with a first surface and an opposite surface, an electrically conductive first via comprising electrically conductive material extending into the wiring substrate from the opposite surface and ending before reaching the first surface, and a plurality of electrically conductive second vias, and a custom electrically conductive terminal disposed on the first surface such that said custom terminal covers the first via and contacts one of the second vias adjacent to said first via without electrically contacting the first via. Each of the second vias may be electrically conductive from the first surface to the opposite surface. The first via may include electrically insulating material disposed within a hole in the first via.

An apparatus for energy auditing can include a sensor portion on a circuit substrate, the sensor portion defining a first opening, an integrated inductor on the sensor portion, the integrated inductor being formed proximal to the first opening or a hall sensor located on the sensor portion proximal to the first opening, and an electronic circuit on a body portion of the circuit substrate electrically coupled to the integrated inductor and configured to wirelessly transmit information to a wireless receiver.

An apparatus for energy auditing can include a sensor portion on a circuit substrate, the sensor portion defining a first opening, an integrated inductor on the sensor portion, the integrated inductor being formed proximal to the first opening or a hall sensor located on the sensor portion proximal to the first opening, and an electronic circuit on a body portion of the circuit substrate electrically coupled to the integrated inductor and configured to wirelessly transmit information to a wireless receiver.

A method for producing a pulse inverter comprising a module with electronic components, a contact bar sticking out from a side of the module, a current measuring device arranged on the contact bar, and a control board arranged on the module with a driver circuit, wherein the driver circuit makes contact with the module across control contacting pins of the module and with the current measuring device across measurement contacting pins of the current measuring device, wherein the current measuring device is movably attached to the contact bar, after which the control board is positioned such that the control contacting pins are led through control contact openings of the control board and the current measuring device is displaced such that the measurement contacting pins are led through measurement contact openings of the control board, after which the current measuring device is secured to the contact bar and/or the control board.

A method for producing a pulse inverter comprising a module with electronic components, a contact bar sticking out from a side of the module, a current measuring device arranged on the contact bar, and a control board arranged on the module with a driver circuit, wherein the driver circuit makes contact with the module across control contacting pins of the module and with the current measuring device across measurement contacting pins of the current measuring device, wherein the current measuring device is movably attached to the contact bar, after which the control board is positioned such that the control contacting pins are led through control contact openings of the control board and the current measuring device is displaced such that the measurement contacting pins are led through measurement contact openings of the control board, after which the current measuring device is secured to the contact bar and/or the control board.