Patent classifications
G01R3/00
CONTACT PROBE AND CONTACTING MEMBER THEREOF, METHOD OF MANUFACTURING CONTACTING MEMBER, PROBE SYSTEM USING THE CONTACTING MEMBER, METHOD OF TESTING UNPACKAGED SEMICONDUCTOR DEVICE, TESTED SEMICONDUCTOR DEVICE AND METHOD OF PRODUCING THE SAME
A contacting member of a contact probe for a probe system for performing a functionality test to a DUT includes a body, a contact tip, and a tip transition section between the body and the contact tip. A bottom side of the contacting member, which faces toward the DUT when testing the DUT, includes a lower surface at the body, a tip bottom surface at the contact tip, and a tip transition surface at the tip transition section. A contact end of the contact tip for contacting the DUT is located on a front side of the tip bottom surface. A rear side of the tip bottom surface and the lower surface have a height difference therebetween. The tip transition surface gradually changes in height from the lower surface to the rear side of the tip bottom surface. The contacting member has high precision and structural strength.
CONTACT PROBE AND CONTACTING MEMBER THEREOF, METHOD OF MANUFACTURING CONTACTING MEMBER, PROBE SYSTEM USING THE CONTACTING MEMBER, METHOD OF TESTING UNPACKAGED SEMICONDUCTOR DEVICE, TESTED SEMICONDUCTOR DEVICE AND METHOD OF PRODUCING THE SAME
A contacting member of a contact probe for a probe system for performing a functionality test to a DUT includes a body, a contact tip, and a tip transition section between the body and the contact tip. A bottom side of the contacting member, which faces toward the DUT when testing the DUT, includes a lower surface at the body, a tip bottom surface at the contact tip, and a tip transition surface at the tip transition section. A contact end of the contact tip for contacting the DUT is located on a front side of the tip bottom surface. A rear side of the tip bottom surface and the lower surface have a height difference therebetween. The tip transition surface gradually changes in height from the lower surface to the rear side of the tip bottom surface. The contacting member has high precision and structural strength.
Acoustic device, acoustic system, moving body device, and malfunction diagnosis method for acoustic system
An inspection signal generator of an acoustic device outputs a first inspection signal. An amplifier receives a first reference signal, and outputs a second inspection signal according to the first inspection signal. A first detector is electrically connected to an output side of the amplifier, and outputs a first detection signal based on the second inspection signal. The first detector is electrically connected to the output side of the amplifier, and outputs the first detection signal based on the second inspection signal. A determiner compares a first detection signal output from the first detector with a preset determination reference signal so as to detect electrical abnormality between a ground terminal and an output terminal electrically connected to the output side of the amplifier.
Testing device and assembling method thereof
A testing device utilized in a testing apparatus includes a top guiding board having top penetrating openings, a bottom guiding board disposed at one side of the top guiding board and having bottom penetrating openings, and elastic contact structures disposed between the top guiding board and the bottom guiding board. A testing device offset (represented by d.sub.2) exists between the top guiding board and the bottom guiding board. Each elastic contact structure has a tip section, a body section, and a tail section in sequence. The elastic contact structures pass through the top penetrating openings and the bottom penetrating openings respectively. Each elastic contact structure has an elastic contact structure offset between the tip section and the tail section. Each elastic contact structure has a target elastic contact structure offset (represented by d.sub.1), in which d.sub.1 and d.sub.2 satisfy the following equation:
d.sub.2=d.sub.150200 m.
Testing device and assembling method thereof
A testing device utilized in a testing apparatus includes a top guiding board having top penetrating openings, a bottom guiding board disposed at one side of the top guiding board and having bottom penetrating openings, and elastic contact structures disposed between the top guiding board and the bottom guiding board. A testing device offset (represented by d.sub.2) exists between the top guiding board and the bottom guiding board. Each elastic contact structure has a tip section, a body section, and a tail section in sequence. The elastic contact structures pass through the top penetrating openings and the bottom penetrating openings respectively. Each elastic contact structure has an elastic contact structure offset between the tip section and the tail section. Each elastic contact structure has a target elastic contact structure offset (represented by d.sub.1), in which d.sub.1 and d.sub.2 satisfy the following equation:
d.sub.2=d.sub.150200 m.
Test probe substrate
A test probe structure having a planar surface and contact locations matched to test hardware is provided. The fabrication of the test probe structure addresses problems related to the possible deformation of base substrates during manufacture. Positional accuracy of contact locations and planarity of base substrates is achieved using dielectric layers, laser ablation, injection molded solder or redistribution layer wiring, and planarization techniques.
Test probe substrate
A test probe structure having a planar surface and contact locations matched to test hardware is provided. The fabrication of the test probe structure addresses problems related to the possible deformation of base substrates during manufacture. Positional accuracy of contact locations and planarity of base substrates is achieved using dielectric layers, laser ablation, injection molded solder or redistribution layer wiring, and planarization techniques.
Guide plate for a probe card and probe card provided with same
It is an object of the invention to provide a guide plate for a probe card with fine through holes at tight pitches and with increased strength. The guide plate 100 for a probe card includes a metal base 110; first insulation layers 120; and metal layers 130. The metal base 110 has a plurality of through holes 111 to receive probes therethrough, and inner walls of the through holes 111. The first insulation layers 120 are of tuboid shape and provided on the respective inner walls of the through holes 111 of the metal base 110. The metal layers 130 are provided on the first insulation layers 120.
Guide plate for a probe card and probe card provided with same
It is an object of the invention to provide a guide plate for a probe card with fine through holes at tight pitches and with increased strength. The guide plate 100 for a probe card includes a metal base 110; first insulation layers 120; and metal layers 130. The metal base 110 has a plurality of through holes 111 to receive probes therethrough, and inner walls of the through holes 111. The first insulation layers 120 are of tuboid shape and provided on the respective inner walls of the through holes 111 of the metal base 110. The metal layers 130 are provided on the first insulation layers 120.
Chip test pressing-down apparatus and formation method thereof
The present disclosure includes a die test pressing-down apparatus and a formation method. The die test pressing-down apparatus includes a support frame capable of moving along a vertical direction; and a pressing-down block installed on the support frame. A part to-be-pressed is disposed directly below the pressing-down block. The pressing-down block is connected to the support frame through an installation plate; a strip-shaped through hole is formed at an upper surface of the support frame; a first protruding strip is at each lower portion of two opposite inner walls of the strip-shaped through hole; a corresponding second protruding strip is at each upper portion of two opposite side surfaces of the installation plate; and a side of a strip-shaped block is fixedly connected to the upper surface of the support frame, and another side of the strip-shaped block is connected to the second protruding strip through at least two springs.