A magnetoresistive sensor contains a bridge circuit having at least one magnetoresistive resistor, wherein the bridge circuit is configured to provide a first differential analog output voltage. The magnetoresistive sensor also contains an amplifier circuit connected downstream of the bridge circuit, wherein the amplifier circuit is configured to provide a second differential analog output voltage based on the first differential analog output voltage provided by the bridge circuit. The second differential analog output voltage has a value of zero at a specified magnetic field strength not equal to zero. A common-mode voltage associated with the second differential analog output voltage corresponds to a specified percentage of a supply voltage of the bridge circuit.

The MEMS probe card of the invention belongs to the technical field of IC manufacturing industry, and specifically relates to the manufacturing of micro-electromechanical systems, testing of semiconductor bare chip and related key technologies; From top to bottom, the probe card comprises a stiffener, a PCB board, an adapter layer, a guide plate and a MEMS probe; the invention not only discloses a MEMS probe card, but also discloses a new manufacturing process of a MEMS probe card, including the structure of MEMS probe card, the etching equipment and method of guide plate-MEMS probe structure template, the probe positioning method of etching the guide plate-MEMS probe structure template, the manufacturing method of the guide plate-MEMS probe structure and the docking device and method of the guide plate-MEMS probe structure and the adapter layer to finally realize the manufacturing of a submicron-sized MEMS probe card.

Because reprocessing or refurbishing of physiological sensors reuses large portions of an existing sensor, the material costs for refurbishing sensors is significantly lower than the material costs for making an entirely new sensor. Typically, existing reprocessors replace only the adhesive portion of an adhesive physiological sensor and reuse the sensing components. However, re-using the sensing components can reduce the reliability of the refurbished sensor and/or reduce the number of sensors eligible for refurbishing due to out-of-specification sensor components. It is therefore desirable to provide a process for refurbishing physiological sensors that replaces the sensing components of the sensor. While sensing components are replaced, generally, sensor cable and/or patient monitor attachments are retained, resulting in cost savings over producing new sensors.

A tactile sensor includes a flexible medium having electrically conductive strips embedded therein and extending in a first direction, said electrically conductive strips including conductive nanostructures dispersed in a flexible support material, said nanostructures selected from conductive nanowires, carbon nanotubes, and graphene, wherein each electrically conductive strip is connected at each end to an impedance measuring device that measures the impedance across each electrically conductive strip. The electrically conductive strips may be formed on a first layer of the flexible medium by using direct-write technology.

A tactile sensor includes a flexible medium having electrically conductive strips embedded therein and extending in a first direction, said electrically conductive strips including conductive nanostructures dispersed in a flexible support material, said nanostructures selected from conductive nanowires, carbon nanotubes, and graphene, wherein each electrically conductive strip is connected at each end to an impedance measuring device that measures the impedance across each electrically conductive strip. The electrically conductive strips may be formed on a first layer of the flexible medium by using direct-write technology.

A two-dimensional SQIF array and methods for manufacture can include at least two bi-SQUIDs that share an inductance. The bi-SQUIDs can be combined to establish a diamond-shaped cell. A plurality of the diamond shaped cells can be packed tightly together so that each cell shares at least three cell junctions with adjacent cells to establish the SQIF array. Because of the close proximity of the cells, the effect that the mutual inductances each cell has on adjacent cells can be accounted for, as well as the SQIF array boundary conditions along the array edges. To do this, a matrix of differential equations can be solved to provide for the recommended inductance of each bi-SQUID in the SQIF array. Each bi-SQUID can be manufactured with the recommended inductance to result in a SQIF having an increased strength of anti-peak response, but without sacrificing the linearity of the response.

A two-dimensional SQIF array and methods for manufacture can include at least two bi-SQUIDs that share an inductance. The bi-SQUIDs can be combined to establish a diamond-shaped cell. A plurality of the diamond shaped cells can be packed tightly together so that each cell shares at least three cell junctions with adjacent cells to establish the SQIF array. Because of the close proximity of the cells, the effect that the mutual inductances each cell has on adjacent cells can be accounted for, as well as the SQIF array boundary conditions along the array edges. To do this, a matrix of differential equations can be solved to provide for the recommended inductance of each bi-SQUID in the SQIF array. Each bi-SQUID can be manufactured with the recommended inductance to result in a SQIF having an increased strength of anti-peak response, but without sacrificing the linearity of the response.

An electrical contact assembly for use in an integrated circuit testing apparatus having a plurality of electrical contact pins and electrical insulators that are each fashioned with through-openings that match a cross-section of a rigid shaft so that the rigid shaft can be threaded through the contact pins and insulators. This ensures that the position of each contact pin is substantially aligned in a single datum with other contact pins following the datum of the rigid shaft. The electrical insulators are placed between each contact pin to prevent electrical connection between contact pins. Further, four rigid shafts assembled in this manner may be interlocked with each other to form a rectangular assembly, which can be inserted into an appropriate housing of the testing apparatus.

An electrical contact assembly for use in an integrated circuit testing apparatus having a plurality of electrical contact pins and electrical insulators that are each fashioned with through-openings that match a cross-section of a rigid shaft so that the rigid shaft can be threaded through the contact pins and insulators. This ensures that the position of each contact pin is substantially aligned in a single datum with other contact pins following the datum of the rigid shaft. The electrical insulators are placed between each contact pin to prevent electrical connection between contact pins. Further, four rigid shafts assembled in this manner may be interlocked with each other to form a rectangular assembly, which can be inserted into an appropriate housing of the testing apparatus.

A probe insertion auxiliary and a method of probe insertion are provided. A light source illuminates holes on a lower die to make the position of the holes clear for an operator. The probe insertion auxiliary includes a bottom and a clamp pair disposed on the bottom. The clamp pair has two clamp parts. The two clamp parts define a slit for disposing a probe chassis. Furthermore, the two clamp parts and the bottom form a space. A light source is disposed inside the space for illuminating the holes.