A method of manufacturing a space transformer includes providing a carrier substrate made for a chip package, forming an insulated layer disposed on the carrier substrate, and forming a conductive block. The carrier substrate is formed with elongated first and second wires. The first wire has an elongated contact which is longer than the width of the first wire. The insulated layer is formed with a hole corresponding in position to the elongated contact. The conductive block is formed with an elongated connecting column located in the hole and connected with the elongated contact, and a cylindrical contact pad exposed at the outside of the insulated layer, larger-sized than the elongated connecting column is connected with the elongated connecting column. As a result, the cylindrical contact pad has sufficient area and structural strength for contact with a probe needle.

A method of manufacturing a space transformer includes providing a carrier substrate made for a chip package, forming an insulated layer disposed on the carrier substrate, and forming a conductive block. The carrier substrate is formed with elongated first and second wires. The first wire has an elongated contact which is longer than the width of the first wire. The insulated layer is formed with a hole corresponding in position to the elongated contact. The conductive block is formed with an elongated connecting column located in the hole and connected with the elongated contact, and a cylindrical contact pad exposed at the outside of the insulated layer, larger-sized than the elongated connecting column is connected with the elongated connecting column. As a result, the cylindrical contact pad has sufficient area and structural strength for contact with a probe needle.

The invention relates to a method for producing a pressure sensor, comprising the following steps: assembling a support substrate with a deformable membrane on which strain gauges have been deposited, wherein the deformable membrane comprises a thinned area at the center thereof, the support substrate is disposed on top of the deformable membrane, the support substrate comprises an upper surface and a lower surface in contact with the deformable membrane, and the support substrate also comprises lateral recesses arranged on top of the strain gauges and a central recess arranged on top of the thinned area of the membrane, so as to obtain a micromechanical structure; and, once the assembly has been obtained, depositing, in a single step, at least one conductive material on the upper surface of the support and in the lateral recesses of the support, said conductive material extending into the recesses in order to be in contact with the strain gauges so as to form electrical contacts in contact with the strain gauges.

The present invention generally relates to nanoscale wires for use in sensors and other applications. In various embodiments, a probe comprising a nanotube (or other nanoscale wire) is provided that can be directly inserted into a cell to determine a property of the cell, e.g., an electrical property. In some cases, only the tip of the nanoscale wire is inserted into the cell; this tip may be very small relative to the cell, allowing for very precise study. In some aspects, the tip of the probe is held by a holding member positioned on a substrate, e.g., at an angle, which makes it easier for the probe to be inserted into the cell. The nanoscale wire may also be connected to electrodes and/or form part of a transistor, such that a property of the nanoscale wire, and thus of the cell, may be determined. Such probes may also be useful for studying other samples besides cells. Other aspects of the invention are generally directed to methods of making or using such probes, kits involving such probes, devices involving such probes, or the like.

The present invention generally relates to nanoscale wires for use in sensors and other applications. In various embodiments, a probe comprising a nanotube (or other nanoscale wire) is provided that can be directly inserted into a cell to determine a property of the cell, e.g., an electrical property. In some cases, only the tip of the nanoscale wire is inserted into the cell; this tip may be very small relative to the cell, allowing for very precise study. In some aspects, the tip of the probe is held by a holding member positioned on a substrate, e.g., at an angle, which makes it easier for the probe to be inserted into the cell. The nanoscale wire may also be connected to electrodes and/or form part of a transistor, such that a property of the nanoscale wire, and thus of the cell, may be determined. Such probes may also be useful for studying other samples besides cells. Other aspects of the invention are generally directed to methods of making or using such probes, kits involving such probes, devices involving such probes, or the like.

A probe device includes an electrode plate arranged above a mounting table for mounting thereon a semiconductor wafer and electrically connected to a tester, a connection conductor arranged at a side of the mounting table and electrically connected to a mounting table electrode formed on a mounting surface of the mounting table, and a cleaning mechanism including a polishing unit for polishing a contact portion of the connection conductor, a brush cleaning unit for performing a brush-cleaning of the contact portion, and a contact resistance measuring unit for measuring a contact resistance of the contact portion. The mounting table electrode is in contact with a backside electrode of a semiconductor device of the semiconductor wafer. When the connection conductor is connected to the electrode plate, a backside electrode formed on a backside of the semiconductor device and the tester are electrically connected to each other.

A probe device includes an electrode plate arranged above a mounting table for mounting thereon a semiconductor wafer and electrically connected to a tester, a connection conductor arranged at a side of the mounting table and electrically connected to a mounting table electrode formed on a mounting surface of the mounting table, and a cleaning mechanism including a polishing unit for polishing a contact portion of the connection conductor, a brush cleaning unit for performing a brush-cleaning of the contact portion, and a contact resistance measuring unit for measuring a contact resistance of the contact portion. The mounting table electrode is in contact with a backside electrode of a semiconductor device of the semiconductor wafer. When the connection conductor is connected to the electrode plate, a backside electrode formed on a backside of the semiconductor device and the tester are electrically connected to each other.

Configuring a test socket to electrically couple a semiconductor package to a test device includes preparing a test socket including a base material and a first conductive portion included in the base material. The first conductive portion may extend in a thickness direction of the base material. Configuring the test socket may include forming a second conductive portion including conductive ink on the first conductive pattern. The second conductive portion may be formed based on printing conductive ink on the first conductive portion. The configuring may include forming the second conductive portion to repair the test socket. The first conductive portion may be degraded such that a top surface of the first conductive portion includes a surface depression. The second conductive portion may fill the surface depression. The first and second conductive portions may be integral with each other.

Configuring a test socket to electrically couple a semiconductor package to a test device includes preparing a test socket including a base material and a first conductive portion included in the base material. The first conductive portion may extend in a thickness direction of the base material. Configuring the test socket may include forming a second conductive portion including conductive ink on the first conductive pattern. The second conductive portion may be formed based on printing conductive ink on the first conductive portion. The configuring may include forming the second conductive portion to repair the test socket. The first conductive portion may be degraded such that a top surface of the first conductive portion includes a surface depression. The second conductive portion may fill the surface depression. The first and second conductive portions may be integral with each other.

A circuit includes, in series between a first terminal and a second terminal of application of a power supply voltage, and first and second branches. The first branch includes a first transistor and a first current source coupled to the first transistor. The second branch includes a resistive element, a second transistor coupled to the resistive element and forming a current mirror with the first transistor and a second current source coupled to the second transistor. The resistive element conditions a threshold of detection of a variation of the power supply voltage.