Probe tip formation is described for die sort and test. In one example, the tips of wires of a test probe head are prepared for use as test probes. The wires are attached to a test probe head substrate. The end opposite the substrate has a tip. The tips of the wires are polished when attached to the test probe head to form a sharpened point.

Probe tip formation is described for die sort and test. In one example, the tips of wires of a test probe head are prepared for use as test probes. The wires are attached to a test probe head substrate. The end opposite the substrate has a tip. The tips of the wires are polished when attached to the test probe head to form a sharpened point.

A measuring resistor for high-current measurements is provided, which has a defined resistance value. The measuring resistor has a resistive layer having a sheet resistivity. The resistance value of the measuring resistor is defined by the resistive layer and is less than the sheet resistivity of the resistive layer.

A probe for connecting an electrode terminal of an electric circuit or an electric component includes a first spring; a second spring covering the first spring; a cover covering the second spring; a first terminal that is connected to the second spring and is provided at one end of the probe; and a second terminal that is connected to the cover and is provided at another end of the probe.

A probe for connecting an electrode terminal of an electric circuit or an electric component includes a first spring; a second spring covering the first spring; a cover covering the second spring; a first terminal that is connected to the second spring and is provided at one end of the probe; and a second terminal that is connected to the cover and is provided at another end of the probe.

A wafer test machine is disclosed. The wafer test machine comprises a main body having a chamber defined therein, wherein a probe card is disposed at an upper portion of the chamber; a chuck for fixing a wafer in the chamber; a moving unit for moving the chuck in the chamber, thus making a contact between the probe card and the wafer; and a laser cleaning apparatus for cleaning the probe card in the chamber using a laser beam, when the probe card does not contact the wafer.

A wafer test machine is disclosed. The wafer test machine comprises a main body having a chamber defined therein, wherein a probe card is disposed at an upper portion of the chamber; a chuck for fixing a wafer in the chamber; a moving unit for moving the chuck in the chamber, thus making a contact between the probe card and the wafer; and a laser cleaning apparatus for cleaning the probe card in the chamber using a laser beam, when the probe card does not contact the wafer.

A repairable rigid test probe system includes an annular gimbal supported by an annular gimbal bearing of a probe card assembly, a test substrate seated and aligned within the annular gimbal, a rigid die including thick periphery and a thin center containing an array of through holes that is aligned above the test substrate, and an array of rigid probes inserted into each of the array of through holes, where each rigid probe includes: a tail end that contacts a connection on a facing surface of the test substrate, a collar limiting a distance of insertion, and a tip that contacts a corresponding contact on a facing surface of a device under test.

Proposed are a probe card for performing a circuit test of a wafer and a manufacturing method therefor. More particularly, proposed are a probe card and a manufacturing method therefor, in which the process of inserting probe pins is eliminated.

Proposed are a probe card for performing a circuit test of a wafer and a manufacturing method therefor. More particularly, proposed are a probe card and a manufacturing method therefor, in which the process of inserting probe pins is eliminated.