A device under test (DUT) has terminals connected to electrically conductive contacts which are in turn connect to a load board and to a test signal source. A second set of kelvin terminals are likewise connected to the DUT, but by pass the load board for connection to a test signal source. The kelvin terminals extend distally away from the DUT and are bonded to a flex circuit at their distal ends so that they make electrical and mechanical contact with the flex circuit. An intermediary terminal block receives the flex circuit and a ribbon cable or other wire connects to a test signal source. The entire circuit then circumvents the use of the load board.

A device under test (DUT) has terminals connected to electrically conductive contacts which are in turn connect to a load board and to a test signal source. A second set of kelvin terminals are likewise connected to the DUT, but by pass the load board for connection to a test signal source. The kelvin terminals extend distally away from the DUT and are bonded to a flex circuit at their distal ends so that they make electrical and mechanical contact with the flex circuit. An intermediary terminal block receives the flex circuit and a ribbon cable or other wire connects to a test signal source. The entire circuit then circumvents the use of the load board.

It is an object of the invention to provide a guide plate for a probe card with fine through holes at tight pitches and with increased strength. The guide plate 100 for a probe card includes a metal base 110; first insulation layers 120; and metal layers 130. The metal base 110 has a plurality of through holes 111 to receive probes therethrough, and inner walls of the through holes 111. The first insulation layers 120 are of tuboid shape and provided on the respective inner walls of the through holes 111 of the metal base 110. The metal layers 130 are provided on the first insulation layers 120.

It is an object of the invention to provide a guide plate for a probe card with fine through holes at tight pitches and with increased strength. The guide plate 100 for a probe card includes a metal base 110; first insulation layers 120; and metal layers 130. The metal base 110 has a plurality of through holes 111 to receive probes therethrough, and inner walls of the through holes 111. The first insulation layers 120 are of tuboid shape and provided on the respective inner walls of the through holes 111 of the metal base 110. The metal layers 130 are provided on the first insulation layers 120.

A probe calibration device that includes a first offset element having a substantially rectangular first aperture. The probe calibration device includes a tuned pass element disposed adjacent to the first offset element. The tuned pass element has a non-rectangular second aperture. The probe calibration device includes a second offset element disposed adjacent to the tuned pass element and on a side opposite the first offset element. The second offset element has a substantially rectangular third aperture. The probe calibration device includes a backing element disposed adjacent to the second offset element. The first offset element, the tuned pass element, the second offset element and the backing element form a cavity.

A probe calibration device that includes a first offset element having a substantially rectangular first aperture. The probe calibration device includes a tuned pass element disposed adjacent to the first offset element. The tuned pass element has a non-rectangular second aperture. The probe calibration device includes a second offset element disposed adjacent to the tuned pass element and on a side opposite the first offset element. The second offset element has a substantially rectangular third aperture. The probe calibration device includes a backing element disposed adjacent to the second offset element. The first offset element, the tuned pass element, the second offset element and the backing element form a cavity.

An embedded sensor apparatus for enabling wireless signal transmission while protecting an embedded sensor is disclosed. In various embodiments, an embedded sensor apparatus may comprise a substrate with a cavity, a wireless sensor embedded in the cavity of the substrate, a protective cover coupled to the wireless sensor, and a ferrite layer covering the protective cover. Further, the embedded sensor apparatus may comprise an electromagnetic reflector coupled between the wireless sensor and the substrate. In addition, the ferrite layer may be a ferrite plug, a deposited ferrite layer, or a combination thereof. Furthermore, in various embodiments, covering the protective cover with the ferrite layer may comprise depositing the ferrite layer on the protective cover using a cold spray process. In another embodiment, covering the protective cover with the ferrite layer may comprise depositing the ferrite layer on the protective cover using a thermal spray process.

An embedded sensor apparatus for enabling wireless signal transmission while protecting an embedded sensor is disclosed. In various embodiments, an embedded sensor apparatus may comprise a substrate with a cavity, a wireless sensor embedded in the cavity of the substrate, a protective cover coupled to the wireless sensor, and a ferrite layer covering the protective cover. Further, the embedded sensor apparatus may comprise an electromagnetic reflector coupled between the wireless sensor and the substrate. In addition, the ferrite layer may be a ferrite plug, a deposited ferrite layer, or a combination thereof. Furthermore, in various embodiments, covering the protective cover with the ferrite layer may comprise depositing the ferrite layer on the protective cover using a cold spray process. In another embodiment, covering the protective cover with the ferrite layer may comprise depositing the ferrite layer on the protective cover using a thermal spray process.

A contact element (25) (electroformed product) is produced by electroforming. The contact element (25) has a surface on which an insulating film (28) having been formed by use of a dry film resist or the like is provided. In a process of producing the contact element (25), the insulating film (28) is provided after a step of producing the contact element 25. This makes it possible to provide electroformed components configured so that respective electroformed products (contact terminals) are arranged at narrow pitches while maintaining electrical insulation of the electroformed products from each other.

A contact element (25) (electroformed product) is produced by electroforming. The contact element (25) has a surface on which an insulating film (28) having been formed by use of a dry film resist or the like is provided. In a process of producing the contact element (25), the insulating film (28) is provided after a step of producing the contact element 25. This makes it possible to provide electroformed components configured so that respective electroformed products (contact terminals) are arranged at narrow pitches while maintaining electrical insulation of the electroformed products from each other.