[Problem] The purpose of the present invention is to facilitate the insertion of a probe into two or more guide plates. [Solution] The present invention is provided with: a probe body 600 accommodated in a guide unit 30 for a probe card 1, the guide unit 30 comprising a first guide plate 301 and a second guide plate 302 disposed with a gap therebetween, and supported by a first guide hole 311 of the first guide plate 301 and a second guide hole 312 of the second guide plate 302; and a leader rod 610 that has a substantially linear shape with one end thereof connected to the probe body 600, that is inserted into the first guide hole 301 earlier than the probe body 600, and that can be separated from the probe body 600 after passing through the second guide hole 302.

[Problem] The purpose of the present invention is to facilitate the insertion of a probe into two or more guide plates. [Solution] The present invention is provided with: a probe body 600 accommodated in a guide unit 30 for a probe card 1, the guide unit 30 comprising a first guide plate 301 and a second guide plate 302 disposed with a gap therebetween, and supported by a first guide hole 311 of the first guide plate 301 and a second guide hole 312 of the second guide plate 302; and a leader rod 610 that has a substantially linear shape with one end thereof connected to the probe body 600, that is inserted into the first guide hole 301 earlier than the probe body 600, and that can be separated from the probe body 600 after passing through the second guide hole 302.

Cantilever probes are produced for use in a test apparatus of integrated electronic circuits. The probes are configured to contact corresponding terminals of the electronic circuits to be tested during a test operation. The probe bodies are formed of electrically conductive materials. On a lower portion of each probe body that, in use, is directed to the respective terminal to be contacted, an electrically conductive contact region is formed having a first hardness value equal to or greater than 300 HV; each contact region and the respective probe body form the corresponding probe.

Cantilever probes are produced for use in a test apparatus of integrated electronic circuits. The probes are configured to contact corresponding terminals of the electronic circuits to be tested during a test operation. The probe bodies are formed of electrically conductive materials. On a lower portion of each probe body that, in use, is directed to the respective terminal to be contacted, an electrically conductive contact region is formed having a first hardness value equal to or greater than 300 HV; each contact region and the respective probe body form the corresponding probe.

An apparatus for repairing a test-contact arrangement includes: a movable arm at whose end effector at least one heat-conductive receptacle is formed, at which a heat-absorption surface is formed; a control device configured for controlling a movement of the arm; a heating device configured for heating the heat-absorption surface; and a temperature measuring device configured for measuring a radiation temperature of a solder material of the solder connection. The receptacle is configured for receiving at least one heat-conductive blade element, and the control device is configured for moving the blade element via a movement of the arm in relation to the test-contact arrangement to sever the at least one solder connection so that at least one solder bridge to be repaired is removable.

An apparatus for repairing a test-contact arrangement includes: a movable arm at whose end effector at least one heat-conductive receptacle is formed, at which a heat-absorption surface is formed; a control device configured for controlling a movement of the arm; a heating device configured for heating the heat-absorption surface; and a temperature measuring device configured for measuring a radiation temperature of a solder material of the solder connection. The receptacle is configured for receiving at least one heat-conductive blade element, and the control device is configured for moving the blade element via a movement of the arm in relation to the test-contact arrangement to sever the at least one solder connection so that at least one solder bridge to be repaired is removable.

An electronic device may include a housing and circuitry carried by the housing and having a device ground associated therewith. The electronic device may also include an array of biometric finger sensing pixel electrodes and an array shielding electrode outside the array of biometric finger sensing pixels. A finger coupling electrode may be outside the array shielding electrode and coupled to the device ground. The electronic device may also include drive circuitry capable of generating a drive signal for the array of biometric finger sensing pixel electrodes and a compensating drive signal for the array shielding electrode.

An electronic device may include a housing and circuitry carried by the housing and having a device ground associated therewith. The electronic device may also include an array of biometric finger sensing pixel electrodes and an array shielding electrode outside the array of biometric finger sensing pixels. A finger coupling electrode may be outside the array shielding electrode and coupled to the device ground. The electronic device may also include drive circuitry capable of generating a drive signal for the array of biometric finger sensing pixel electrodes and a compensating drive signal for the array shielding electrode.

A method of increasing uniformity in light from a light source at a plurality of targets of the light includes locating a plurality of movable aperture elements between the light source and the targets. Each aperture element defines an aperture through which the light passes from the light source to an associated one of the plurality of targets associated with the aperture element along a longitudinal axis of the aperture element. The method also includes moving at least one of the aperture elements along its longitudinal axis to change a feature of light incident on the target associated with the aperture element.

A contact-distance transformer of an electric testing device for testing an electric specimen such as a wafer, for reducing a distance between neighboring electric contacts, the transformer having a non-electrically conductive supporting structure with a first side with first electric contacts positioned apart a first distance and a second side with second electric contacts positioned apart a second, smaller distance. The first contacts are connected to the second contacts by electric connections passing through the support structure and/or which are positioned on the support structure.