A a testing head with vertical probes for a probe card, including: at least one pair of support and guide plates arranged parallel to each other in a prefixed spaced apart relation and provided with a plurality of guide and housing holes; a plurality of contact probes housed and extended between corresponding holes of the guide plates; at least one additional plate slidingly mounted next to one or the other of the guide plates and provided with one corresponding plurality of holes of the guide plates. The embodiments also relate to a method of assembly of the testing head.

A a testing head with vertical probes for a probe card, including: at least one pair of support and guide plates arranged parallel to each other in a prefixed spaced apart relation and provided with a plurality of guide and housing holes; a plurality of contact probes housed and extended between corresponding holes of the guide plates; at least one additional plate slidingly mounted next to one or the other of the guide plates and provided with one corresponding plurality of holes of the guide plates. The embodiments also relate to a method of assembly of the testing head.

An apparatus for testing semiconductor devices is disclosed. In one example, the apparatus includes a rolling contactor comprising a first cylindrical rotatable holder, a plurality of test pin sets, each one of the test pin sets being connected to the cylindrical rotatable holder. Each one of the test pin sets comprises a plurality of test pins, and a substrate configured to support a plurality of semiconductor devices. The semiconductor devices comprising one or more contact elements on a main surface thereof remote from the substrate, wherein the first cylindrical rotatable holder and the substrate are arranged relative to each other so that due to a rotating movement of the first cylindrical rotatable holder the test pins of the test pin sets are successively contacted with the contact elements of the semiconductor devices.

The present invention discloses methods, gantry, and room's infrastructure for maneuvering a portable open-bore magnetic resonance device with no fringing of its magnetic field (MRD) from at least one first location towards at least one static patient placed at at least one second remote location. The gantry comprises a transporting mechanism; and, an open-bore MRD, interconnected to the gantry by at least one maneuverable member. The MRD, by means of the gantry, is transportable from the first location to the second remote location adjacent the static patient. The aperture of the MRD's open-bore, by means of said maneuverable member, is directable towards a defined spatially orientation facing the static patient.

The present invention discloses methods, gantry, and room's infrastructure for maneuvering a portable open-bore magnetic resonance device with no fringing of its magnetic field (MRD) from at least one first location towards at least one static patient placed at at least one second remote location. The gantry comprises a transporting mechanism; and, an open-bore MRD, interconnected to the gantry by at least one maneuverable member. The MRD, by means of the gantry, is transportable from the first location to the second remote location adjacent the static patient. The aperture of the MRD's open-bore, by means of said maneuverable member, is directable towards a defined spatially orientation facing the static patient.

A multilayer circuit board includes a ceramic multilayer body that is a stack of multiple ceramic layers, a resin multilayer body on the ceramic multilayer body 2 that is a stack of multiple resin layers, conductive vias in the uppermost ceramic layer, and conductive vias in the lowermost resin layer. The upper end faces of the conductive vias are exposed on the interface between the ceramic multilayer body and the resin multilayer body. The lower end faces of the conductive vias are exposed on the interface between the ceramic multilayer body and the resin multilayer body and directly connected to the upper end faces of the conductive vias in the uppermost ceramic layer. The lower end faces of the conductive vias on the resin layer side are within the upper end faces of the conductive vias on the ceramic layer side in plan view.

A method of fabricating a test probe includes a first conductive providing operation in which a first conductive member formed of a conductive metal material is provided, the first conductive member including a probe portion that has a probe shape and is formed in an upper portion of the first conductive member by a micro-electromechanical systems (MEMS) process, a second conductive member providing operation in which a second conductive member formed of a conductive metal material is provided, the second conductive member having an insertion portion formed in an upper portion of the second conductive member for inserting the first conductive member to be coupled to the insertion portion, an insertion operation in which the first conductive member is inserted into the insertion portion of the second conductive member, and a fixing and coupling operation in which the first conducive member is fixedly coupled to the second conductive member by deforming a part of the second conductive member.

A method of fabricating a test probe includes a first conductive providing operation in which a first conductive member formed of a conductive metal material is provided, the first conductive member including a probe portion that has a probe shape and is formed in an upper portion of the first conductive member by a micro-electromechanical systems (MEMS) process, a second conductive member providing operation in which a second conductive member formed of a conductive metal material is provided, the second conductive member having an insertion portion formed in an upper portion of the second conductive member for inserting the first conductive member to be coupled to the insertion portion, an insertion operation in which the first conductive member is inserted into the insertion portion of the second conductive member, and a fixing and coupling operation in which the first conducive member is fixedly coupled to the second conductive member by deforming a part of the second conductive member.

A capacitive sensor sheet producing method for producing a capacitive sensor sheet uses a base having an insulative base layer on which a binder resin layer including conductive nanowires is formed. The conductive nanowires partially projecting from a surface of the binder resin layer. The method includes removing a binder resin from projections of conductive nanowires partially projected from a plurality of detection electrodes by implementing a surface etching and shaping treatment on a surface of the binder resin layer, or surface ends of at least partial detection electrodes of the plurality of detection electrodes, forming wiring lines of the conductive pattern layer, and connecting the wiring lines to the surface ends of at least partial detection electrodes in the pattern layer. The projections of the conductive nanowires removed the binder resin are put into contact with the connecting portions.

A capacitive sensor sheet producing method for producing a capacitive sensor sheet uses a base having an insulative base layer on which a binder resin layer including conductive nanowires is formed. The conductive nanowires partially projecting from a surface of the binder resin layer. The method includes removing a binder resin from projections of conductive nanowires partially projected from a plurality of detection electrodes by implementing a surface etching and shaping treatment on a surface of the binder resin layer, or surface ends of at least partial detection electrodes of the plurality of detection electrodes, forming wiring lines of the conductive pattern layer, and connecting the wiring lines to the surface ends of at least partial detection electrodes in the pattern layer. The projections of the conductive nanowires removed the binder resin are put into contact with the connecting portions.