A vertical probe includes opposite first and third sides, and opposite second and fourth sides. The third and fourth sides extend in a planar manner from a body to a tip portion. The first and second sides include first and second upper plane segments at the body, first and second transition segments at the tip portion, and first and second lower plane segments closer to the third and fourth sides than the first and second upper plane segments are, respectively. The first and second transition segments gradually approach the third and fourth sides as they extend from the first and second upper plane segments to the first and second lower plane segments. The first transition and lower plane segments are realized by laser processing. The vertical probe can contact small conductive contacts with good current resistance, structural strength, lifespan, and processing accuracy. When applied to a probe head, breaking or shifting position of the tip portion due to vertical movement can be avoided.

A vertical probe includes opposite first and third sides, and opposite second and fourth sides. The third and fourth sides extend in a planar manner from a body to a tip portion. The first and second sides include first and second upper plane segments at the body, first and second transition segments at the tip portion, and first and second lower plane segments closer to the third and fourth sides than the first and second upper plane segments are, respectively. The first and second transition segments gradually approach the third and fourth sides as they extend from the first and second upper plane segments to the first and second lower plane segments. The first transition and lower plane segments are realized by laser processing. The vertical probe can contact small conductive contacts with good current resistance, structural strength, lifespan, and processing accuracy. When applied to a probe head, breaking or shifting position of the tip portion due to vertical movement can be avoided.

Disclosed is an apparatus and a tool for installation of a measurement coil. The apparatus includes a tool and a holder. The tool has a first portion and a second portion at least partially surrounding the first portion. The first portion is configured to receive a conductor and the second portion is configured to hold a measurement coil. The holder is configured to be detachably attached to the tool, wherein the holder is to be employed to install the tool holding the measurement coil onto a conductor. The first portion is configured to fit onto the conductor during installation, and the measurement coil at least partially surrounds the conductor when installed.

Disclosed is an apparatus and a tool for installation of a measurement coil. The apparatus includes a tool and a holder. The tool has a first portion and a second portion at least partially surrounding the first portion. The first portion is configured to receive a conductor and the second portion is configured to hold a measurement coil. The holder is configured to be detachably attached to the tool, wherein the holder is to be employed to install the tool holding the measurement coil onto a conductor. The first portion is configured to fit onto the conductor during installation, and the measurement coil at least partially surrounds the conductor when installed.

A testing apparatus for integrated circuits (ICs) that includes a printed circuit board (PCB) incorporating a test circuit is provided. The testing apparatus includes an insulating support structure and multiple conductive pillars. The insulating support structure features several through-holes designed to accommodate the conductive pillars. The conductive pillars are partially embedded within the insulating support structure and extend through the through-holes to establish electrical connections for IC testing. These conductive pillars possess elasticity, enabling them to adapt to various sizes and shapes of ICs. The insulating support structure includes multiple grooves adjacent to the through-holes, wherein portions of the conductive pillars are embedded to enhance their secure attachment to the insulating support structure. The testing apparatus also includes an isolation layer located adjacent to the conductive pillars to prevent the pillars from contacting each other and causing short circuits. Moreover, the invention provides a method for manufacturing the testing apparatus.

A testing apparatus for integrated circuits (ICs) that includes a printed circuit board (PCB) incorporating a test circuit is provided. The testing apparatus includes an insulating support structure and multiple conductive pillars. The insulating support structure features several through-holes designed to accommodate the conductive pillars. The conductive pillars are partially embedded within the insulating support structure and extend through the through-holes to establish electrical connections for IC testing. These conductive pillars possess elasticity, enabling them to adapt to various sizes and shapes of ICs. The insulating support structure includes multiple grooves adjacent to the through-holes, wherein portions of the conductive pillars are embedded to enhance their secure attachment to the insulating support structure. The testing apparatus also includes an isolation layer located adjacent to the conductive pillars to prevent the pillars from contacting each other and causing short circuits. Moreover, the invention provides a method for manufacturing the testing apparatus.

The present invention provides a probe card. The probe card comprises a circuit board, a cantilever-type space transformer electrically connected to the circuit board, and a vertical probe head electrically connected to the cantilever-type space transformer. The vertical probe head comprises a probe base and a plurality of vertical probes. The cantilever-type space transformer comprises a mounting base and a plurality of cantilever converting probes, wherein each cantilever converting probe has a fixed segment and an exposed segment. The fixed segment is secured to the mounting base, and the exposed segment is located outside the mounting base. The fixing segment enters from the side of the mounting base and forms a contact at the bottom of the mounting base.

The present invention provides a probe card. The probe card comprises a circuit board, a cantilever-type space transformer electrically connected to the circuit board, and a vertical probe head electrically connected to the cantilever-type space transformer. The vertical probe head comprises a probe base and a plurality of vertical probes. The cantilever-type space transformer comprises a mounting base and a plurality of cantilever converting probes, wherein each cantilever converting probe has a fixed segment and an exposed segment. The fixed segment is secured to the mounting base, and the exposed segment is located outside the mounting base. The fixing segment enters from the side of the mounting base and forms a contact at the bottom of the mounting base.

In a method for manufacturing a current sensor, a wiring board is placed by bringing the wiring board into contact with board contact portions of a sensor housing while deforming an adhesive applied on top surfaces of board adhesion portions of the sensor housing between the board adhesion portions and the wiring board, and a shield is placed by bringing the shield into contact with shield contact portions of the sensor housing while deforming an adhesive applied on top surfaces of shield adhesion portions of the sensor housing between the shield adhesion portions and the shield. After the placing of the wiring board and the placing of the shield, both the adhesive positioned between the board adhesion portions and the wiring board and the adhesive positioned between the shield adhesion portions and the shield are cured simultaneously.

In a method for manufacturing a current sensor, a wiring board is placed by bringing the wiring board into contact with board contact portions of a sensor housing while deforming an adhesive applied on top surfaces of board adhesion portions of the sensor housing between the board adhesion portions and the wiring board, and a shield is placed by bringing the shield into contact with shield contact portions of the sensor housing while deforming an adhesive applied on top surfaces of shield adhesion portions of the sensor housing between the shield adhesion portions and the shield. After the placing of the wiring board and the placing of the shield, both the adhesive positioned between the board adhesion portions and the wiring board and the adhesive positioned between the shield adhesion portions and the shield are cured simultaneously.