A packaged electronic device has a die with a load circuit, a resistor and an analog to digital converter (ADC). The resistor is coupled between a supply node of the die and a power input of the load circuit. The ADC has a first input coupled to a first terminal of the resistor, and a second input coupled to a second terminal of the resistor to measure a voltage across the resistor while a supply voltage is applied to the supply node to determine a load current conducted by the load circuit. A method of manufacturing a packaged electronic device includes wafer processing to fabricate the load circuit, the resistor and the ADC on or in a die area of the wafer with the resistor coupled between the power input of the load circuit and the supply node of the die area.

A packaged electronic device has a die with a load circuit, a resistor and an analog to digital converter (ADC). The resistor is coupled between a supply node of the die and a power input of the load circuit. The ADC has a first input coupled to a first terminal of the resistor, and a second input coupled to a second terminal of the resistor to measure a voltage across the resistor while a supply voltage is applied to the supply node to determine a load current conducted by the load circuit. A method of manufacturing a packaged electronic device includes wafer processing to fabricate the load circuit, the resistor and the ADC on or in a die area of the wafer with the resistor coupled between the power input of the load circuit and the supply node of the die area.

A method for manufacturing a short-circuit protection device, including producing, on a first face of a first substrate, a plurality of first electrically conductive segments; producing, on the first face, a plurality of electrically conductive pads each being in mechanical and electrical contact, through the base thereof, with a single corresponding first segment; producing, on a second face of a second substrate, a plurality of second electrically conductive segments; placing the first face and the second face opposite to each other, to bring a free end of each pad into mechanical and electrical contact with a single corresponding second segment, such that the first segments, the second segments and the pads form a coil.

A method for manufacturing a short-circuit protection device, including producing, on a first face of a first substrate, a plurality of first electrically conductive segments; producing, on the first face, a plurality of electrically conductive pads each being in mechanical and electrical contact, through the base thereof, with a single corresponding first segment; producing, on a second face of a second substrate, a plurality of second electrically conductive segments; placing the first face and the second face opposite to each other, to bring a free end of each pad into mechanical and electrical contact with a single corresponding second segment, such that the first segments, the second segments and the pads form a coil.

The present invention relates primarily to a method of fabrication of one or more free-standing micromachined parts. The method includes performing reactive ion etching of photoresist and tungsten-based layers supported on a carrier substrate to thereby define one or more micromachined parts, followed by separating the resulting one or more micromachined parts from the carrier substrate such that the parts are free-standing. The invention also relates to tungsten-based microprobe obtainable by such a method, wherein the microprobe has a substantially square or rectangular cross-section in a direction perpendicular to a longitudinal axis of the microprobe, and to probe cards comprising a plurality of such microprobes.

The present invention relates primarily to a method of fabrication of one or more free-standing micromachined parts. The method includes performing reactive ion etching of photoresist and tungsten-based layers supported on a carrier substrate to thereby define one or more micromachined parts, followed by separating the resulting one or more micromachined parts from the carrier substrate such that the parts are free-standing. The invention also relates to tungsten-based microprobe obtainable by such a method, wherein the microprobe has a substantially square or rectangular cross-section in a direction perpendicular to a longitudinal axis of the microprobe, and to probe cards comprising a plurality of such microprobes.

A magnetoresistive sensor is provided. The magnetoresistive sensor comprises a substrate having a layer structure thereon. The layer structure comprises a lower layer, and an upper layer. The lower layer is provided on the substrate, wherein the lower layer comprises one or more graphene layers which extend across the lower layer. The upper layer is provided on the lower layer and formed of a dielectric material. The lower and upper layers of the layer structure share one or more continuous edge surfaces. The magnetoresistive sensor further comprises a first electrical contact provided adjacent to the layer structure such that the first electrical contact is in direct contact with the one or more graphene layers via one of the one or more continuous edge surfaces, a second electrical contact provided adjacent to the layer structure such that the second electrical contact is in direct contact with the one or more graphene layers via one of the one or more continuous edge surfaces, and a continuous air-resistant coating layer covering the layer structure.

A magnetoresistive sensor is provided. The magnetoresistive sensor comprises a substrate having a layer structure thereon. The layer structure comprises a lower layer, and an upper layer. The lower layer is provided on the substrate, wherein the lower layer comprises one or more graphene layers which extend across the lower layer. The upper layer is provided on the lower layer and formed of a dielectric material. The lower and upper layers of the layer structure share one or more continuous edge surfaces. The magnetoresistive sensor further comprises a first electrical contact provided adjacent to the layer structure such that the first electrical contact is in direct contact with the one or more graphene layers via one of the one or more continuous edge surfaces, a second electrical contact provided adjacent to the layer structure such that the second electrical contact is in direct contact with the one or more graphene layers via one of the one or more continuous edge surfaces, and a continuous air-resistant coating layer covering the layer structure.

The disclosure relates to a method of fabricating a test socket including forming a plate-shaped first coupling block by joining a first base member made of a conductive material and a first insulating member made of an insulating material; forming a plate-shaped second coupling block by joining a second base member made of the conductive material and a second insulating member made of the insulating material; forming a first barrel accommodating hole for accommodating a part of the probe and a first support hole for supporting one end portion of the probe in the first coupling block; forming a second barrel accommodating hole for accommodating the rest of the probe and a first support hole for supporting the other end portion of the probe in the second coupling block; inserting one end of the probe into the first barrel accommodating hole to be supported on the first support hole, and inserting the other end of the probe into the second barrel accommodating hole to be supported on the second support hole; and joining the first coupling block and the second coupling block.

The disclosure relates to a method of fabricating a test socket including forming a plate-shaped first coupling block by joining a first base member made of a conductive material and a first insulating member made of an insulating material; forming a plate-shaped second coupling block by joining a second base member made of the conductive material and a second insulating member made of the insulating material; forming a first barrel accommodating hole for accommodating a part of the probe and a first support hole for supporting one end portion of the probe in the first coupling block; forming a second barrel accommodating hole for accommodating the rest of the probe and a first support hole for supporting the other end portion of the probe in the second coupling block; inserting one end of the probe into the first barrel accommodating hole to be supported on the first support hole, and inserting the other end of the probe into the second barrel accommodating hole to be supported on the second support hole; and joining the first coupling block and the second coupling block.