Disclosed is a test socket. The test socket includes a base frame shaped like a plate having a plurality of probe holes and conductive probes accommodated in the plurality of probe holes, having terminal portions protruding from both sides of the base frame, and comprising elastic material having higher elastic deformation than the base frame and conductive particles distributed in the elastic material.

Disclosed is a test socket. The test socket includes a base frame shaped like a plate having a plurality of probe holes and conductive probes accommodated in the plurality of probe holes, having terminal portions protruding from both sides of the base frame, and comprising elastic material having higher elastic deformation than the base frame and conductive particles distributed in the elastic material.

A method for manufacturing a metal structure designed to put a plurality of electronic devices in electric contact, the method including the steps of: arranging a planar lower support; depositing a first photoresist layer on the lower support; etching the first photoresist layer so as to form at least one first through opening in the first photoresist layer; filling the at least one first through opening with a conductive material so as to form at least one first conductive segment, which develops along a growth direction; depositing a first metallic primary layer on the first photoresist layer; repeating the previous steps to form other conductive segments in line with the first one to define the metal structure; and a step of removing the photoresist layers and the metallic primary layers so as to release the metal structure.

A method for manufacturing a metal structure designed to put a plurality of electronic devices in electric contact, the method including the steps of: arranging a planar lower support; depositing a first photoresist layer on the lower support; etching the first photoresist layer so as to form at least one first through opening in the first photoresist layer; filling the at least one first through opening with a conductive material so as to form at least one first conductive segment, which develops along a growth direction; depositing a first metallic primary layer on the first photoresist layer; repeating the previous steps to form other conductive segments in line with the first one to define the metal structure; and a step of removing the photoresist layers and the metallic primary layers so as to release the metal structure.

A testing device includes N devices, and N1 probe heads. N is an integer. An M-th probe head includes devices 1 to N-M electrically connected to each other. The M-th probe head is configured to test the M-th device, and M is an integer between 1 and N1.

A testing device includes N devices, and N1 probe heads. N is an integer. An M-th probe head includes devices 1 to N-M electrically connected to each other. The M-th probe head is configured to test the M-th device, and M is an integer between 1 and N1.

A method for producing a probe card comprises the steps of: providing a carrier board, wherein a surface of the carrier board has at least one probe guiding portion; and generating a probe on the probe guiding portion by performing additive manufacturing with a conductive material directly on the at least one probe guiding portion to generate the probe, wherein the additive manufacturing comprises directly layering the conductive material on the probe guiding portion.

A method for producing a probe card comprises the steps of: providing a carrier board, wherein a surface of the carrier board has at least one probe guiding portion; and generating a probe on the probe guiding portion by performing additive manufacturing with a conductive material directly on the at least one probe guiding portion to generate the probe, wherein the additive manufacturing comprises directly layering the conductive material on the probe guiding portion.

A method for manufacturing an electrical component, comprising: an armature (1) formed by a polymeric plastic material and an organometallic additive and comprising a support arm (4), with a winding (2) formed directly on the surface of the support arm (4) by a conductor track (10) forming turns. According to the invention, in order to obtain a winding with a high density of turns, with a precise arrangement which varies little over time, while making it possible to have a winding design with any desired geometry, the manufacturing method comprises laser engraving of the support arm (4), for engraving an initiator track forming the turns of the winding (2) and where the organometallic additive is locally activated. The method then comprises metallizing the initiator track with a conducting metal so to form the conductor track (10) according to the turns formed by the initiator track.

A method for manufacturing an electrical component, comprising: an armature (1) formed by a polymeric plastic material and an organometallic additive and comprising a support arm (4), with a winding (2) formed directly on the surface of the support arm (4) by a conductor track (10) forming turns. According to the invention, in order to obtain a winding with a high density of turns, with a precise arrangement which varies little over time, while making it possible to have a winding design with any desired geometry, the manufacturing method comprises laser engraving of the support arm (4), for engraving an initiator track forming the turns of the winding (2) and where the organometallic additive is locally activated. The method then comprises metallizing the initiator track with a conducting metal so to form the conductor track (10) according to the turns formed by the initiator track.