A prober head to interface an E-testing apparatus to a device under test, which may be an unpackaged die, for example. In some embodiments, the prober head includes an array of conductive pins, each of the pins extending outwardly from a first pin end anchored to a substrate. At least a partial length of each of the pins is coated with a hydrophobic monolayer. The conductive pins may be composite metal wires including a core metal encased by one or more peripheral metal. At a tip of the pins, opposite the first pin end anchored to the substrate, the peripheral metals are recessed from the core metal. In further embodiments, the hydrophobic monolayer is disposed on an outer surface of the peripheral metals, but is substantially absent from a surface of the core metal exposed at the tip.

A prober head to interface an E-testing apparatus to a device under test, which may be an unpackaged die, for example. In some embodiments, the prober head includes an array of conductive pins, each of the pins extending outwardly from a first pin end anchored to a substrate. At least a partial length of each of the pins is coated with a hydrophobic monolayer. The conductive pins may be composite metal wires including a core metal encased by one or more peripheral metal. At a tip of the pins, opposite the first pin end anchored to the substrate, the peripheral metals are recessed from the core metal. In further embodiments, the hydrophobic monolayer is disposed on an outer surface of the peripheral metals, but is substantially absent from a surface of the core metal exposed at the tip.

Interconnection meter socket adapters are provided. An interconnection meter socket adapter comprises a housing enclosing a set of electrical connections. The interconnection meter socket adapter may be configured to be coupled to a standard distribution panel and a standard electric meter, thereby establishing connections between a distribution panel and a user such that electrical power may be delivered to the user while an electrical meter measures the power consumption of the user. An interconnection meter socket adapter may be configured to be coupled to a DC-AC inverter, which may be coupled to various energy sources. As such, the energy sources are coupled to an electrical power system. In addition, a connector such as a flexible cable or flexible conduit containing insulated wires can be provided for connecting various energy sources and/or sinks.

Interconnection meter socket adapters are provided. An interconnection meter socket adapter comprises a housing enclosing a set of electrical connections. The interconnection meter socket adapter may be configured to be coupled to a standard distribution panel and a standard electric meter, thereby establishing connections between a distribution panel and a user such that electrical power may be delivered to the user while an electrical meter measures the power consumption of the user. An interconnection meter socket adapter may be configured to be coupled to a DC-AC inverter, which may be coupled to various energy sources. As such, the energy sources are coupled to an electrical power system. In addition, a connector such as a flexible cable or flexible conduit containing insulated wires can be provided for connecting various energy sources and/or sinks.

A probe unit includes a probe pin and a support unit supporting the probe pin. The support unit includes first and second arms disposed at a distance along a direction in which the probe pin probes a probed object; a holding unit holding base ends of the arms; and a linking unit attached to the probe pin and linking front ends of the arms. The support unit constructs a four-bar linkage that permits linear or approximately linear movement of the probe pin in an opposite direction to the probing direction. The first and second arms have through-holes at positions slightly closer to the front ends than the base ends and positions slightly closer to the base ends than the front ends, center parts between the through-holes function as bars in the four-bar linkage, and formation positions of the through-holes function as joints in the four-bar linkage.

A probe unit includes a probe pin and a support unit supporting the probe pin. The support unit includes first and second arms disposed at a distance along a direction in which the probe pin probes a probed object; a holding unit holding base ends of the arms; and a linking unit attached to the probe pin and linking front ends of the arms. The support unit constructs a four-bar linkage that permits linear or approximately linear movement of the probe pin in an opposite direction to the probing direction. The first and second arms have through-holes at positions slightly closer to the front ends than the base ends and positions slightly closer to the base ends than the front ends, center parts between the through-holes function as bars in the four-bar linkage, and formation positions of the through-holes function as joints in the four-bar linkage.

A testing device for wafer level testing of IC circuits is disclosed. An upper and lower pin (22, 62) are configured to slide relatively to each other and are held in electrically biased contact by an elastomer (80). The elastomer is precompressed from its natural rest state between a top (22) plate and a bottom (70). Pre compression improves the resilient response of the pins. The pin crowns (40) are maintained relatively coplanar by the engagement of at least one flange (44a-b) against an up-stop surface 90 of plate 20, thereby insuring coplanarity of the crowns. The pin guide (12) is maintained in alignment with the retainer 14 by establishing a registration corner (506) and driving the guide into the corner by elastomers in at least one diagonally opposite corner.

A testing device for wafer level testing of IC circuits is disclosed. An upper and lower pin (22, 62) are configured to slide relatively to each other and are held in electrically biased contact by an elastomer (80). The elastomer is precompressed from its natural rest state between a top (22) plate and a bottom (70). Pre compression improves the resilient response of the pins. The pin crowns (40) are maintained relatively coplanar by the engagement of at least one flange (44a-b) against an up-stop surface 90 of plate 20, thereby insuring coplanarity of the crowns. The pin guide (12) is maintained in alignment with the retainer 14 by establishing a registration corner (506) and driving the guide into the corner by elastomers in at least one diagonally opposite corner.

The present disclosure relates to a method for manufacturing a sensor for a thermal, flow measuring device. The method includes, in such case, manufacturing a metal jacketing for a sensor core, introducing the sensor core into the metal jacketing and sintering the metal jacketing with introduced sensor core.

The present disclosure relates to a method for manufacturing a sensor for a thermal, flow measuring device. The method includes, in such case, manufacturing a metal jacketing for a sensor core, introducing the sensor core into the metal jacketing and sintering the metal jacketing with introduced sensor core.