A method for assembling an ultrahigh-frequency spring probe test assembly includes: drilling signal cavities, power supply cavities, and grounding cavities, assembling an upper mold core and a lower mold core and performing curing, mounting an upper shaft sleeve and a lower shaft sleeve, inserting a signal probe, a power supply probe and a grounding probe, and mounting an upper base to complete assembling the probe test assembly. The signal probe becomes coaxial with the signal cavity by mounting the insulating ring, achieving small signal loss; the insulating mold core is inserted into the power supply cavity after drilling and is bonded to the power supply cavity via adhesive to form a dual-layer insulating structure between the power supply probe and the base, having high insulation performance and low power loss; the grounding probe is in direct contact with the metal base, achieving high conductivity.

A method for assembling an ultrahigh-frequency spring probe test assembly includes: drilling signal cavities, power supply cavities, and grounding cavities, assembling an upper mold core and a lower mold core and performing curing, mounting an upper shaft sleeve and a lower shaft sleeve, inserting a signal probe, a power supply probe and a grounding probe, and mounting an upper base to complete assembling the probe test assembly. The signal probe becomes coaxial with the signal cavity by mounting the insulating ring, achieving small signal loss; the insulating mold core is inserted into the power supply cavity after drilling and is bonded to the power supply cavity via adhesive to form a dual-layer insulating structure between the power supply probe and the base, having high insulation performance and low power loss; the grounding probe is in direct contact with the metal base, achieving high conductivity.

There is provided a maintenance apparatus including: an acquisition unit configured to acquire a plurality of test results, for each of a plurality of jigs, in a case where a plurality of devices under measurement, which are different from each other, are sequentially tested via the plurality of jigs; a calculation unit configured to calculate a variation in test results, for each jig, by using the plurality of test results; and a determination unit configured to determine maintenance timing of the jig based on the variation in the test results.

An embodiment of the present invention provides a method and system of manufacturing a redistribution platform comprising: providing a substrate; patterning a first layer of a routing trace over the base substrate; testing the first layer of the routing traces; repair of any defect traces; re-patterning of defect traces; testing the first layer of routing traces for validation of the 1.sup.st layer routing traces; repeating the 2.sup.nd layer to each consequent buildup layers as the 1.sup.st layer patterning of a routing traces, testing of a routing traces, re-patterning of defect traces and testing of layer routing traces for validation.

An embodiment of the present invention provides a method and system of manufacturing a redistribution platform comprising: providing a substrate; patterning a first layer of a routing trace over the base substrate; testing the first layer of the routing traces; repair of any defect traces; re-patterning of defect traces; testing the first layer of routing traces for validation of the 1.sup.st layer routing traces; repeating the 2.sup.nd layer to each consequent buildup layers as the 1.sup.st layer patterning of a routing traces, testing of a routing traces, re-patterning of defect traces and testing of layer routing traces for validation.

An embodiment of the present invention provides a method and system of manufacturing a redistribution platform comprising and providing a base substrate; buildup layer level thereof vertical and/or horizontal electrical shield on Inner layer connecting conductor vias and traces in any positions in the buildup redistribution system.

An embodiment of the present invention provides a method and system of manufacturing a redistribution platform comprising and providing a base substrate; buildup layer level thereof vertical and/or horizontal electrical shield on Inner layer connecting conductor vias and traces in any positions in the buildup redistribution system.

A probe device includes a substrate, a holder, a plurality of test probes and a plurality of insulative skin layers. The substrate is provided with a conductive trace and the holder is disposed on the substrate. The test probes are oriented at an angle relative to the substrate, penetrating through the holder and electrically connected to the conductive trace. The insulative skin layer radially surrounds the test probe and contacts the test probe.

A probe card and a manufacturing method of a probe card are provided. The probe card includes a probe head, first and second substrates, a first elastic component, and a first adhesive member. The second substrate is disposed between the probe head and the first substrate, and is disposed on the first substrate. The second substrate faces the first substrate and includes second contacts. The second contacts are electrically connected to first contacts of the first substrate. The first elastic component is disposed between the first substrate and the second substrate, and disposed at an outer side of the second contacts. The first adhesive member is disposed on the first substrate, annularly arranged on the side surface of the second substrate, and disposed at an outer side of the first elastic component.

A probe card and a manufacturing method of a probe card are provided. The probe card includes a probe head, first and second substrates, a first elastic component, and a first adhesive member. The second substrate is disposed between the probe head and the first substrate, and is disposed on the first substrate. The second substrate faces the first substrate and includes second contacts. The second contacts are electrically connected to first contacts of the first substrate. The first elastic component is disposed between the first substrate and the second substrate, and disposed at an outer side of the second contacts. The first adhesive member is disposed on the first substrate, annularly arranged on the side surface of the second substrate, and disposed at an outer side of the first elastic component.