The disclosure provides a probe card comprising a circuit substrate, a space transformer, and a first coaxial cable. The circuit substrate has a first surface and a second surface, wherein a through hole penetrates the circuit substrate from the first surface to the second surface. The space transformer is arranged on the second surface corresponding to the through hole and has a probe setting surface opposite to the second surface. The first coaxial cable has a first conducting part and a first insulating part, wherein the first coaxial cable is inserted into the through hole, and a first end surface of the first conducting part is flush with the probe setting surface.

A contactor block of a self-aligning vertical probe card according to the present invention comprises: at least one vertical contactor array in which a plurality of vertical contactors manufactured by a MEMS process and extending in the longitudinal direction are arranged side by side in the horizontal direction; and a molding layer that exposes the upper and lower ends of the plurality of vertical contactors constituting the vertical contactor array and surrounds and supports the plurality of vertical contactors.

A contactor block of a self-aligning vertical probe card according to the present invention comprises: at least one vertical contactor array in which a plurality of vertical contactors manufactured by a MEMS process and extending in the longitudinal direction are arranged side by side in the horizontal direction; and a molding layer that exposes the upper and lower ends of the plurality of vertical contactors constituting the vertical contactor array and surrounds and supports the plurality of vertical contactors.

An oxygen sensor for a gas, coal, oil or wood fired kiln that is orders of magnitude cheaper than the current state of the art oxygen sensors. It uses a TiO.sub.2 tip sintered between and bridging a 1 mm spacing between a pair of 22 gauge Nichrome® series 90 round annealed resistance wires (0.64 mm diameter and having 0.648 Ohms/ft resistance). The Nichrome® 90 wires do not contact each other. One of the wires is a signal wire that resides down the center of an insulating sheath and the other wire is a ground wire that is wound around the outside of a high temperature ceramic insulating sleeve. The sensor needs no temperature compensation and exhibits an approximate 50,000 ohms of resistance change from a neutral (ambient) atmosphere and a fully reduced atmosphere.

An oxygen sensor for a gas, coal, oil or wood fired kiln that is orders of magnitude cheaper than the current state of the art oxygen sensors. It uses a TiO.sub.2 tip sintered between and bridging a 1 mm spacing between a pair of 22 gauge Nichrome® series 90 round annealed resistance wires (0.64 mm diameter and having 0.648 Ohms/ft resistance). The Nichrome® 90 wires do not contact each other. One of the wires is a signal wire that resides down the center of an insulating sheath and the other wire is a ground wire that is wound around the outside of a high temperature ceramic insulating sleeve. The sensor needs no temperature compensation and exhibits an approximate 50,000 ohms of resistance change from a neutral (ambient) atmosphere and a fully reduced atmosphere.

The present invention relates to the inspection process which includes providing access to the microdevice contacts, measuring the microdevice and analyzing the data to identify defects or performance of the micro device. The invention also relates to the forming of test electrodes on microdevices. The test electrodes may be connected to hidden contacts. The type of microdevices may be vertical, lateral or a flip chip.

When a probe is made thin so as to correspond to the electrode pitch of a semiconductor device, the mechanical strength becomes insufficient. Efforts are required to devise a thin metal plate with sufficient mechanical strength. On the surface of a probe of probe card use, there are provided with a plurality of deformation regions of hollow shape or protrusion shape and a framework region provided on the boundary between adjacent deformation regions. The stress at the deformation regions is made to be distributed.

When a probe is made thin so as to correspond to the electrode pitch of a semiconductor device, the mechanical strength becomes insufficient. Efforts are required to devise a thin metal plate with sufficient mechanical strength. On the surface of a probe of probe card use, there are provided with a plurality of deformation regions of hollow shape or protrusion shape and a framework region provided on the boundary between adjacent deformation regions. The stress at the deformation regions is made to be distributed.

A spring probe assembly for a Kelvin testing system for testing integrated circuit devices is disclosed. The assembly includes a force spring probe and a sense spring probe. Each of the force spring probe and the sense spring probe includes a head; a body containing at least one resilient element; and a bottom. The body has a cylindrical shape, and the head and the body have a same diameter in an end view. The head includes a base and a top integrated with the base. The base has a cylindrical shape. The head includes a shoulder between the base and the top. The top includes an apex. The force spring probe and the sense spring probe are disposed so that the apexes of the force spring probe and the sense spring probe are adjacent to each other.

Disclosed is a probe device of a floating structure including a probe unit having a groove formed at one end thereof into which a needle for transmitting an electrical signal is inserted, and a guide portion formed at the other end thereof and a plate unit having an inner space which is inserted with the guide portion and formed to support a part of the guide portion, wherein the guide portion is spaced apart from the inner space at a predetermined interval by an external force applied to the needle.