An embodiment of the present invention provides a method and system of manufacturing a redistribution platform comprising and providing a base substrate; buildup layer level thereof vertical electrical shield and insulation on the top layer test pad to provide EMI protection from probe contact pins and another adjacent conductor.

A power calculation apparatus includes a microprocessor and a memory. The microprocessor is configured to perform: acquiring a power amount information regarding amounts of power input to and output from a plurality of vehicles, the amounts of power being detected by a plurality of measuring instruments provided in the plurality of vehicles or interposed between a power grid and the plurality of vehicles; classifying the plurality of measuring instruments based on errors possessed by the plurality of measuring instruments to set a plurality of groups; and calculating a total power input and output in each of the groups, based on the power amount information. The setting the plurality of groups includes setting the plurality of groups such that a mean value of errors of amounts of power in the groups is a predetermined value or less.

Cantilever probes are produced for use in a test apparatus of integrated electronic circuits. The probes are configured to contact corresponding terminals of the electronic circuits to be tested during a test operation. The probe bodies are formed of electrically conductive materials. On a lower portion of each probe body that, in use, is directed to the respective terminal to be contacted, an electrically conductive contact region is formed having a first hardness value equal to or greater than 300 HV; each contact region and the respective probe body form the corresponding probe.

Cantilever probes are produced for use in a test apparatus of integrated electronic circuits. The probes are configured to contact corresponding terminals of the electronic circuits to be tested during a test operation. The probe bodies are formed of electrically conductive materials. On a lower portion of each probe body that, in use, is directed to the respective terminal to be contacted, an electrically conductive contact region is formed having a first hardness value equal to or greater than 300 HV; each contact region and the respective probe body form the corresponding probe.

An electronic device includes a substrate, an electronic element, a transistor, a redistribution layer and a plurality of first bonding pads. The electronic element is disposed on the substrate. The transistor is electrically connected with the electronic element. The plurality of first bonding pads are disposed on the redistribution layer.

A probe pin material including a Ag—Pd—Cu-based alloy essentially including Ag, Pd and Cu, B as a first additive element, and at least any element of Zn, Bi and Sn, as a second additive element. A concentration of the first additive element is 0.1 mass % or more and 1.5 mass % or less, and a concentration of the second additive element is 0.1 mass % or more and 1.0 mass % or less. A Ag concentration, a Pd concentration and a Cu concentration in the Ag—Pd—Cu-based alloy are required as follows: a Ag concentration (S.sub.Ag), a Pd concentration (S.sub.Pd) and a Cu concentration (S.sub.Cu) converted as given that a Ag—Pd—Cu ternary alloy is formed from only such three elements all fall within a predetermined range in a Ag—Pd—Cu ternary system phase diagram. The probe pin material is excellent in resistance value and hardness/wear resistance, and also is enhanced in bending resistance.

A contact, an inspection jig using the contact, an inspection device, and a method of manufacturing the contact are provided. A contact includes a coil spring including a slit formed in a cylindrical body and first and second conductors. A bottom wall portion, a first side wall portion, a second side wall portion, and a top wall portion are configured so a cross-sectional shape of the cylindrical body as viewed in the axial direction is rectangular, the slit includes a first slit, a second slit, a third slit, and a fourth slit, the third slit is continuous with the first slit and the second slit, the fourth slit is continuous with the second slit, the first slit and the second slit are rectangular in a side view of the cylindrical body, the first and second conductors respectively connected to first and second end portions of the cylindrical body.

A contact, an inspection jig using the contact, an inspection device, and a method of manufacturing the contact are provided. A contact includes a coil spring including a slit formed in a cylindrical body and first and second conductors. A bottom wall portion, a first side wall portion, a second side wall portion, and a top wall portion are configured so a cross-sectional shape of the cylindrical body as viewed in the axial direction is rectangular, the slit includes a first slit, a second slit, a third slit, and a fourth slit, the third slit is continuous with the first slit and the second slit, the fourth slit is continuous with the second slit, the first slit and the second slit are rectangular in a side view of the cylindrical body, the first and second conductors respectively connected to first and second end portions of the cylindrical body.

A method for producing a device for measuring current intensities, including: providing a resistor arrangement having connection elements and a resistor element arranged therebetween in a current flow direction. The resistor element and the connection elements consist of different electrically conductive materials; forming a contact pin from the material of at least one connection element; positioning a printed circuit board with a conductor track and a passage bore on the resistor arrangement such that the contact pin projects through the passage bore and has on the side of the printed circuit board facing away from the resistor arrangement a protrusion; laterally widening the contact pin in the region of the protrusion by deforming the material such that the printed circuit board is mechanically fixed to the resistor arrangement; and producing an electrically conductive connection between the contact pin and the conductor track of the printed circuit board.

A method for producing a device for measuring current intensities, including: providing a resistor arrangement having connection elements and a resistor element arranged therebetween in a current flow direction. The resistor element and the connection elements consist of different electrically conductive materials; forming a contact pin from the material of at least one connection element; positioning a printed circuit board with a conductor track and a passage bore on the resistor arrangement such that the contact pin projects through the passage bore and has on the side of the printed circuit board facing away from the resistor arrangement a protrusion; laterally widening the contact pin in the region of the protrusion by deforming the material such that the printed circuit board is mechanically fixed to the resistor arrangement; and producing an electrically conductive connection between the contact pin and the conductor track of the printed circuit board.