G01R3/00

Vertical probe arrays and improved methods for making using temporary or permanent alignment structures for setting or maintaining probe-to-probe relationships

Probe arrays include spacers attached to the probes that were formed along with the probes. Methods of making probe arrays by (1) forming probes on their sides and possibly as linear arrays or combination subarrays (e.g. as a number of side-to-side joined linear arrays) having probes fixed in array positions by a sacrificial material that is temporarily retained after formation of the probes; (2) assembling the probe units into full array configurations using the spacers attached to the probes or using alternative alignment structures to set the spacing and/or alignment of the probe(s) of one unit with another unit; and (3) fixing the probes in their configurations (e.g. bonding to a substrate and/or engaging the probes with one or more guide plates) wherein the spacers are retained or are removed, in whole or in part, prior to putting the array to use.

Vertical probe arrays and improved methods for making using temporary or permanent alignment structures for setting or maintaining probe-to-probe relationships

Probe arrays include spacers attached to the probes that were formed along with the probes. Methods of making probe arrays by (1) forming probes on their sides and possibly as linear arrays or combination subarrays (e.g. as a number of side-to-side joined linear arrays) having probes fixed in array positions by a sacrificial material that is temporarily retained after formation of the probes; (2) assembling the probe units into full array configurations using the spacers attached to the probes or using alternative alignment structures to set the spacing and/or alignment of the probe(s) of one unit with another unit; and (3) fixing the probes in their configurations (e.g. bonding to a substrate and/or engaging the probes with one or more guide plates) wherein the spacers are retained or are removed, in whole or in part, prior to putting the array to use.

CONDUCTIVE PROBE, METHOD OF MANUFACTURING THE SAME, AND PROBE CARD DEVICE HAVING THE SAME
20230333141 · 2023-10-19 ·

A conductive probe includes a columnar body. The columnar body is defined with a longitudinal direction. The columnar body is provided with a first contacting surface and a second contacting surface in the longitudinal direction. The first contacting surface is opposite to the second contacting surface, and the first contacting surface is cross shaped or X-shaped for contacting to a conductive pillar of a device under test (DUT).

CONDUCTIVE PROBE, METHOD OF MANUFACTURING THE SAME, AND PROBE CARD DEVICE HAVING THE SAME
20230333141 · 2023-10-19 ·

A conductive probe includes a columnar body. The columnar body is defined with a longitudinal direction. The columnar body is provided with a first contacting surface and a second contacting surface in the longitudinal direction. The first contacting surface is opposite to the second contacting surface, and the first contacting surface is cross shaped or X-shaped for contacting to a conductive pillar of a device under test (DUT).

Cantilever-type probe with multiple metallic coatings
11543431 · 2023-01-03 · ·

A cantilever-type probe with multiple metallic coatings is disclosed. The cantilever-type probe includes at least one probe pin. A first metallic coating is disposed upon a tip of the probe pin, and a second metallic coating is disposed upon a root of the probe pin. The second metallic coating is in contact with the first metallic coating and comprises a softer (more flexible) metal than the first metallic coating.

Probe card device and disposable adjustment film thereof

A probe card device and a disposable adjustment film thereof are provided. The disposable adjustment film is integrally formed as a single one-piece structure, and includes a probe hole and a plurality of first slots that are parallel to each other. The disposable adjustment film defines two predetermined lines respectively extending from two opposite lateral edges thereof to the probe hole. The two predetermined lines respectively extend across the first slots. In a plane that the disposable adjustment film is located thereon, when the disposable adjustment film is applied with forces that act in opposite directions and that are parallel to any one of the first slots, the disposable adjustment film is broken into two abandoned films along the two predetermined lines.

Contact probe and relative probe head of an apparatus for testing electronic devices
11442080 · 2022-09-13 · ·

A contact probe comprises a probe body being extended in a longitudinal direction between respective end portions adapted to realize a contact with respective contact pads, at least one end portion having transverse dimensions greater than the probe body. Suitably, the end portion comprises at least one indentation adapted to house a material scrap being on the contact probe after a separation from a substrate wherein the contact probe has been realized.

Contact probe and relative probe head of an apparatus for testing electronic devices
11442080 · 2022-09-13 · ·

A contact probe comprises a probe body being extended in a longitudinal direction between respective end portions adapted to realize a contact with respective contact pads, at least one end portion having transverse dimensions greater than the probe body. Suitably, the end portion comprises at least one indentation adapted to house a material scrap being on the contact probe after a separation from a substrate wherein the contact probe has been realized.

Direct metalized guide plate

Improved electrically conductive guide plates for vertical probe arrays are provided by patterning a thin metal layer disposed on an insulating substrate. Holes passing through the guide plate for guiding probes can be electrically connected or isolated from each other in any pattern according to the deposition of the metal. Such structures can include several distinct ground and/or voltage planes. Furthermore, passive electrical components can be included in the guide plate, by patterning of the deposited metal and/or by integration of passive electrical components with the deposited metal traces.

Direct metalized guide plate

Improved electrically conductive guide plates for vertical probe arrays are provided by patterning a thin metal layer disposed on an insulating substrate. Holes passing through the guide plate for guiding probes can be electrically connected or isolated from each other in any pattern according to the deposition of the metal. Such structures can include several distinct ground and/or voltage planes. Furthermore, passive electrical components can be included in the guide plate, by patterning of the deposited metal and/or by integration of passive electrical components with the deposited metal traces.