In a method of manufacturing an integrated circuit involving performing an electrostatic discharge (ESD) test, a weak frequency band is detected by sequentially radiating a plurality of first electromagnetic waves on a first test board including the integrated circuit. First peak-to-peak voltage signals are detected by sequentially radiating the plurality of first electromagnetic waves on a second test board including an electromagnetic wave receiving module. A frequency spectrum is detected by radiating a second electromagnetic wave on a housing including a third test board including the electromagnetic wave receiving module. A second peak-to-peak voltage signal is generated based on the weak frequency band, the first peak-to-peak voltage signals and the frequency spectrum. An ESD characteristic associated with an electronic system including the integrated circuit is predicted based on the second peak-to-peak voltage signal.

A method may include pressing a sensor module onto a control board such that the sensor module is at an initial position where an air gap is present between a module body of the sensor module and the control board such that compliant pins of the sensor module are partially inserted into the control board. The method may include mounting the control board on a power module to cause pins of the power module to be at least partially inserted into the control board and the sensor module to be at least partially inserted in the power module such that a protrusion is through an opening in a busbar. The method may include pressing the control board onto the power module to cause the pins of the power module to be further inserted into the control board, the sensor module to be further inserted in the power module, and the sensor module to be at a final position.

A method for assembling an ultrahigh-frequency spring probe test assembly includes: drilling signal cavities, power supply cavities, and grounding cavities, assembling an upper mold core and a lower mold core and performing curing, mounting an upper shaft sleeve and a lower shaft sleeve, inserting a signal probe, a power supply probe and a grounding probe, and mounting an upper base to complete assembling the probe test assembly. The signal probe becomes coaxial with the signal cavity by mounting the insulating ring, achieving small signal loss; the insulating mold core is inserted into the power supply cavity after drilling and is bonded to the power supply cavity via adhesive to form a dual-layer insulating structure between the power supply probe and the base, having high insulation performance and low power loss; the grounding probe is in direct contact with the metal base, achieving high conductivity.

A method for assembling an ultrahigh-frequency spring probe test assembly includes: drilling signal cavities, power supply cavities, and grounding cavities, assembling an upper mold core and a lower mold core and performing curing, mounting an upper shaft sleeve and a lower shaft sleeve, inserting a signal probe, a power supply probe and a grounding probe, and mounting an upper base to complete assembling the probe test assembly. The signal probe becomes coaxial with the signal cavity by mounting the insulating ring, achieving small signal loss; the insulating mold core is inserted into the power supply cavity after drilling and is bonded to the power supply cavity via adhesive to form a dual-layer insulating structure between the power supply probe and the base, having high insulation performance and low power loss; the grounding probe is in direct contact with the metal base, achieving high conductivity.

The invention is a contacting device suitable for measurements and/or other contact tests, the device comprising a head unit comprising a plunger (14) having a broadened portion (28) at its first end, and a head element (16) being on a second end of the plunger (14); a tube element (10) having a third end and a fourth end opposite the third end, receiving the broadened portion (28) of the plunger (14) at the third end, and keeping the broadened portion (28) in its inner space by means of an inward-projecting flange portion (18) arranged at the third end; and a resilient element (20) being arranged in the inner space of the tube element (10) being supported against the end portion of the broadened portion (28) and against the closed fourth end of the tube element (10). The second end of the plunger (14) projects out from the tube element (10) in case the broadened portion (28) is abutted against the flange portion (18). In the contacting device according to the invention the head element (16) and the second end of the plunger (14) are connected to each other by shrink fitting or by press fitting. The invention is, furthermore, a head unit for a contacting device, and methods for manufacturing a contacting device and a head unit.

The invention is a contacting device suitable for measurements and/or other contact tests, the device comprising a head unit comprising a plunger (14) having a broadened portion (28) at its first end, and a head element (16) being on a second end of the plunger (14); a tube element (10) having a third end and a fourth end opposite the third end, receiving the broadened portion (28) of the plunger (14) at the third end, and keeping the broadened portion (28) in its inner space by means of an inward-projecting flange portion (18) arranged at the third end; and a resilient element (20) being arranged in the inner space of the tube element (10) being supported against the end portion of the broadened portion (28) and against the closed fourth end of the tube element (10). The second end of the plunger (14) projects out from the tube element (10) in case the broadened portion (28) is abutted against the flange portion (18). In the contacting device according to the invention the head element (16) and the second end of the plunger (14) are connected to each other by shrink fitting or by press fitting. The invention is, furthermore, a head unit for a contacting device, and methods for manufacturing a contacting device and a head unit.

A detection substrate 150 has a body film 1a having a through hole 91; a winding wire part 10 provided on a surface of one side of the body film 1a, on a surface of another side of the body film 1a and in the through hole 91, and disposed so as to surround a current to be detected; and a winding return wire part 50, provided on the body film 1a, connected at a terminal end part of the winding wire part 10 and returning from the terminal end part toward a starting end part side.

An oxygen sensor for a gas, coal, oil or wood fired kiln that is orders of magnitude cheaper than the current state of the art oxygen sensors. It uses a TiO.sub.2 tip sintered between and bridging a 1 mm spacing between a pair of 22 gauge Nichrome® series 90 round annealed resistance wires (0.64 mm diameter and having 0.648 Ohms/ft resistance). The Nichrome® 90 wires do not contact each other. One of the wires is a signal wire that resides down the center of an insulating sheath and the other wire is a ground wire that is wound around the outside of a high temperature ceramic insulating sleeve. The sensor needs no temperature compensation and exhibits an approximate 50,000 ohms of resistance change from a neutral (ambient) atmosphere and a fully reduced atmosphere.

An oxygen sensor for a gas, coal, oil or wood fired kiln that is orders of magnitude cheaper than the current state of the art oxygen sensors. It uses a TiO.sub.2 tip sintered between and bridging a 1 mm spacing between a pair of 22 gauge Nichrome® series 90 round annealed resistance wires (0.64 mm diameter and having 0.648 Ohms/ft resistance). The Nichrome® 90 wires do not contact each other. One of the wires is a signal wire that resides down the center of an insulating sheath and the other wire is a ground wire that is wound around the outside of a high temperature ceramic insulating sleeve. The sensor needs no temperature compensation and exhibits an approximate 50,000 ohms of resistance change from a neutral (ambient) atmosphere and a fully reduced atmosphere.

An atomic vapor cell for performing RF measurements includes: a first optical window of transparent nonconducting material free of electrically conductive materials; an intermediate frame of transparent nonconducting material free of electrically conductive materials; a second optical window disposed on the intermediate frame and including transparent nonconducting material free of electrically conductive materials to minimize distortion of radiofrequency fields by the windows and frame; and a cell aperture, wherein the atomic vapor cell is hermetically sealed by bonding between the first optical window and the second optical window to the intermediate frame.