Proposed are an anodic aluminum oxide structure made of anodic aluminum oxide, a probe head having the same, and a probe card having the same. More particularly, proposed are an anodic aluminum oxide structure that has a fine size and pitch guide hole and facilitates insertion of a probe, a probe head having the same, and a probe card having the same.

A current sensor includes a magnetic detection unit capable of detecting the magnetism, a first magnetic shield and a second magnetic shield. The first magnetic shield includes a first shield section and two second shield sections respectively connected in the vicinity of the two ends thereof. The second magnetic shield includes a third shield section and two fourth shield sections respectively connected in the vicinity of the two ends thereof. Between the first shield section and the third shield section is a conductor placement region, and the magnetic detection unit is positioned between the first shield section and the conductor placement region and is provided at a magnetic field canceling position where the magnetic field in the second direction is substantially zero at non-energized times after a prescribed current has flowed in the conductor, in relationship to the length of the two fourth shield sections along the third direction.

A current sensor includes a magnetic detection unit capable of detecting the magnetism, a first magnetic shield and a second magnetic shield. The first magnetic shield includes a first shield section and two second shield sections respectively connected in the vicinity of the two ends thereof. The second magnetic shield includes a third shield section and two fourth shield sections respectively connected in the vicinity of the two ends thereof. Between the first shield section and the third shield section is a conductor placement region, and the magnetic detection unit is positioned between the first shield section and the conductor placement region and is provided at a magnetic field canceling position where the magnetic field in the second direction is substantially zero at non-energized times after a prescribed current has flowed in the conductor, in relationship to the length of the two fourth shield sections along the third direction.

A probe head may be utilized to test an electronic device. The probe head may include a probe axis extending along a length of the probe head. The probe head may include a probe core including a first metal. The probe core may include a core surface having a first dimension. The first dimension may be perpendicular to the probe axis. The probe core may include a probe tip, for instance extending from the core surface along the probe axis. The probe tip has a second dimension that may be perpendicular to the probe axis. The second dimension may be less than the first dimension of the core surface. The probe head may include a cladding layer that includes a second metal. The cladding layer may be coupled around a perimeter of the probe core. The probe tip may extend beyond the cladding layer.

A three-layer micro electro mechanical system (MEMS) spring pin includes a lower-layer spring pin in which a lower-layer wave is disposed between and connected to a lower-layer top plunger and a lower-layer bottom plunger, an upper-layer spring pin in which an upper-layer wave is disposed between and connected to an upper-layer top plunger and an upper-layer bottom plunger, a middle-layer top tip interposed between the upper-layer top plunger and the lower-layer top plunger, and a middle-layer bottom tip interposed between the upper-layer bottom plunger and the lower-layer bottom plunger. According to the above-described structure, effects are expected in which bending is prevented, a stroke is stabilized due to the multi-layer spring, and contact characteristics are enhanced due to the multi-layer plunger.

A method of manufacturing a probe card and a probe card manufactured using the same are disclosed. The method is configured to be capable of collectively attaching probes to a wiring board provided with a connection pad to which the probes are attached.

A method of manufacturing a probe card and a probe card manufactured using the same are disclosed. The method is configured to be capable of collectively attaching probes to a wiring board provided with a connection pad to which the probes are attached.

An integrated substrate for testing a semiconductor wafer and a method are provided. The integrated substrate includes a first redistribution structure including a fine redistribution circuitry, a plurality of testing tips disposed on a first surface of the first redistribution structure and electrically connected to the fine redistribution circuitry to probe the semiconductor wafer, a second redistribution structure including a coarse redistribution circuitry and disposed over a second surface of the first redistribution structure opposite to the first surface, and a plurality of conductive joints interposed between the coarse redistribution circuitry and the fine redistribution circuitry to provide electrical connections therebetween. A layout density of the fine redistribution circuitry is denser than that of the coarse redistribution circuitry.

An integrated substrate for testing a semiconductor wafer and a method are provided. The integrated substrate includes a first redistribution structure including a fine redistribution circuitry, a plurality of testing tips disposed on a first surface of the first redistribution structure and electrically connected to the fine redistribution circuitry to probe the semiconductor wafer, a second redistribution structure including a coarse redistribution circuitry and disposed over a second surface of the first redistribution structure opposite to the first surface, and a plurality of conductive joints interposed between the coarse redistribution circuitry and the fine redistribution circuitry to provide electrical connections therebetween. A layout density of the fine redistribution circuitry is denser than that of the coarse redistribution circuitry.

The disclosure includes a contact device for electrical test, the contact device for electrical test including a second body portion, a first body portion stacked above the second body portion, a middle portion stacked above the first body portion, and having a first protrusion that is sharp and has a first apex portion, the first protrusion being formed on an upper side of the middle portion, and the first body portion, the middle portion, and the contact portion are sequentially and upwardly stacked, the middle portion and the contact portion include materials different from each other, and a first protrusion is provided inside the second protrusion.