A method for manufacturing a wire harness includes: disposing a trunk harness, a branch harness and control boxes on a workbench and attaching the trunk harness and the branch harness to the control boxes; connecting the control boxes to an external device via the branch harness; and switching operation mode of at least one of the control boxes to an information writing mode for inputting information for operating the electric component to be connected to the branch harness into the at least one of the control boxes and then inputting the information from the external device into the at least one of the control boxes via the branch harness.

A method for manufacturing a wire harness includes: disposing a trunk harness, a branch harness and control boxes on a workbench and attaching the trunk harness and the branch harness to the control boxes; connecting the control boxes to an external device via the branch harness; and switching operation mode of at least one of the control boxes to an information writing mode for inputting information for operating the electric component to be connected to the branch harness into the at least one of the control boxes and then inputting the information from the external device into the at least one of the control boxes via the branch harness.

A space transformer for connecting a signal source and probing a semiconductor wafer and a manufacturing method thereof are provided. The space transformer includes a circuit board, a redistribution structure bonded to the circuit board, and a conductive through via providing a vertical conductive path therebetween. The circuit board includes a wiring structure which includes alternately stacked dielectric layers and patterned wiring layers, and first contact pads of the patterned wiring layers connect the signal source. The redistribution structure is thinner than the circuit board and includes second contact pads for probing the semiconductor wafer. A pitch of adjacent second contact pads is finer than that of adjacent first contact pads. The conductive through via penetrates through the circuit board, and the conductive through via is laterally covered by the dielectric layers and is laterally and physically in contact with the patterned wiring layers.

A cleaning material, device, and method for predictably cleaning the contact elements and support hardware of a tester interface, such as a probe card and a test socket, in which the cleaning pad has a predetermined configuration appropriate for the particular pin contact elements and a substrate having a defined functionalized surface topology and geometry which can be introduced into the testing apparatus during the normal testing operations. The cleaning material has a predetermined topography with a plurality of functional 3-dimensional (3D) microstructures that provide performance characteristics which are not possible with a non-functionalized and flat surface.

The testing apparatus for singulated semiconductor dies comprises a nesting frame and a bottom part, which form a testing device nest adapted to the size of a semiconductor die. A pushing device is provided for an alignment of the semiconductor die in the testing device nest. An engineering plastic layer on the bottom part forms a surface on which the semiconductor die slides during its alignment.

A metal probe structure and a method for fabricating the same are provided. The metal probe structure includes a multi-layer substrate, a first flexible dielectric layer, a second flexible dielectric layer, and a plurality of first metal components. The first flexible dielectric layer is disposed over the multi-layer substrate and has a conductive layer formed thereover. The second flexible dielectric layer is disposed over the first flexible dielectric layer to cover the conductive layer. The plurality of first metal components is disposed over the conductive layer and partially in the second flexible dielectric layer to serve as a metal probe.

A probe card device is provided, including a thin film substrate, a first circuit board, and a plurality of probes. The thin film substrate has opposite first and second surface. The first circuit board is disposed over the second surface of the thin film substrate to electrically connect the thin film substrate. The probes are disposed over the first surface of the thin film substrate and are not deformable.

A probe card device is provided, including a thin film substrate, a first circuit board, and a plurality of probes. The thin film substrate has opposite first and second surface. The first circuit board is disposed over the second surface of the thin film substrate to electrically connect the thin film substrate. The probes are disposed over the first surface of the thin film substrate and are not deformable.

A probe has a substantially bar shape, and includes a tip end, a base end, and a body portion that is located between the tip end and the base end and has a thickness in a thickness direction orthogonal to an axial direction of the substantially bar shape thinner than the tip end. The body portion includes a slope surface that is continuous with the tip end and is inclined with respect to the axial direction in a direction in which the thickness becomes gradually thinner with increasing distance from the tip end. A first region having a surface shape that bulges outward is provided in at least a part of the slope surface.

A method of making an array of vapor cells for an array of magnetometers includes providing a plurality of separate vapor cell elements, each vapor cell element including at least one vapor cell; arranging the vapor cell elements in an alignment jig to produce a selected arrangement of the vapor cells; attaching at least one alignment-maintaining film onto the vapor cell elements in the alignment jig; transferring the vapor cells elements and the at least one alignment-maintaining film from the alignment jig to a mold; injecting a bonding material into the mold and between the vapor cell elements to bond the vapor cell elements in the selected arrangement; removing the at least one alignment maintaining film from the vapor cell elements; and removing the bonded vapor cells elements in the selected arrangement from the mold to provide the array of vapor.