The invention concerns a manufacturing method for an electrical resistor (1), in particular for a low-resistance current measuring resistor, with the following steps (S1-S4): a) providing a plate-shaped base part (9) for the resistor (1), the base part (9) having a certain thickness and corresponding to the thickness a certain value of an electrical component characteristic (R), the thickness-dependent electrical component characteristic (R) preferably being the electrical resistance (1) of the base part (9), the sheet resistance or the transverse resistance, and b) rolling the base part (9) with a certain degree of rolling (AG), the thickness of the base part (9) decreasing in accordance with the degree of rolling (AG) and the value of the component characteristic (R) changing accordingly, c) measuring the thickness-dependent electrical component characteristic (R) on the rolled base part (9), and d) adaptation of the degree of rolling (AG) as a function of the measured electrical component characteristic (R), in particular in the context of a closed-loop control system with the electrical component characteristic (R) as controlled variable and the degree of rolling (AG) as control variable. Furthermore, the invention includes an appropriately manufactured resistor and a corresponding production plant.

The invention concerns a manufacturing method for an electrical resistor (1), in particular for a low-resistance current measuring resistor, with the following steps (S1-S4): a) providing a plate-shaped base part (9) for the resistor (1), the base part (9) having a certain thickness and corresponding to the thickness a certain value of an electrical component characteristic (R), the thickness-dependent electrical component characteristic (R) preferably being the electrical resistance (1) of the base part (9), the sheet resistance or the transverse resistance, and b) rolling the base part (9) with a certain degree of rolling (AG), the thickness of the base part (9) decreasing in accordance with the degree of rolling (AG) and the value of the component characteristic (R) changing accordingly, c) measuring the thickness-dependent electrical component characteristic (R) on the rolled base part (9), and d) adaptation of the degree of rolling (AG) as a function of the measured electrical component characteristic (R), in particular in the context of a closed-loop control system with the electrical component characteristic (R) as controlled variable and the degree of rolling (AG) as control variable. Furthermore, the invention includes an appropriately manufactured resistor and a corresponding production plant.

A handheld differential contact probe includes a housing configured to be held in a hand of a user, a pair of probe arms carried by the housing, and a pair of opposing probe tip assemblies each carried by one of the respective probe arms and each having a probe tip circuit coupled to a probe tip at a distal end thereof. A probe tip span adjustment mechanism is carried by the housing and coupled to the pair of probe arms, and configured to adjust a span between the probe tips. A ground path mechanism is coupled between the probe tip circuits of the respective probe tip assemblies, and includes a pair of curved conductive ribbon springs each coupled at an outer end thereof to a respective probe tip circuit, and each curved conductive ribbon spring slidably engaging each other at a respective inner end thereof.

A handheld differential contact probe includes a housing configured to be held in a hand of a user, a pair of probe arms carried by the housing, and a pair of opposing probe tip assemblies each carried by one of the respective probe arms and each having a probe tip circuit coupled to a probe tip at a distal end thereof. A probe tip span adjustment mechanism is carried by the housing and coupled to the pair of probe arms, and configured to adjust a span between the probe tips. A ground path mechanism is coupled between the probe tip circuits of the respective probe tip assemblies, and includes a pair of curved conductive ribbon springs each coupled at an outer end thereof to a respective probe tip circuit, and each curved conductive ribbon spring slidably engaging each other at a respective inner end thereof.

The test system provides an array of test probes. The probes pass through a first or upper probe guide retainer which has a plurality of slot sized to receive the probes in a way that they cannot rotate. A plurality of flex circuits at the different heights engage bottom probe ends at their respective height levels and flex circuits continue the electrical connection from the probes to a load board. The test probes are bonded to the flex circuits by ring shaped flowable conductive material. The flex circuits are biased against a load board by an elastomeric pad of spaced part conical projections.

The test system provides an array of test probes. The probes pass through a first or upper probe guide retainer which has a plurality of slot sized to receive the probes in a way that they cannot rotate. A plurality of flex circuits at the different heights engage bottom probe ends at their respective height levels and flex circuits continue the electrical connection from the probes to a load board. The test probes are bonded to the flex circuits by ring shaped flowable conductive material. The flex circuits are biased against a load board by an elastomeric pad of spaced part conical projections.

The present invention focuses on a material constituting a contact pin and a processing technique of the material, and is directed to manufacturing a conductive member by using a material and a processing technique which are different from those in the related art.

The conductive member is obtained by applying etching treatment to a copper-silver alloy including copper and silver while using at least copper alloy etching liquid, but silver etching liquid may also be selectively added to the copper alloy etching liquid.

This inspection jig is provided with: an inspection-side support member having a counter plate (51) provided with a facing surface (F) disposed to face the substrate; and an electrode-side support member (6) having supporting plates (61-63) disposed to face an electrode plate (9) located on the side opposite to the facing surface (F) of the counter plate (51) A probe supporting hole (23), into and by which the rear end portion of the probe (Pr) is inserted and supported, is provided in the supporting plates (61-63), and the probe supporting hole (23) is provided with a restricting surface which is formed along a supporting line (V) inclined at a certain angle () with respect to a reference line (Z), and which restricts the rear end portion of the probe (Pr) from moving in the direction perpendicular to the inclined direction of the supporting line (V).

This inspection jig is provided with: an inspection-side support member having a counter plate (51) provided with a facing surface (F) disposed to face the substrate; and an electrode-side support member (6) having supporting plates (61-63) disposed to face an electrode plate (9) located on the side opposite to the facing surface (F) of the counter plate (51) A probe supporting hole (23), into and by which the rear end portion of the probe (Pr) is inserted and supported, is provided in the supporting plates (61-63), and the probe supporting hole (23) is provided with a restricting surface which is formed along a supporting line (V) inclined at a certain angle () with respect to a reference line (Z), and which restricts the rear end portion of the probe (Pr) from moving in the direction perpendicular to the inclined direction of the supporting line (V).

Embodiments of the present disclosure can include a method for frequency trimming a microelectromechanical resonator, the resonator comprising a substrate and a plurality of loading elements layered on a surface of the substrate, the method comprising: selecting a first loading element of the plurality of loading elements, the first loading element being layered on a surface of a region of interest of the substrate; heating the first loading element and substrate within the region of interest to a predetermined temperature using an optical energy source, causing the first loading element to diffuse into the substrate; and cooling the region of interest to form a eutectic composition layer bonding the loading element and the substrate within the region of interest.