An embodiment of a magnetic-field sensor includes a magnetic-field sensor arrangement and a magnetic body which has, for example, a non-convex cross-sectional area with regard to a cross-sectional plane running through the magnetic body, the magnetic body having an inhomogeneous magnetization.

An embodiment of a magnetic-field sensor includes a magnetic-field sensor arrangement and a magnetic body which has, for example, a non-convex cross-sectional area with regard to a cross-sectional plane running through the magnetic body, the magnetic body having an inhomogeneous magnetization.

A semiconductor device 100 has a first electrode 61; a second electrode 62; and a semiconductor layer 1 including a first winding wire part 10 provided so as to surround a current flowing between the first electrode 61 and the second electrode 62, and a second winding wire part 50 connected to a terminal end part of the first winding wire part 10 and returning from the terminal end part toward a starting end part side of the first winding wire part 10.

A detection substrate 150 has a body film 1a having a through hole 91; a winding wire part 10 provided on a surface of one side of the body film 1a, on a surface of another side of the body film 1a and in the through hole 91, and disposed so as to surround a current to be detected; and a winding return wire part 50, provided on the body film 1a, connected at a terminal end part of the winding wire part 10 and returning from the terminal end part toward a starting end part side.

A transmission line arrangement having a first end and a second end, the transmission line arrangement being configured to transmit a signal between the first end and the second end, the transmission line arrangement comprising a signal conductor extending between the first end and the second end of the transmission line arrangement, a first conducting sheet and a second conducting sheet positioned on two opposing sides of the signal conductor, an insulating material separating the first and second conducting sheets from the signal conductor and a plurality of pieces of conducting material extending between the first and second conducting sheets and arranged at different positions between the first and second ends of the transmission line arrangement, wherein the pieces of conducting material and the conducting sheets are arranged to substantially surround the signal conductor for at least part of its length between the first and second ends of the transmission line arrangement.

A transmission line arrangement having a first end and a second end, the transmission line arrangement being configured to transmit a signal between the first end and the second end, the transmission line arrangement comprising a signal conductor extending between the first end and the second end of the transmission line arrangement, a first conducting sheet and a second conducting sheet positioned on two opposing sides of the signal conductor, an insulating material separating the first and second conducting sheets from the signal conductor and a plurality of pieces of conducting material extending between the first and second conducting sheets and arranged at different positions between the first and second ends of the transmission line arrangement, wherein the pieces of conducting material and the conducting sheets are arranged to substantially surround the signal conductor for at least part of its length between the first and second ends of the transmission line arrangement.

A probe card device includes an upper die unit, a lower die unit, a spacer sandwiched between the upper and lower die units, an impedance adjusting member, and conductive probes. The upper die unit includes a first die and a second die spaced apart from the first die. The first die has a penetrating hole, and the second die has a circuit layer. The impedance adjusting member is disposed on the second die and is electrically coupled to the circuit layer. Each of the conductive probes passes through the upper die unit, the spacer, and the lower die unit. At least one of the conductive probes includes an upper contacting segment protruding from the upper die unit and an extending arm connected to the upper contacting segment. The extending arm is abutted against the circuit layer by passing through the penetrating hole.

In one embodiment, a tester calibration device includes a first board to be installed on one of a plurality of sockets of a tester for testing a semiconductor device, when the tester is to be calibrated. The device further includes a plurality of first pins provided on a first face of the first board, and to be made contact with the one socket when the tester is to be calibrated. The device further includes a wiring configured to electrically connect some of the plurality of first pins with each other.

In one embodiment, a tester calibration device includes a first board to be installed on one of a plurality of sockets of a tester for testing a semiconductor device, when the tester is to be calibrated. The device further includes a plurality of first pins provided on a first face of the first board, and to be made contact with the one socket when the tester is to be calibrated. The device further includes a wiring configured to electrically connect some of the plurality of first pins with each other.

A sensor intermediate part is provided with a physical quantity detection element that has a power source terminal, a ground terminal and an output terminal that outputs a desired output signal, where the physical quantity detection element is capable of adjusting properties of the output signal; a high-capacitance capacitor, which has at least a first terminal and a second terminal, and a jumper wire, one end of which is conducted to either the power source terminal or the second terminal and the other end of which is not conducted. The first terminal is conducted to the ground terminal, and the power source terminal and the second terminal are configured to be electrically connectable by the jumper wire.