A method of treating a material on a probe is provided. The method includes the steps of immersing a probe tip into a first fluid, wherein the probe tip includes one or more oxidized metallic fragments on a surface of the probe tip; polarizing the probe tip, through a counter electrode, with a negative current to reduce the one or more oxidized metallic fragments to one or more substantially unoxidized metallic fragments; removing the probe tip from the first fluid; immersing the probe in a second fluid, wherein the second fluid is a complexer for the one or more substantially unoxidized metallic fragments; and polarizing the probe tip with a positive current, through the counter electrode, wherein the positive current oxidizes the one or more substantially unoxidized metallic fragments.

A method for manufacturing probes includes forming a recessed portion on a plate such that the plate has a first subsidiary plate, a second subsidiary plate and a third subsidiary plate mutually connected. The first subsidiary plate has a first thickness. The second subsidiary plate corresponds to the recessed portion and has a second thickness. The first thickness is larger than the second thickness. The second subsidiary plate is located between the first subsidiary plate and the third subsidiary plate. The third subsidiary plate has a third thickness. The third thickness is larger than the second thickness. Subsequently, the plate is held and cut by laser to form a plurality of probes. Each of the probes includes a probe tail formed from the first subsidiary plate, a probe body formed from the second subsidiary plate and a probe tip formed form the third subsidiary plate.

A method of increasing uniformity in light from a light source at a plurality of targets of the light includes locating a plurality of movable aperture elements between the light source and the targets. Each aperture element defines an aperture through which the light passes from the light source to an associated one of the plurality of targets associated with the aperture element along a longitudinal axis of the aperture element. The method also includes moving at least one of the aperture elements along its longitudinal axis to change a feature of light incident on the target associated with the aperture element.

A method for producing a contact spacing converter space transformer) which has electrical contacts that form electrical paths and in which a first contact spacing of the contacts is converted into a comparatively different, second contact spacing of the electrical contacts including producing at least one base part from each of at least some of the electrical contacts. At least a section of the base part is produced from plastic. The method subsequently includes metallization of at least the section of the base part that is produced from plastic.

A method for producing a contact spacing converter space transformer) which has electrical contacts that form electrical paths and in which a first contact spacing of the contacts is converted into a comparatively different, second contact spacing of the electrical contacts including producing at least one base part from each of at least some of the electrical contacts. At least a section of the base part is produced from plastic. The method subsequently includes metallization of at least the section of the base part that is produced from plastic.

A wiring board design support apparatus, in which a plurality of vias are arranged on a wiring board, includes a design information storage unit that stores design information of vias and wirings to be arranged on the wiring board, and a wiring board via arrangement unit that moves, on a basis of the design information, positions of lattice points arranged with same intervals in vertical and horizontal directions by a given moving amount in a vertical direction and a horizontal direction while alternately changing a moving direction in the horizontal direction of the lattice points for each row of the lattice and alternately changing a moving direction in the vertical direction of the lattice points for each column of the lattice, so as to arrange vias at positions of the lattice points after movement.

A wiring board design support apparatus, in which a plurality of vias are arranged on a wiring board, includes a design information storage unit that stores design information of vias and wirings to be arranged on the wiring board, and a wiring board via arrangement unit that moves, on a basis of the design information, positions of lattice points arranged with same intervals in vertical and horizontal directions by a given moving amount in a vertical direction and a horizontal direction while alternately changing a moving direction in the horizontal direction of the lattice points for each row of the lattice and alternately changing a moving direction in the vertical direction of the lattice points for each column of the lattice, so as to arrange vias at positions of the lattice points after movement.

A test probe assembly for use in testing a semiconductor wafer includes a probe card, a plurality of test probes mounted to the probe card and one or more piezoelectric elements mounted to each test probe. The piezoelectric elements are configured to move respective probe ends of the individual test probes in at least one direction to facilitate realignment of the probe ends for semiconductor wafer testing.

A conductive probe may include a probe body for communicating with a circuit tester or a jumper. The probe body may be formed of metal and may have a free end. A probe tip may be mounted to the end of the probe body. The probe tip may be formed of thorium-tungsten. The probe tip may be configured for contacting a circuit node.

A conductive probe may include a probe body for communicating with a circuit tester or a jumper. The probe body may be formed of metal and may have a free end. A probe tip may be mounted to the end of the probe body. The probe tip may be formed of thorium-tungsten. The probe tip may be configured for contacting a circuit node.