A device includes a channel, a slit, and a cap. The channel is formed on a surface of the device. The slit separates the channel to a first portion and a second portion. The first portion comprises liquid metal, e.g., gallatin. The second portion comprises gas. The liquid metal moves within the channel between the first and the second portions in response to external stimuli, e.g., pressure. The liquid metal moving within the channel changes electrical characteristics, e.g., capacitive value, inductance value, resistance value, resonance frequency, etc., of the device.

A device includes a channel, a slit, and a cap. The channel is formed on a surface of the device. The slit separates the channel to a first portion and a second portion. The first portion comprises liquid metal, e.g., gallatin. The second portion comprises gas. The liquid metal moves within the channel between the first and the second portions in response to external stimuli, e.g., pressure. The liquid metal moving within the channel changes electrical characteristics, e.g., capacitive value, inductance value, resistance value, resonance frequency, etc., of the device.

Disclosed is a probe device of a floating structure including a probe unit having a groove formed at one end thereof into which a needle for transmitting an electrical signal is inserted, and a guide portion formed at the other end thereof and a plate unit having an inner space which is inserted with the guide portion and formed to support a part of the guide portion, wherein the guide portion is spaced apart from the inner space at a predetermined interval by an external force applied to the needle.

An integrated circuit (IC) device, such as a wafer, die, or the like, includes a viscoelastic pad upon a contact. The viscoelastic pad includes a viscoelastic material and an electrically conductive material within the viscoelastic material. The viscoelastic pad provides for a probe needle of an IC device tester to be electrically connected to the IC device contact without the probe needle directly contacting the IC device contact. The viscoelastic pad may be probed multiple instances by the probe needle and may be washed or otherwise removed from the IC device after testing is completed. The viscoelastic pad may be formed upon the IC device by forming the viscoelastic material within a mask, aligning the viscoelastic pad to the IC device contact, and ejecting the viscoelastic material from the mask upon the IC device contact.

An integrated circuit (IC) device, such as a wafer, die, or the like, includes a viscoelastic pad upon a contact. The viscoelastic pad includes a viscoelastic material and an electrically conductive material within the viscoelastic material. The viscoelastic pad provides for a probe needle of an IC device tester to be electrically connected to the IC device contact without the probe needle directly contacting the IC device contact. The viscoelastic pad may be probed multiple instances by the probe needle and may be washed or otherwise removed from the IC device after testing is completed. The viscoelastic pad may be formed upon the IC device by forming the viscoelastic material within a mask, aligning the viscoelastic pad to the IC device contact, and ejecting the viscoelastic material from the mask upon the IC device contact.

A method for cleaning and coating a tip of a test probe in an integrated circuit package test system is provided. The method includes 1) saturating a brush tip comprising nonporous bristles with a solution of phosphonic acid; 2) applying the solution of phosphonic acid to the tip of the test probe with the brush tip to coat the tip of the test probe with the solution of phosphonic acid; and 3) allowing the solution of phosphonic acid to dry on the tip of the test probe and form a self-assembled monolayer of phosphonates thereon.

A method for cleaning and coating a tip of a test probe in an integrated circuit package test system is provided. The method includes 1) saturating a brush tip comprising nonporous bristles with a solution of phosphonic acid; 2) applying the solution of phosphonic acid to the tip of the test probe with the brush tip to coat the tip of the test probe with the solution of phosphonic acid; and 3) allowing the solution of phosphonic acid to dry on the tip of the test probe and form a self-assembled monolayer of phosphonates thereon.

A shunt strip that includes a plurality of shunts arranged in a grid with each of the shunts spaced from an adjacent shunt by a shunt-gap. A plurality of tabs connect the plurality of shunts and at least one tab is positioned within each shunt-gap. Also, a shunt with a generally parallelepiped shaped body has severed tab portions extending outwardly and downwardly from the body.

A shunt strip that includes a plurality of shunts arranged in a grid with each of the shunts spaced from an adjacent shunt by a shunt-gap. A plurality of tabs connect the plurality of shunts and at least one tab is positioned within each shunt-gap. Also, a shunt with a generally parallelepiped shaped body has severed tab portions extending outwardly and downwardly from the body.

A method of conductively bonding a test probe tip having an electrically conductive element to a device under test (DUT) having an electrical connection point, the method comprising: positioning the electrically conductive element of the test probe tip proximate to the electrical connection point of the DUT; dispensing a UV-cure conductive adhesive between the electrically conductive element and the electrical connection point of the DUT, the dispensed UV-cure conductive adhesive continuously covering at least a portion of the electrically conductive element and at least a portion of the electrical connection point of the DUT; and bonding the dispensed UV-cure conductive adhesive to the electrically conductive element and the electrical connection point of the DUT by applying UV-light from a UV-light source to the dispensed UV-cure conductive adhesive.