A method of detecting abnormal test signal channel of automatic test equipment firstly obtains a raw test data and then divides into the data groups according to a mapping data. The test data of DUTs in one data group are generated by the same group of probes. A yield of each data group is further estimated. A yield of a wafer is further estimated when the yield of the data group matches a first failure threshold. An abnormal test signal channel is determined when the yield of the wafer does not match a second failure threshold or the yield of the wafer matches the normal threshold. Therefore, to add the detecting method in an original test procedure of the ATE, the operator easily identifies which blocks in the failure color on the test data map are caused by the abnormal test signal channel.

A circuit includes, in series between a first terminal and a second terminal of application of a power supply voltage, and first and second branches. The first branch includes a first transistor and a first current source coupled to the first transistor. The second branch includes a resistive element, a second transistor coupled to the resistive element and forming a current mirror with the first transistor and a second current source coupled to the second transistor. The resistive element conditions a threshold of detection of a variation of the power supply voltage.

A circuit includes, in series between a first terminal and a second terminal of application of a power supply voltage, and first and second branches. The first branch includes a first transistor and a first current source coupled to the first transistor. The second branch includes a resistive element, a second transistor coupled to the resistive element and forming a current mirror with the first transistor and a second current source coupled to the second transistor. The resistive element conditions a threshold of detection of a variation of the power supply voltage.

A system for managing grid interaction with an energy storage device includes an energy exchange server, a plurality of energy storage devices, a plurality of interconnect socket adapters, and a plurality of energy exchange controllers, each energy exchange controller coupling to one of the plurality of interconnect socket adapters and dictating energy consumption based on energy pricing data received from the energy exchange server. Each interconnect socket adapter electrically couples to the power grid, one or more energy sinks, and an energy storage device, and the energy exchange server receives a real-time energy consumption data set, a real-time energy production data set, a set of environmental parameters and a starting energy price, and generates a current aggregate electricity demand value as a function of the real-time energy consumption data set and the environmental parameters, a current aggregate electricity supply value as a function of the real-time energy production dataset and the environmental parameters, and a current energy price as a function of the starting energy price, the current aggregate electricity demand value, and the current aggregate electricity supply value.

A system for managing grid interaction with an energy storage device includes an energy exchange server, a plurality of energy storage devices, a plurality of interconnect socket adapters, and a plurality of energy exchange controllers, each energy exchange controller coupling to one of the plurality of interconnect socket adapters and dictating energy consumption based on energy pricing data received from the energy exchange server. Each interconnect socket adapter electrically couples to the power grid, one or more energy sinks, and an energy storage device, and the energy exchange server receives a real-time energy consumption data set, a real-time energy production data set, a set of environmental parameters and a starting energy price, and generates a current aggregate electricity demand value as a function of the real-time energy consumption data set and the environmental parameters, a current aggregate electricity supply value as a function of the real-time energy production dataset and the environmental parameters, and a current energy price as a function of the starting energy price, the current aggregate electricity demand value, and the current aggregate electricity supply value.

A probe card device includes an upper die unit, a lower die unit, a spacer sandwiched between the upper and lower die units, an impedance adjusting member, and conductive probes. The upper die unit includes a first die and a second die spaced apart from the first die. The first die has a penetrating hole, and the second die has a circuit layer. The impedance adjusting member is disposed on the second die and is electrically coupled to the circuit layer. Each of the conductive probes passes through the upper die unit, the spacer, and the lower die unit. At least one of the conductive probes includes an upper contacting segment protruding from the upper die unit and an extending arm connected to the upper contacting segment. The extending arm is abutted against the circuit layer by passing through the penetrating hole.

A probe card and a manufacturing method of a probe card are provided. The probe card includes a probe head, first and second substrates, a first elastic component, and a first adhesive member. The second substrate is disposed between the probe head and the first substrate, and is disposed on the first substrate. The second substrate faces the first substrate and includes second contacts. The second contacts are electrically connected to first contacts of the first substrate. The first elastic component is disposed between the first substrate and the second substrate, and disposed at an outer side of the second contacts. The first adhesive member is disposed on the first substrate, annularly arranged on the side surface of the second substrate, and disposed at an outer side of the first elastic component.

A probe card and a manufacturing method of a probe card are provided. The probe card includes a probe head, first and second substrates, a first elastic component, and a first adhesive member. The second substrate is disposed between the probe head and the first substrate, and is disposed on the first substrate. The second substrate faces the first substrate and includes second contacts. The second contacts are electrically connected to first contacts of the first substrate. The first elastic component is disposed between the first substrate and the second substrate, and disposed at an outer side of the second contacts. The first adhesive member is disposed on the first substrate, annularly arranged on the side surface of the second substrate, and disposed at an outer side of the first elastic component.

An electrical characteristics inspection tool capable of inspecting electrical characteristics even when an oxide film is formed on pads or bumps formed at a fine pitch. The electrical characteristics inspection tool includes: a flexible sheet; a through electrode having a recess that is recessed from one surface of the flexible sheet; and a conductive elastomer disposed in the recess of the through electrode. Electrical characteristics can be inspected even when an oxide film is formed on pads or bumps of an inspection object by bringing the conductive elastomer into contact with the pads or bumps and bringing a probe into contact with the through electrode since the conductive particles in the conductive elastomer break through the oxide film.

An apparatus includes a substrate mechanically and electrically connected on one side of the substrate to multiple metallic probes in one or more arrays and includes the multiple metallic probes in the one or more arrays. In a method, multiple pits may be formed in an array on a first substrate. The pits have a pyramidal shape. A release layer is formed on the first substrate and covers surfaces of the pits. Probe tips are formed in the pits on the first substrate. The probe tips are formed from rigid conductive material. Multiple pillars are formed from rigid conductive material. The pillars are electrically and mechanically connected to a second substrate and to the probe tips. Release is caused of the probe tips from the first substrate, wherein the pillars and probe tips are connected to the second substrate and together form an array of rigid and conductive probes.