An apparatus includes a substrate mechanically and electrically connected on one side of the substrate to multiple metallic probes in one or more arrays and includes the multiple metallic probes in the one or more arrays. In a method, multiple pits may be formed in an array on a first substrate. The pits have a pyramidal shape. A release layer is formed on the first substrate and covers surfaces of the pits. Probe tips are formed in the pits on the first substrate. The probe tips are formed from rigid conductive material. Multiple pillars are formed from rigid conductive material. The pillars are electrically and mechanically connected to a second substrate and to the probe tips. Release is caused of the probe tips from the first substrate, wherein the pillars and probe tips are connected to the second substrate and together form an array of rigid and conductive probes.

A direction detecting device according to an exemplary embodiment of the present invention includes; a structure having at least two through-holes passing through an upper surface and a lower surface thereof; and at least two electrode units inserted into the at least two through-holes and each including a dielectric layer, a first electrode layer disposed on an upper surface of the dielectric layer and exposed at the upper surface of the structure, and a second electrode layer disposed on a lower surface of the dielectric layer and exposed at the lower surface of the structure.

Disclosed is a probe bonding device and method. The probe bonding device includes, a second gripper configured to move the probe to a bonding position on the substrate, a laser unit configured to emit a laser beam, a fourth vision device configured to check whether the probe gripped by the second gripper; and a controller configured to control the second gripper and the fourth vision device, wherein the controller controls the fourth vision device to photograph one end of the probe a plurality of numbers of times while sequentially adjusting a height of at least one of the second gripper and the fourth vision device at a predetermined interval to acquire information on a height of the probe based on a plurality of captured images, thereby bonding the probe to an accurate position to enhance bonding quality of the probe and quality of a probe card.

Disclosed is a probe bonding device and method. The probe bonding device includes, a second gripper configured to move the probe to a bonding position on the substrate, a laser unit configured to emit a laser beam, a fourth vision device configured to check whether the probe gripped by the second gripper; and a controller configured to control the second gripper and the fourth vision device, wherein the controller controls the fourth vision device to photograph one end of the probe a plurality of numbers of times while sequentially adjusting a height of at least one of the second gripper and the fourth vision device at a predetermined interval to acquire information on a height of the probe based on a plurality of captured images, thereby bonding the probe to an accurate position to enhance bonding quality of the probe and quality of a probe card.

A contact pin (100; 10012, 10032) for electrically connecting a first electrical contact area (13), which is arranged on a device under test (300) to be surveyed, and a second electrical contact area (17), which is arranged in a test base (200; 200), has an elongate central region (1) which is mechanically connected to the test base (200; 200), has a first spring arm (21), the first end (41) of which is connected to a first end (5) of the central region (1) and the second end (111) of which has a first contact region (12) for electrical contact-connection to the first electrical contact area (13), and has a second spring arm (31), the first end (61) of which is connected to a first or second end (5, 7) of the central region (1) and the second end (151) of which has a second contact region (16) for electrical contact-connection to the second electrical contact area (17). The first and the second spring arm (21, 31) are each oriented, in the region of their first end (41, 61), at an angle (1, 2) in relation to a longitudinal axis (9) of the central region (1), which angle is smaller than or equal to 90.

A contact pin (100; 10012, 10032) for electrically connecting a first electrical contact area (13), which is arranged on a device under test (300) to be surveyed, and a second electrical contact area (17), which is arranged in a test base (200; 200), has an elongate central region (1) which is mechanically connected to the test base (200; 200), has a first spring arm (21), the first end (41) of which is connected to a first end (5) of the central region (1) and the second end (111) of which has a first contact region (12) for electrical contact-connection to the first electrical contact area (13), and has a second spring arm (31), the first end (61) of which is connected to a first or second end (5, 7) of the central region (1) and the second end (151) of which has a second contact region (16) for electrical contact-connection to the second electrical contact area (17). The first and the second spring arm (21, 31) are each oriented, in the region of their first end (41, 61), at an angle (1, 2) in relation to a longitudinal axis (9) of the central region (1), which angle is smaller than or equal to 90.

Disclosed is a guide plate for a probe card guiding a probe pin of the probe card and a manufacturing method thereof, and the probe card having the same. Particularly, the guide plate and a manufacturing method thereof, and the probe card securing reliability of the probe card are intended to be provided, wherein probe pins are easily inserted into the guide plate, and pin insertion holes into which the probe pins are inserted are precisely formed in a small size.

Disclosed is a guide plate for a probe card guiding a probe pin of the probe card and a manufacturing method thereof, and the probe card having the same. Particularly, the guide plate and a manufacturing method thereof, and the probe card securing reliability of the probe card are intended to be provided, wherein probe pins are easily inserted into the guide plate, and pin insertion holes into which the probe pins are inserted are precisely formed in a small size.

A power exchange includes an energy exchange server and a plurality of exchange controllers, each exchange controller communicatively coupled to an interconnect socket adapter, wherein the energy exchange server receives a real-time energy consumption data set, a real-time energy production data set, a set of environmental parameters and a starting energy price, and generates a current aggregate electricity demand value as a function of the real-time energy consumption data set and the environmental parameters, a current aggregate electricity supply value as a function of the real-time energy production dataset and the environmental parameters, and a current energy price as a function of the starting energy price, the current aggregate electricity demand value, and the current aggregate electricity supply value.

A power exchange includes an energy exchange server and a plurality of exchange controllers, each exchange controller communicatively coupled to an interconnect socket adapter, wherein the energy exchange server receives a real-time energy consumption data set, a real-time energy production data set, a set of environmental parameters and a starting energy price, and generates a current aggregate electricity demand value as a function of the real-time energy consumption data set and the environmental parameters, a current aggregate electricity supply value as a function of the real-time energy production dataset and the environmental parameters, and a current energy price as a function of the starting energy price, the current aggregate electricity demand value, and the current aggregate electricity supply value.