A device for the placing and contacting of a test contact of a test contact arrangement arranged on a contact carrier featuring a contact head having at least one transmission channel for transmitting thermal energy and transferring a vacuum. The contact head is provided with a test contact receptacle at its contact end in the area of a channel mouth, the test contact receptacle having a receiving gap formed between two parallel receiving cheeks for receiving the test contact and connected with the transmission channel. The receiving cheeks have contact surfaces at their contact ends for contacting a solder deposit arranged on the contact carrier to produce a heat conducting contact with the solder material of the solder deposit.

A device for the placing and contacting of a test contact of a test contact arrangement arranged on a contact carrier featuring a contact head having at least one transmission channel for transmitting thermal energy and transferring a vacuum. The contact head is provided with a test contact receptacle at its contact end in the area of a channel mouth, the test contact receptacle having a receiving gap formed between two parallel receiving cheeks for receiving the test contact and connected with the transmission channel. The receiving cheeks have contact surfaces at their contact ends for contacting a solder deposit arranged on the contact carrier to produce a heat conducting contact with the solder material of the solder deposit.

A current sensor includes: a magnetic core member including a core main body obtained by forming a slit-shaped gap portion along a tube axis direction in a tube that surrounds a conductive member, which is an object to be energized, on an inner side with a clearance, the magnetic core member being configured to generate a magnetic flux corresponding to a current flowing through the conductive member; a magnetic sensor configured to output a signal corresponding to magnetic flux density in the gap portion; and a magnetic shield member including a shield main body that surrounds the core main body from an outer side of the core main body with a clearance, the magnetic shield member being configured to block magnetism between inside and outside of the shield main body by the shield main body.

A current sensor includes: a magnetic core member including a core main body obtained by forming a slit-shaped gap portion along a tube axis direction in a tube that surrounds a conductive member, which is an object to be energized, on an inner side with a clearance, the magnetic core member being configured to generate a magnetic flux corresponding to a current flowing through the conductive member; a magnetic sensor configured to output a signal corresponding to magnetic flux density in the gap portion; and a magnetic shield member including a shield main body that surrounds the core main body from an outer side of the core main body with a clearance, the magnetic shield member being configured to block magnetism between inside and outside of the shield main body by the shield main body.

A probe member for a pogo pin, a method of manufacturing the probe member, and a pogo pin including the probe member are disclosed. The probe member for the pogo pin has a contact portion including a material having hardness greater than the hardness of a first body portion and a second body portion, and each of the first and second body portions includes a material having electrical conductivity equal to or greater than 50% IACS (International Annealed Copper Standard).

A probe member for a pogo pin, a method of manufacturing the probe member, and a pogo pin including the probe member are disclosed. The probe member for the pogo pin has a contact portion including a material having hardness greater than the hardness of a first body portion and a second body portion, and each of the first and second body portions includes a material having electrical conductivity equal to or greater than 50% IACS (International Annealed Copper Standard).

Embodiments relate to the formation of test probes. One method includes providing a bulk sheet of an electrically conductive material. A laser is used to cut through the bulk sheet in a predetermined pattern to form a test probe. Other embodiments are described and claimed.

Embodiments relate to the formation of test probes. One method includes providing a bulk sheet of an electrically conductive material. A laser is used to cut through the bulk sheet in a predetermined pattern to form a test probe. Other embodiments are described and claimed.

A kit for cleaning and coating a tip of a test probe in an integrated circuit package test system is provided. The kit comprises a transfer stamp having a porous material impregnated with a phosphonic acid solution. The size and shape of the transfer stamp approximate those of the integrated circuit package being tested. Also provided is a method of cleaning and coating a tip of a test probe in an integrated circuit package test system. The method includes aligning the test system with a transfer stamp comprising a porous material that is impregnated with a phosphonic acid solution; pushing the test probe into the porous material to coat the tip with the phosphonic acid solution; removing the test probe; and allowing the phosphonic acid solution to dry on the tip of the test probe and form a self-assembled monolayer of phosphonates thereon. A test probe is also provided.

A redistribution system includes: a probe support base; a homogenous dielectric structure formed on the probe support base; a probe head structure formed on the homogenous dielectric structure, including: a probe conductive connector partially embedded in and extending from the homogenous dielectric structure; a probe head support adjacent to the probe conductive connector and extending from the homogenous dielectric structure; and a deflectable probe head attached to the probe conductive connector and suspended over a deflection gap between the probe conductive connector probe head support.