High-efficiency, ultra-low power gas sensors are provided. In one aspect, a gas detector device is provided which includes: at least one gas sensor having a plurality of fins; a conformal resistive heating element on the fins; a conformal barrier layer on the resistive heating element; and a conformal sensing layer on the barrier layer. A method of forming a gas sensor as well as a method for use thereof in gas detection are also provided.

High-efficiency, ultra-low power gas sensors are provided. In one aspect, a gas detector device is provided which includes: at least one gas sensor having a plurality of fins; a conformal resistive heating element on the fins; a conformal barrier layer on the resistive heating element; and a conformal sensing layer on the barrier layer. A method of forming a gas sensor as well as a method for use thereof in gas detection are also provided.

Embodiments may include systems and methods for manufacturing a probe for wafer sorting or die testing. A probe for wafer sorting or die testing may include a probe body and a probe tip. The probe body may include a probe core and a probe plating layer around the probe core. The probe core may include a first material, and the probe plating layer may include a second material. The probe tip may be next to the probe core of the probe body and may include the first material. In addition, the probe tip may have an end surface that is smaller than a surface of the probe core, and larger than a single point. A probe-manufacturing device may include a forging unit, a clipping unit, and an actuation mechanism to control the forging unit and the clipping unit. Other embodiments may be described and/or claimed.

Embodiments may include systems and methods for manufacturing a probe for wafer sorting or die testing. A probe for wafer sorting or die testing may include a probe body and a probe tip. The probe body may include a probe core and a probe plating layer around the probe core. The probe core may include a first material, and the probe plating layer may include a second material. The probe tip may be next to the probe core of the probe body and may include the first material. In addition, the probe tip may have an end surface that is smaller than a surface of the probe core, and larger than a single point. A probe-manufacturing device may include a forging unit, a clipping unit, and an actuation mechanism to control the forging unit and the clipping unit. Other embodiments may be described and/or claimed.

A probe tip structure that decreases the accumulation rate of Sn particles to the probe tip and enables considerably more efficient and complete laser cleaning is disclosed. In an embodiment, the probe structure includes an array of probe tips, each probe tip having an inner core; an interfacial layer bonded to the inner core; and an outer layer bonded to the interfacial layer, wherein the outer layer is resistant to adherence of the solder of the ball grid array package.

A probe tip structure that decreases the accumulation rate of Sn particles to the probe tip and enables considerably more efficient and complete laser cleaning is disclosed. In an embodiment, the probe structure includes an array of probe tips, each probe tip having an inner core; an interfacial layer bonded to the inner core; and an outer layer bonded to the interfacial layer, wherein the outer layer is resistant to adherence of the solder of the ball grid array package.

Provided is a current sensing device including an electrical conductor made of electrically conductive metal; and voltage sensing terminals provided on the electrical conductor. Each voltage sensing terminal is formed by inserting bar-like metal into a through-hole formed in the electrical conductor, and the voltage sensing terminal includes a first terminal portion that is stored in the through-hole and a second terminal portion that protrudes from the through-hole.

Provided is a current sensing device including an electrical conductor made of electrically conductive metal; and voltage sensing terminals provided on the electrical conductor. Each voltage sensing terminal is formed by inserting bar-like metal into a through-hole formed in the electrical conductor, and the voltage sensing terminal includes a first terminal portion that is stored in the through-hole and a second terminal portion that protrudes from the through-hole.

To improve wiring housing property, with preferable work efficiency, without deviation in the vertical direction or the horizontal direction, without expanding via arrangement areas. A wiring board design support apparatus of the present disclosure is a wiring board design support apparatus arranging a plurality of vias on a wiring board, and includes a design information storage unit that stores design information of vias and wirings to be arranged on the wiring board, and a wiring board via arrangement unit that moves, on a basis of the design information, positions of lattice points arranged with same intervals in vertical and horizontal directions by a given moving amount in a vertical direction and a horizontal direction while alternately changing a moving direction in the horizontal direction of the lattice points for each row of the lattice and alternately changing a moving direction in the vertical direction of the lattice points for each column of the lattice, so as to arrange vias at positions of the lattice points after movement.

An electrostatic encoder (40) detects the rotation angle of a rotor (42) with great accuracy based on the change in the capacitance between electrodes arranged on a stator (41) and the rotor (42). Detection electrodes (44a to 44d) and transmission electrodes (45a to 45d) are arranged circumferentially and alternately on the stator (41). Detection signals (phase A, phase B) amplitude-modulated based on the rotation of the rotor (42) and having a mutual phase difference of 90 degrees are output from adjacent ones of the detection electrodes. Modulated signals (V1, V2) are generated by demodulating the detection signals having a mutual phase difference of 90 degrees. Applying resolver-digital (RD) conversion processing to the modulated signals allows obtaining the rotation angle of the rotor.