A precise assembly mechanism contains: a control unit controlling a clamp unit, a loading unit, and a visual sensing unit to operate. The clamp unit includes a clamper and moves in a third direction Z, the loading unit includes a slider moving in a first direction X or a second direction Y, the holding tray moves in the first direction X or the second direction Y. The visual sensing unit includes a first sensor for identifying a position of an upper rim of each of at least one through orifice on a holding tray, a second sensor for identifying positions of a lower rim of each through orifice and a tip of each of multiple materials, a third sensor for determining a profile of each material in the second direction Y, and a fourth sensor configured to judge the profile of each material in the first direction X.

A precise assembly mechanism contains: a control unit controlling a clamp unit, a loading unit, and a visual sensing unit to operate. The clamp unit includes a clamper and moves in a third direction Z, the loading unit includes a slider moving in a first direction X or a second direction Y, the holding tray moves in the first direction X or the second direction Y. The visual sensing unit includes a first sensor for identifying a position of an upper rim of each of at least one through orifice on a holding tray, a second sensor for identifying positions of a lower rim of each through orifice and a tip of each of multiple materials, a third sensor for determining a profile of each material in the second direction Y, and a fourth sensor configured to judge the profile of each material in the first direction X.

A space transformer for connecting a signal source and probing a semiconductor wafer and a manufacturing method thereof are provided. The space transformer includes a circuit board including a wiring structure, a redistribution structure bonded to the circuit board and including second contact pads configured to probe the semiconductor wafer, a conductive through via penetrating through the circuit board and providing a vertical conductive path between the circuit board and redistribution structure. A plurality of first contact pads of the wiring structure is configured to connect the signal source. The redistribution structure is thinner than the circuit board, wherein a pitch of the adjacent second contact pads is finer than that of the adjacent first contact pads.

An interposer for disposing a semiconductor chip and an external terminal at two opposing sides and a manufacturing method thereof are provided. The interposer includes a first redistribution structure, a second redistribution structure disposed over and electrically coupled to the first redistribution structure, and an active device interposed between the first redistribution structure and the second redistribution structure. The semiconductor chip is disposed on and electrically connected to the first redistribution structure. A dimension of a first conductive pattern of the first redistribution structure is less than that of a second conductive pattern of the second redistribution structure, and the external terminal is disposed on and electrically connected to the second redistribution structure. An active surface of the active device is in contact with the first redistribution structure, and the active device is electrically coupled to the second redistribution structure through the first redistribution structure.

A testing apparatus according to an embodiment includes a chamber, a probe card including probes exposed in the chamber, a stage supporting a test target object in the chamber, a moving mechanism to move the stage between a testing position where the test target object is in contact with the probes and a cleaning position where the test target object is arranged away from the probes in a horizontal direction, and an air tube introducing first dry air into the chamber through the probe card when the stage is placed at the cleaning position.

A voltage detection circuit includes a resistance dividing circuit containing a coarse adjustment variable resistance circuit and a fine adjustment variable resistance circuit, a coarse adjustment circuit controlling the coarse adjustment variable resistance circuit, a fine adjustment circuit controlling the fine adjustment variable resistance circuit, and a control circuit controlling the coarse adjustment circuit and the fine adjustment circuit based upon a detection signal of a comparator circuit.

A device for measuring current intensities including a resistor arrangement, the resistor arrangement having at least two connection elements, at least one resistor element arranged between the connection elements, and at least one contact pin monolithically connected to one of the connection elements and being formed out of the material of the connection element. The device also includes a printed circuit board mechanically and electrically connected to the resistor arrangement, which printed circuit board has a side facing away from the resistor arrangement. The printed circuit board also includes at least one conductor track and at least one passage bore. The at least one contact pin of the resistor arrangement extends through the passage bore and has, on the side of the printed circuit board facing away from the resistor arrangement, a lateral widening. The lateral widening mechanically fixes the printed circuit board to the resistor arrangement.

A device for measuring current intensities including a resistor arrangement, the resistor arrangement having at least two connection elements, at least one resistor element arranged between the connection elements, and at least one contact pin monolithically connected to one of the connection elements and being formed out of the material of the connection element. The device also includes a printed circuit board mechanically and electrically connected to the resistor arrangement, which printed circuit board has a side facing away from the resistor arrangement. The printed circuit board also includes at least one conductor track and at least one passage bore. The at least one contact pin of the resistor arrangement extends through the passage bore and has, on the side of the printed circuit board facing away from the resistor arrangement, a lateral widening. The lateral widening mechanically fixes the printed circuit board to the resistor arrangement.

A device includes a channel, a slit, and a cap. The channel is formed on a surface of the device. The slit separates the channel to a first portion and a second portion. The first portion comprises liquid metal, e.g., gallatin. The second portion comprises gas. The liquid metal moves within the channel between the first and the second portions in response to external stimuli, e.g., pressure. The liquid metal moving within the channel changes electrical characteristics, e.g., capacitive value, inductance value, resistance value, resonance frequency, etc., of the device.

A contact probe may include a Ni pipe that may include a coiled spring structure, and the Ni pipe 11 may contain 0.5 to 10 wt % of phosphorus (P). The contact probe may have improved durability, by reducing shrinkage, after probing performed in a high temperature environment.