A method for attaching two electronics boards, e.g., a testing PCB and a space transformer, comprises rack welding resin prepreg and a mylar film to a testing PCB; laser drilling via holes in the resin prepreg and mylar film such that the holes are aligned on one side of the resin prepreg with connection/capture pads on the testing PCB and aligned (after attachment) on the other side of the resin prepreg with connection capture pads on a space transformer, filling the via holes with sintering paste; applying a pressure treatment to remove air, bubbles, and voids from the sintering paste; removing the mylar film; and using a lamination press cycle to attach a space transformer to the resin prepreg.

An object is to provide a probe card for high-temperature inspection at low cost. A wiring board 130 that supports a large number of probes 15, a heat-generating film 3 formed on the wiring board 130, and a pair of electrode terminals 4 that supplies a current to the heat-generating film 3 are provided, and the heat-generating film 3 is formed on a surface of the wiring board 130 by applying a heat-generating coating material in which fine carbon particles are dispersed in a binder.

A probe card capable of simultaneously measuring both optical and electrical characteristics of an optoelectronic device is provided. A probe pin inserted into a via hole formed in a substrate and configured to measure the electrical characteristics and an optical fiber inserted into the via hole formed in the substrate and configured to measure the optical characteristics are provided.

A probe card capable of simultaneously measuring both optical and electrical characteristics of an optoelectronic device is provided. A probe pin inserted into a via hole formed in a substrate and configured to measure the electrical characteristics and an optical fiber inserted into the via hole formed in the substrate and configured to measure the optical characteristics are provided.

Embodiments are directed to probe structures, arrays, methods of using probes and arrays, and/or methods for making probes and/or arrays. In the various embodiments, probes include at least two flat spring segments with at least one of those segments being used in a compressive manner wherein the probe additionally includes guide elements, framing structures or other structural configurations that limit or inhibit one or more compressive spring segments from bowing or deflecting out of a desired position when subjected to loading.

A handheld differential contact probe includes a housing configured to be held in a hand of a user, a pair of probe arms carried by the housing, and a pair of opposing probe tip assemblies each carried by one of the respective probe arms and each having a probe tip circuit coupled to a probe tip at a distal end thereof. A probe tip span adjustment mechanism is carried by the housing and coupled to the pair of probe arms, and configured to adjust a span between the probe tips. A ground path mechanism is coupled between the probe tip circuits of the respective probe tip assemblies, and includes a pair of curved conductive ribbon springs each coupled at an outer end thereof to a respective probe tip circuit, and each curved conductive ribbon spring slidably engaging each other at a respective inner end thereof.

A handheld differential contact probe includes a housing configured to be held in a hand of a user, a pair of probe arms carried by the housing, and a pair of opposing probe tip assemblies each carried by one of the respective probe arms and each having a probe tip circuit coupled to a probe tip at a distal end thereof. A probe tip span adjustment mechanism is carried by the housing and coupled to the pair of probe arms, and configured to adjust a span between the probe tips. A ground path mechanism is coupled between the probe tip circuits of the respective probe tip assemblies, and includes a pair of curved conductive ribbon springs each coupled at an outer end thereof to a respective probe tip circuit, and each curved conductive ribbon spring slidably engaging each other at a respective inner end thereof.

A testing head comprises at least one guide provided with a plurality of guide holes, and a plurality of contact elements housed in the plurality of guide holes. Suitably, the at least one guide comprises a plurality of conductive layers, each conductive layer: including holes of a corresponding plurality of group of the plurality of guide holes and electrically connecting a corresponding group of contact elements housed in the guide holes of the group, contact elements of a group being adapted to carry a same type of signal. The at least one guide is a multilayer comprising a plurality of non-conductive layers, and the conductive layers are arranged on respective faces of a layer of the plurality of non-conductive layers.

A testing head comprises at least one guide provided with a plurality of guide holes, and a plurality of contact elements housed in the plurality of guide holes. Suitably, the at least one guide comprises a plurality of conductive layers, each conductive layer: including holes of a corresponding plurality of group of the plurality of guide holes and electrically connecting a corresponding group of contact elements housed in the guide holes of the group, contact elements of a group being adapted to carry a same type of signal. The at least one guide is a multilayer comprising a plurality of non-conductive layers, and the conductive layers are arranged on respective faces of a layer of the plurality of non-conductive layers.

A handheld differential contact probe includes a housing configured to be held in a hand of a user, a pair of probe arms carried by the housing, and a pair of opposing probe tip assemblies each carried by one of the respective probe arms and each having a probe tip circuit coupled to a probe tip at a distal end thereof. A probe tip span adjustment mechanism is carried by the housing and coupled to the pair of probe arms, and configured to adjust a span between the probe tips. A ground path mechanism is coupled between the probe tip circuits of the respective probe tip assemblies, and includes a pair of curved conductive ribbon springs each coupled at an outer end thereof to a respective probe tip circuit, and each curved conductive ribbon spring slidably engaging each other at a respective inner end thereof.