The purpose of the present invention is to provide a method for repairing a probe card in which a defect has occurred in an alignment symbol or a peripheral region thereof by using a high reflection chip for alignment. The present invention is provided with a probe 16 for contacting an inspection object, a wiring substrate 14 to which the probe 16 is attached, and a high reflection chip 4 for alignment provided to a probe installation surface 17 of the wiring substrate 14. The high reflection chip 4 includes a metal plate having a fixing through-hole 41, and has an affixing surface to be attached to the probe installation surface 17 with an adhesive 6 and a mirror-finished high reflection surface on the other side from the affixing surface. The adhesive 6 formed on the affixing surface has a ridge 61 that extends into the fixing through-hole 41.

The purpose of the present invention is to provide a method for repairing a probe card in which a defect has occurred in an alignment symbol or a peripheral region thereof by using a high reflection chip for alignment. The present invention is provided with a probe 16 for contacting an inspection object, a wiring substrate 14 to which the probe 16 is attached, and a high reflection chip 4 for alignment provided to a probe installation surface 17 of the wiring substrate 14. The high reflection chip 4 includes a metal plate having a fixing through-hole 41, and has an affixing surface to be attached to the probe installation surface 17 with an adhesive 6 and a mirror-finished high reflection surface on the other side from the affixing surface. The adhesive 6 formed on the affixing surface has a ridge 61 that extends into the fixing through-hole 41.

A method for producing a probe card comprises the steps of: providing a carrier board, wherein a surface of the carrier board has at least one probe guiding portion; and generating a probe on the probe guiding portion by performing additive manufacturing with a conductive material directly on the at least one probe guiding portion to generate the probe, wherein the additive manufacturing comprises directly layering the conductive material on the probe guiding portion.

A method for producing a probe card comprises the steps of: providing a carrier board, wherein a surface of the carrier board has at least one probe guiding portion; and generating a probe on the probe guiding portion by performing additive manufacturing with a conductive material directly on the at least one probe guiding portion to generate the probe, wherein the additive manufacturing comprises directly layering the conductive material on the probe guiding portion.

A system for managing grid interaction with a solar power source includes an energy exchange server, a plurality of solar energy sources, a plurality of interconnect socket adapters, and a plurality of energy exchange controllers, each energy exchange controller coupling to one of the plurality of interconnect socket adapters and dictating energy consumption based on energy pricing data received from the energy exchange server. Each interconnect socket adapter electrically couples to the power grid, one or more energy sinks, and a solar energy source, and the energy exchange server receives a real-time energy consumption data set, a real-time energy production data set, a set of environmental parameters and a starting energy price, and generates a current aggregate electricity demand value as a function of the real-time energy consumption data set and the environmental parameters, a current aggregate electricity supply value as a function of the real-time energy production dataset and the environmental parameters, and a current energy price as a function of the starting energy price, the current aggregate electricity demand value, and the current aggregate electricity supply value.

A system for managing grid interaction with a solar power source includes an energy exchange server, a plurality of solar energy sources, a plurality of interconnect socket adapters, and a plurality of energy exchange controllers, each energy exchange controller coupling to one of the plurality of interconnect socket adapters and dictating energy consumption based on energy pricing data received from the energy exchange server. Each interconnect socket adapter electrically couples to the power grid, one or more energy sinks, and a solar energy source, and the energy exchange server receives a real-time energy consumption data set, a real-time energy production data set, a set of environmental parameters and a starting energy price, and generates a current aggregate electricity demand value as a function of the real-time energy consumption data set and the environmental parameters, a current aggregate electricity supply value as a function of the real-time energy production dataset and the environmental parameters, and a current energy price as a function of the starting energy price, the current aggregate electricity demand value, and the current aggregate electricity supply value.

A system for managing grid interaction with a wind power source includes an energy exchange server, a plurality of wind energy sources, a plurality of interconnect socket adapters, and a plurality of energy exchange controllers, each energy exchange controller coupling to one of the plurality of interconnect socket adapters and dictating energy consumption based on energy pricing data received from the energy exchange server. Each interconnect socket adapter electrically couples to the power grid, one or more energy sinks, and a wind energy source, and the energy exchange server receives a real-time energy consumption data set, a real-time energy production data set, a set of environmental parameters and a starting energy price, and generates a current aggregate electricity demand value as a function of the real-time energy consumption data set and the environmental parameters, a current aggregate electricity supply value as a function of the real-time energy production dataset and the environmental parameters, and a current energy price as a function of the starting energy price, the current aggregate electricity demand value, and the current aggregate electricity supply value.

A system for managing grid interaction with a wind power source includes an energy exchange server, a plurality of wind energy sources, a plurality of interconnect socket adapters, and a plurality of energy exchange controllers, each energy exchange controller coupling to one of the plurality of interconnect socket adapters and dictating energy consumption based on energy pricing data received from the energy exchange server. Each interconnect socket adapter electrically couples to the power grid, one or more energy sinks, and a wind energy source, and the energy exchange server receives a real-time energy consumption data set, a real-time energy production data set, a set of environmental parameters and a starting energy price, and generates a current aggregate electricity demand value as a function of the real-time energy consumption data set and the environmental parameters, a current aggregate electricity supply value as a function of the real-time energy production dataset and the environmental parameters, and a current energy price as a function of the starting energy price, the current aggregate electricity demand value, and the current aggregate electricity supply value.

An exemplary apparatus includes a testing module connected to, and providing a test voltage to, an integrated circuit containing devices under test. The testing module performs a time-dependent dielectric breakdown (TDDB) test on the devices under test. A decoder is connected to the devices under test and the testing module. The decoder selectively connects each device being tested to the testing module. Efuses are connected to a different one of the devices under test. The efuses separately electrically disconnect each of the devices under test from the test voltage upon failure of a corresponding device under test. Protection circuits are connected between the efuses and a ground voltage. Each protection circuit provides a shunt around the decoder upon failure of the device under test.

An exemplary apparatus includes a testing module connected to, and providing a test voltage to, an integrated circuit containing devices under test. The testing module performs a time-dependent dielectric breakdown (TDDB) test on the devices under test. A decoder is connected to the devices under test and the testing module. The decoder selectively connects each device being tested to the testing module. Efuses are connected to a different one of the devices under test. The efuses separately electrically disconnect each of the devices under test from the test voltage upon failure of a corresponding device under test. Protection circuits are connected between the efuses and a ground voltage. Each protection circuit provides a shunt around the decoder upon failure of the device under test.