A probe head comprises a plate-shaped support including respective pluralities of guide holes, a plurality of contact probes being slidingly housed in the respective pluralities of guide holes and including at least a first group of contact probes being apt to carry only one type of signal chosen between ground and power supply signals, a conductive portion realized on the support and including a plurality of the guide holes housing the contact probes of the first group, and at least one filtering capacitor having at least one capacitor plate being electrically connected to the conductive portion, the conductive portion electrically connecting the contact probes of the first group.

A probe head comprises a plate-shaped support including respective pluralities of guide holes, a plurality of contact probes being slidingly housed in the respective pluralities of guide holes and including at least a first group of contact probes being apt to carry only one type of signal chosen between ground and power supply signals, a conductive portion realized on the support and including a plurality of the guide holes housing the contact probes of the first group, and at least one filtering capacitor having at least one capacitor plate being electrically connected to the conductive portion, the conductive portion electrically connecting the contact probes of the first group.

Systems, methods, architectures, mechanisms, tools, and apparatus providing design for testability (DFT) to rapidly estimate a number of faults made untestable by a given circuit signal being either in the X/Z logic state, uncontrollable, or unobservable, and to iteratively configure mechanisms for insertion of test point structure within a circuit under test (CUT) such as a digital circuit including a large number of sequential logic, combinational logic, latches, clocking/timing devices, and the like. Various embodiments contemplate several iterations to achieve a desired testing solution, illustratively (i) a first pass to eliminate uninitialized flip-flops and latches using blockers; (ii) a second pass to estimate the number of lost faults caused by each untestable site; and (iii) a final pass to select only the most essential test point sites using measures of Entropy, Entropy Gain, and/or Entropy Derivative. All three passes employ the novel tournament structure of this invention where test points compete with each other and are ranked by importance. For some circuits, it is also effective to combine these three main optimization functions with the level number of logic gates (their depth in the circuit).

A probe card includes a flexible inorganic material layer, a metal micro structure, and a circuit board. The flexible inorganic material layer has a first surface and a second surface opposite to each other. The metal micro structure is disposed on the first surface. The circuit board is disposed on the second surface, and the circuit board is electrically connected to the metal micro structure. The test signal is adapted to be conducted to the circuit board through the flexible inorganic material layer.

A probe card comprises a support element that has a first side and a second side opposite the first side. A plurality of probe tips extend outward from the first side of the support element, the probe tips configured to make contact with components of a device-under-test (DUT). A plurality of vias extend through the support element from the first side to the second side, each of the vias connected to a respective probe tip in the plurality of probe tips. A plurality of conductive traces are formed on the support element, and each of the traces is connected to a respective via in the plurality of vias, wherein electrical signals can be provided to or received from the probe tips by way of the conductive traces.

A probe card comprises a support element that has a first side and a second side opposite the first side. A plurality of probe tips extend outward from the first side of the support element, the probe tips configured to make contact with components of a device-under-test (DUT). A plurality of vias extend through the support element from the first side to the second side, each of the vias connected to a respective probe tip in the plurality of probe tips. A plurality of conductive traces are formed on the support element, and each of the traces is connected to a respective via in the plurality of vias, wherein electrical signals can be provided to or received from the probe tips by way of the conductive traces.

Disclosed in the embodiments of the present invention are a laser writing apparatus and method for programming magnetoresistive devices. The apparatus comprises: a substrate, a magnetoresistive sensor and a thermal control layer which are sequentially arranged in a stacked manner. A non-magnetic insulating layer for electrical isolation is provided between the magnetoresistive sensor and the thermal control layer. The magnetoresistive sensor is composed of a magnetoresistive sensing unit which is a multilayer thin-film stacked structure containing an anti-ferromagnetic layer. The laser writer programming apparatus is used during the laser writer programming phase, along with varied parameters of the thermal control layers and/or magnetoresistive sensors, to change the thermal gradient produced by the laser on the magnetoresistive sensor, to increase or decrease the temperature change of the magnetoresistive sensor at the same laser power, and the film parameters use d to do this include material composition and film thickness. Through the embodiments of this invention, high precision laser programming of a magneotresistive sensor is obtained, with improved magnetoresistive sensor manufacturability, improved magnetoresistive sensor noise performance, and with improved magnetoresistive sensor detectability.

Disclosed in the embodiments of the present invention are a laser writing apparatus and method for programming magnetoresistive devices. The apparatus comprises: a substrate, a magnetoresistive sensor and a thermal control layer which are sequentially arranged in a stacked manner. A non-magnetic insulating layer for electrical isolation is provided between the magnetoresistive sensor and the thermal control layer. The magnetoresistive sensor is composed of a magnetoresistive sensing unit which is a multilayer thin-film stacked structure containing an anti-ferromagnetic layer. The laser writer programming apparatus is used during the laser writer programming phase, along with varied parameters of the thermal control layers and/or magnetoresistive sensors, to change the thermal gradient produced by the laser on the magnetoresistive sensor, to increase or decrease the temperature change of the magnetoresistive sensor at the same laser power, and the film parameters use d to do this include material composition and film thickness. Through the embodiments of this invention, high precision laser programming of a magneotresistive sensor is obtained, with improved magnetoresistive sensor manufacturability, improved magnetoresistive sensor noise performance, and with improved magnetoresistive sensor detectability.

A probe card and a manufacturing method of a probe card are provided. The probe card includes a probe head, first and second substrates, an insulating component, and an adhesive member. The second substrate is disposed between the probe head and the first substrate, and is disposed on the first substrate. The second substrate faces the first substrate and includes second contacts. The second contacts are electrically connected to first contacts of the first substrate. The insulating component is disposed between the first substrate and the second substrate, and disposed at an outer side of the second contacts. The adhesive member is disposed on the first substrate, arranged on at least a part of the side surface of the second substrate, and disposed at an outer side of the insulating component.

A probe card and a manufacturing method of a probe card are provided. The probe card includes a probe head, first and second substrates, an insulating component, and an adhesive member. The second substrate is disposed between the probe head and the first substrate, and is disposed on the first substrate. The second substrate faces the first substrate and includes second contacts. The second contacts are electrically connected to first contacts of the first substrate. The insulating component is disposed between the first substrate and the second substrate, and disposed at an outer side of the second contacts. The adhesive member is disposed on the first substrate, arranged on at least a part of the side surface of the second substrate, and disposed at an outer side of the insulating component.