Configuring a test socket to electrically couple a semiconductor package to a test device includes preparing a test socket including a base material and a first conductive portion included in the base material. The first conductive portion may extend in a thickness direction of the base material. Configuring the test socket may include forming a second conductive portion including conductive ink on the first conductive pattern. The second conductive portion may be formed based on printing conductive ink on the first conductive portion. The configuring may include forming the second conductive portion to repair the test socket. The first conductive portion may be degraded such that a top surface of the first conductive portion includes a surface depression. The second conductive portion may fill the surface depression. The first and second conductive portions may be integral with each other.

Configuring a test socket to electrically couple a semiconductor package to a test device includes preparing a test socket including a base material and a first conductive portion included in the base material. The first conductive portion may extend in a thickness direction of the base material. Configuring the test socket may include forming a second conductive portion including conductive ink on the first conductive pattern. The second conductive portion may be formed based on printing conductive ink on the first conductive portion. The configuring may include forming the second conductive portion to repair the test socket. The first conductive portion may be degraded such that a top surface of the first conductive portion includes a surface depression. The second conductive portion may fill the surface depression. The first and second conductive portions may be integral with each other.

An inductive-capacitive (LC) wireless sensor for the detection of toxic heavy metal ions includes inductors and interdigitated electrodes (IDE) in planar form. The sensor is fabricated by screen printing silver (Ag) ink onto a flexible polyethylene-terephthalate (PET) substrate to form a metallization layer. Palladium nanoparticles (Pd NP) is drop casted onto the IDEs to form a sensing layer. The resonant frequency of the LC sensor is remotely monitored by measuring the reflection coefficient (S.sub.11) of a detection coil (planar inductor). The resonant frequency of the LC sensor changes with varying concentrations of heavy metals such as mercury (Hg.sup.2+) and lead (Pb.sup.2+) ions. Changes in the resonant frequency are used to detect the presence and/or concentration of heavy metal ions.

Interconnection meter socket adapters are provided. An interconnection meter socket adapter comprises a housing enclosing a set of electrical connections. The interconnection meter socket adapter may be configured to be coupled to a standard distribution panel and a standard electric meter, thereby establishing connections between a distribution panel and a user such that electrical power may be delivered to the user while an electrical meter measures the power consumption of the user. A power regulation module is disposed between the interconnection meter socket adapter, and configured to selectively connect one or more energy sources or energy sinks.

Interconnection meter socket adapters are provided. An interconnection meter socket adapter comprises a housing enclosing a set of electrical connections. The interconnection meter socket adapter may be configured to be coupled to a standard distribution panel and a standard electric meter, thereby establishing connections between a distribution panel and a user such that electrical power may be delivered to the user while an electrical meter measures the power consumption of the user. A power regulation module is disposed between the interconnection meter socket adapter, and configured to selectively connect one or more energy sources or energy sinks.

A probe card device includes a plurality of pins; a thin film substrate including a plurality of first thin film connecting points and a plurality of second thin film connecting points, wherein at least one of the first thin film connecting points is electrically connected to at least one the second thin film connecting points, and a pitch of any two adjacent ones of the first film connecting points is less than a pitch of any two adjacent ones of the second film connecting points; and a circuit board including a plurality of first circuit board connecting points, wherein at least one of the second thin film connecting points is electrically connected to at least one of the first circuit board connecting points. The probe card device can enhance a layout function and a support function at the same time.

A probe card device includes a plurality of pins; a thin film substrate including a plurality of first thin film connecting points and a plurality of second thin film connecting points, wherein at least one of the first thin film connecting points is electrically connected to at least one the second thin film connecting points, and a pitch of any two adjacent ones of the first film connecting points is less than a pitch of any two adjacent ones of the second film connecting points; and a circuit board including a plurality of first circuit board connecting points, wherein at least one of the second thin film connecting points is electrically connected to at least one of the first circuit board connecting points. The probe card device can enhance a layout function and a support function at the same time.

A shunt strip that includes a plurality of shunts arranged in a grid with each of the shunts spaced from an adjacent shunt by a shunt-gap. A plurality of tabs connect the plurality of shunts and at least one tab is positioned within each shunt-gap. Also, a shunt with a generally parallelepiped shaped body has severed tab portions extending outwardly and downwardly from the body.

The present disclosure relates to a method for manufacturing a conductivity sensor, including a conductive conductivity sensor, including method steps of producing a thermoplastic sensor body of a plastic, which is doped at least partially with a laser activatable, metal compound as an additive, radiating the sensor body at doped locations by means of a laser, so that conductive metal nuclei form from the metal compound, immersing the sensor body in a metal bath, until at least one conductive trace forms on the region having the metal nuclei, where the at least one conductive trace serves as an electrode of the conductivity sensor.

The present disclosure relates to a method for manufacturing a conductivity sensor, including a conductive conductivity sensor, including method steps of producing a thermoplastic sensor body of a plastic, which is doped at least partially with a laser activatable, metal compound as an additive, radiating the sensor body at doped locations by means of a laser, so that conductive metal nuclei form from the metal compound, immersing the sensor body in a metal bath, until at least one conductive trace forms on the region having the metal nuclei, where the at least one conductive trace serves as an electrode of the conductivity sensor.