In one embodiment, a tester calibration device includes a first board to be installed on one of a plurality of sockets of a tester for testing a semiconductor device, when the tester is to be calibrated. The device further includes a plurality of first pins provided on a first face of the first board, and to be made contact with the one socket when the tester is to be calibrated. The device further includes a wiring configured to electrically connect some of the plurality of first pins with each other.

In one embodiment, a tester calibration device includes a first board to be installed on one of a plurality of sockets of a tester for testing a semiconductor device, when the tester is to be calibrated. The device further includes a plurality of first pins provided on a first face of the first board, and to be made contact with the one socket when the tester is to be calibrated. The device further includes a wiring configured to electrically connect some of the plurality of first pins with each other.

A method for manufacturing a wire harness (1) includes: disposing a trunk harness (20), a branch harness (30) and control boxes (10) on a workbench (41) and attaching the trunk harness and the branch harness to the control boxes; connecting the control boxes to an external device (60) via the branch harness; and switching operation mode of at least one of the control boxes to an information writing mode for inputting information for operating the electric component to be connected to the branch harness into the at least one of the control boxes and then inputting the information from the external device into the at least one of the control boxes via the branch harness.

A kit for cleaning and coating a tip of a test probe in an integrated circuit package test system is provided. The kit comprises a transfer stamp having a porous material impregnated with a phosphonic acid solution. The size and shape of the transfer stamp approximate those of the integrated circuit package being tested. Also provided is a method of cleaning and coating a tip of a test probe in an integrated circuit package test system. The method includes aligning the test system with a transfer stamp comprising a porous material that is impregnated with a phosphonic acid solution; pushing the test probe into the porous material to coat the tip with the phosphonic acid solution; removing the test probe; and allowing the phosphonic acid solution to dry on the tip of the test probe and form a self-assembled monolayer of phosphonates thereon. A test probe is also provided.

A cleaning film designed to remove foreign matter and particulates from working surfaces of cleaning wafers used in semiconductor processes. These processes include wafer sort test for cleaning of probe card pins and FEOL tooling for cleaning during wafer handling equipment and wafer chucks. The debris collected on the cleaning wafer working surfaces is removed by the particle removal film allowing the debris and foreign matter to be discarded. The use of the cleaning film allows the operator to refresh the cleaning wafer without use of an outside vendor and eliminates wet washing and the use of solvents in the cleaning process.

This inspection jig is provided with: an inspection-side support member having a counter plate (51) provided with a facing surface (F) disposed to face the substrate; and an electrode-side support member (6) having supporting plates (61-63) disposed to face an electrode plate (9) located on the side opposite to the facing surface (F) of the counter plate (51) A probe supporting hole (23), into and by which the rear end portion of the probe (Pr) is inserted and supported, is provided in the supporting plates (61-63), and the probe supporting hole (23) is provided with a restricting surface which is formed along a supporting line (V) inclined at a certain angle () with respect to a reference line (Z), and which restricts the rear end portion of the probe (Pr) from moving in the direction perpendicular to the inclined direction of the supporting line (V).

This inspection jig is provided with: an inspection-side support member having a counter plate (51) provided with a facing surface (F) disposed to face the substrate; and an electrode-side support member (6) having supporting plates (61-63) disposed to face an electrode plate (9) located on the side opposite to the facing surface (F) of the counter plate (51) A probe supporting hole (23), into and by which the rear end portion of the probe (Pr) is inserted and supported, is provided in the supporting plates (61-63), and the probe supporting hole (23) is provided with a restricting surface which is formed along a supporting line (V) inclined at a certain angle () with respect to a reference line (Z), and which restricts the rear end portion of the probe (Pr) from moving in the direction perpendicular to the inclined direction of the supporting line (V).

A manufacturing method of contact probes for a testing head comprises the steps of: providing a substrate made of a conductive material; and defining at least one contact probe by laser cutting the substrate. The method further includes at least one post-processing fine definition step of at least one end portion of the contact probe, that follows the step of defining the contact probe by laser cutting, the end portion being a portion including a contact tip or a contact head of the contact probe. The fine definition step does not involve a laser processing and includes geometrically defining the end portion of the contact probe with at least a substantially micrometric precision.

A manufacturing method of contact probes for a testing head comprises the steps of: providing a substrate made of a conductive material; and defining at least one contact probe by laser cutting the substrate. The method further includes at least one post-processing fine definition step of at least one end portion of the contact probe, that follows the step of defining the contact probe by laser cutting, the end portion being a portion including a contact tip or a contact head of the contact probe. The fine definition step does not involve a laser processing and includes geometrically defining the end portion of the contact probe with at least a substantially micrometric precision.

This inspection jig is provided with: a plurality of probes (Pr) for bringing leading end portions (Pra) thereof into contact with a plurality of inspection points on a substrate (100); a support member (300) that supports the probes (Pr) in a state wherein the leading end portions (Pra) are disposed to be in contact with the inspection points on the substrate (100) respectively; device-side connecting terminals (36) electrically connected to an inspection device main body (2); a plurality of standard disposition electrodes (332), which are conducted to the device-side connecting terminals (36), and are disposed in previously set standard disposition; and a conversion block (31), which has a first surface (311) and a second surface (312) on sides opposite to each other, and in which first electrodes (E1) are formed on the first surface (311), and in which second electrodes (E2) are formed on the second surface (312).