This inspection jig is provided with: a plurality of probes (Pr) for bringing leading end portions (Pra) thereof into contact with a plurality of inspection points on a substrate (100); a support member (300) that supports the probes (Pr) in a state wherein the leading end portions (Pra) are disposed to be in contact with the inspection points on the substrate (100) respectively; device-side connecting terminals (36) electrically connected to an inspection device main body (2); a plurality of standard disposition electrodes (332), which are conducted to the device-side connecting terminals (36), and are disposed in previously set standard disposition; and a conversion block (31), which has a first surface (311) and a second surface (312) on sides opposite to each other, and in which first electrodes (E1) are formed on the first surface (311), and in which second electrodes (E2) are formed on the second surface (312).

In one embodiment, the present invention includes an interface assembly for a vertical probe contactor. The interface assembly comprises a base board, a mounting board, a depth adjust plate, and an interface apparatus. The depth adjust plate is between the base board and the mounting board, and the interface apparatus is mounted to the mounting board. The interface apparatus is configured to receive the vertical probe contactor through an opening in the base board and a corresponding opening in the depth adjust plate. A thickness of the depth adjust plate defines a vertical distance between a wafer side of the base board and a plurality of probe tips of the vertical probe contactor.

In one embodiment, the present invention includes an interface assembly for a vertical probe contactor. The interface assembly comprises a base board, a mounting board, a depth adjust plate, and an interface apparatus. The depth adjust plate is between the base board and the mounting board, and the interface apparatus is mounted to the mounting board. The interface apparatus is configured to receive the vertical probe contactor through an opening in the base board and a corresponding opening in the depth adjust plate. A thickness of the depth adjust plate defines a vertical distance between a wafer side of the base board and a plurality of probe tips of the vertical probe contactor.

A probe guide plate includes a first silicon substrate having first through-holes formed therein, an insulation layer formed on the first silicon substrate and having an opening on a region in which the first through-holes are arranged, a second silicon substrate arranged on the insulation layer and having second through-holes formed at positions corresponding to the first through-holes, and a silicon oxide layer formed on exposed surfaces of the first silicon substrate and the second silicon substrate.

A probe guide plate includes a first silicon substrate having first through-holes formed therein, an insulation layer formed on the first silicon substrate and having an opening on a region in which the first through-holes are arranged, a second silicon substrate arranged on the insulation layer and having second through-holes formed at positions corresponding to the first through-holes, and a silicon oxide layer formed on exposed surfaces of the first silicon substrate and the second silicon substrate.

A vertical spring contact that is constructed of a single piece of electrical conductor, having a central compressible spine that acts as a spring. This contact is also provided with a pair of arms extending downwards from a top member, flanking both sides of the central spine without being in contact with the central spine. The central spine structurally connects the top member to a bottom member. The bottom member is provided with recesses that are adapted to loosely receive the lower tips of the arms. In this way, when the contact is compressed, the lower tips of the arms are pressed into the recesses, thus establishing more contact points for a current to pass through.

A vertical spring contact that is constructed of a single piece of electrical conductor, having a central compressible spine that acts as a spring. This contact is also provided with a pair of arms extending downwards from a top member, flanking both sides of the central spine without being in contact with the central spine. The central spine structurally connects the top member to a bottom member. The bottom member is provided with recesses that are adapted to loosely receive the lower tips of the arms. In this way, when the contact is compressed, the lower tips of the arms are pressed into the recesses, thus establishing more contact points for a current to pass through.

Embodiments are directed to microscale and millimeter scale multi-layer structures (e.g., probe structures for making contact between two electronic components for example in semiconductor wafer, chip, and electronic component test applications). One or more layers of the structures include shell and core regions formed of different materials wherein the core regions are offset from a symmetric, longitudinally extending position.

Embodiments are directed to microscale and millimeter scale multi-layer structures (e.g., probe structures for making contact between two electronic components for example in semiconductor wafer, chip, and electronic component test applications). One or more layers of the structures include shell and core regions formed of different materials wherein the core regions are offset from a symmetric, longitudinally extending position.

Provided is a vertical probe card, the vertical probe card includes: a printed circuit board (PCB) including a bottom hole and a PCB pad surrounding the bottom hole; a cover plate disposed on the PCB and including a cover hole, where the cover hole and the bottom hole are disposed coaxial with each other and form a receiving space; and a probe received in the receiving space. The probe includes a probe head passing through the cover hole to extend out of the cover plate and to contact with a chip, where an end, which is provided with the probe head, of the probe is a first end; and a protruding portion disposed in the mid-portion of the probe and in contact with the PCB pad, where a part between the probe head and the protruding portion of the probe and the protruding portion are conductors.