A contact-distance transformer of an electric testing device for testing an electric specimen such as a wafer, for reducing a distance between neighboring electric contacts, the transformer having a non-electrically conductive supporting structure with a first side with first electric contacts positioned apart a first distance and a second side with second electric contacts positioned apart a second, smaller distance. The first contacts are connected to the second contacts by electric connections passing through the support structure and/or which are positioned on the support structure.

A contact-distance transformer of an electric testing device for testing an electric specimen such as a wafer, for reducing a distance between neighboring electric contacts, the transformer having a non-electrically conductive supporting structure with a first side with first electric contacts positioned apart a first distance and a second side with second electric contacts positioned apart a second, smaller distance. The first contacts are connected to the second contacts by electric connections passing through the support structure and/or which are positioned on the support structure.

A continuity testing and cleaning fixture includes a continuity test area disposed on a portion of a first surface of the fixture, wherein the continuity test area comprises an upper region comprising at least 99.99 wt % tungsten. The continuity testing and cleaning fixture may be used in a method involving contacting at least two conductive elements of a probe card with a continuity test area of a continuity testing and cleaning fixture, wherein the continuity test area comprises an upper region comprising at least 99.99 wt % tungsten; determining an electrical resistance between the at least two conductive elements; and cleaning the at least two conductive elements with at least one cleaning zone of the continuity testing and cleaning fixture in response to determining the electrical resistance to be above a first threshold.

The present disclosure relates to a method for producing a sensor comprising the steps of: adapting a sensor adapter of the sensor element to a first section of the process connection, introducing the sensor element with the sensor adapter first into the first section of the process connection, so that the sensor element projects beyond the process connection with a second section and the first section of the process connection and the first section of the sensor element form a gap, connecting the sensor element to the process connection by creating a weld connection between the first section of the process connection and the sensor adapter of the sensor element in the region of the gap.

The present disclosure relates to a method for producing a sensor comprising the steps of: adapting a sensor adapter of the sensor element to a first section of the process connection, introducing the sensor element with the sensor adapter first into the first section of the process connection, so that the sensor element projects beyond the process connection with a second section and the first section of the process connection and the first section of the sensor element form a gap, connecting the sensor element to the process connection by creating a weld connection between the first section of the process connection and the sensor adapter of the sensor element in the region of the gap.

A manufacturing method of a semi-finished product that includes a plurality of contact for a testing head of electronic devices comprises the steps of: providing a substrate made of a conductive material; and defining each contact probe by removing material from the substrate, each contact probes being anchored to the substrate by at least one bridge of material. The step of defining the contact probes includes a step of laser cutting, in correspondence with a contour of the contact probes and of that at least one bridge of material.

A manufacturing method of a semi-finished product that includes a plurality of contact for a testing head of electronic devices comprises the steps of: providing a substrate made of a conductive material; and defining each contact probe by removing material from the substrate, each contact probes being anchored to the substrate by at least one bridge of material. The step of defining the contact probes includes a step of laser cutting, in correspondence with a contour of the contact probes and of that at least one bridge of material.

A connector includes multiple contact sets that are aligned. Each of the contact sets includes a signal contact for signal transmission and multiple ground contacts. The ground contacts include respective shield portions. The ground contacts are provided around the signal contact in such a manner as to surround the signal contact by the respective shield portions.

A shunt strip that includes a plurality of shunts arranged in a grid with each of the shunts spaced from an adjacent shunt by a shunt-gap. A plurality of tabs connect the plurality of shunts and at least one tab is positioned within each shunt-gap. Also, a shunt with a generally parallelepiped shaped body has severed tab portions extending outwardly and downwardly from the body.

Embodiments of the invention are directed to apparatuses and methods for cleaning and disinfecting probes. A cleaner is utilized to remove foreign materials (e.g., bioburden, soil, and other like material) from the probe after it is removed from the patient by soaking and/or flushing the foreign materials from the probe. The cleaner may be an enzymatic detergent that has bacteriostatic properties to inhibit bacterial growth within the apparatus. The multiple enzymes in the cleaner attack the foreign material, and include low-foam properties for effective recirculation across cycles within the cleaning step. The probe is rinsed after the cleaning step, and after rinsing a disinfectant process is applied to the probe. The disinfectant soaks and/or flushes the probe for a specified amount of time across cycles of recirculation to disinfect the surface of the probe, and afterwards the probe is rinsed thoroughly to remove the disinfectant from the probe.