Patent classifications
G01R3/00
SYSTEM AND METHOD FOR PROBE CLEANING AND DISINFECTING
Embodiments of the invention are directed to apparatuses and methods for cleaning and disinfecting probes. A cleaner is utilized to remove foreign materials (e.g., bioburden, soil, and other like material) from the probe after it is removed from the patient by soaking and/or flushing the foreign materials from the probe. The cleaner may be an enzymatic detergent that has bacteriostatic properties to inhibit bacterial growth within the apparatus. The multiple enzymes in the cleaner attack the foreign material, and include low-foam properties for effective recirculation across cycles within the cleaning step. The probe is rinsed after the cleaning step, and after rinsing a disinfectant process is applied to the probe. The disinfectant soaks and/or flushes the probe for a specified amount of time across cycles of recirculation to disinfect the surface of the probe, and afterwards the probe is rinsed thoroughly to remove the disinfectant from the probe.
REDISTRIBUTION SYSTEM WITH HOMOGENOUS NON-CONDUCTIVE STRUCTURE AND METHOD OF MANUFACTURE THEREOF
A redistribution system includes: a substrate; a homogenous dielectric structure on the substrate, including a plurality of redistribution layers, wherein: the redistribution layers include a polymer layer and conductive traces; the redistribution layers are directly bonded to one another by cross-linking of polymer molecules within the polymer layer of one of the redistribution layers to the polymer molecules of the polymer layer in an adjacent instance of the redistribution layers; and routing traces, including the conductive traces, embedded in the homogenous dielectric structure.
REDISTRIBUTION SYSTEM WITH HOMOGENOUS NON-CONDUCTIVE STRUCTURE AND METHOD OF MANUFACTURE THEREOF
A redistribution system includes: a substrate; a homogenous dielectric structure on the substrate, including a plurality of redistribution layers, wherein: the redistribution layers include a polymer layer and conductive traces; the redistribution layers are directly bonded to one another by cross-linking of polymer molecules within the polymer layer of one of the redistribution layers to the polymer molecules of the polymer layer in an adjacent instance of the redistribution layers; and routing traces, including the conductive traces, embedded in the homogenous dielectric structure.
HYBRID CURRENT SENSE SYSTEM
A hybrid current sense system and methods can comprise: a switch coupled to a phase output and coupled to a voltage rail; an amplifier coupled to the switch and the amplifier configured to detect current information of the switch; a current detector coupled between the switch and the voltage rail, the current detector configured to determine a measured current for the switch; and a current calibrator configured to calibrate the current information for the switch based on the measured current.
HYBRID CURRENT SENSE SYSTEM
A hybrid current sense system and methods can comprise: a switch coupled to a phase output and coupled to a voltage rail; an amplifier coupled to the switch and the amplifier configured to detect current information of the switch; a current detector coupled between the switch and the voltage rail, the current detector configured to determine a measured current for the switch; and a current calibrator configured to calibrate the current information for the switch based on the measured current.
PROBE HEAD AND METHOD OF PRODUCING TESTED SEMICONDUCTOR DIE AND VERTICAL PROBE MANUFACTURING METHOD
A probe head includes a probe seat, and vertical probes each having a head portion including a head portion installation section with a first width, and a probe tip section including a probe tip contact part with a second width smaller than the first width and a probe tip gradually narrowing part which is located between the head portion installation section and the probe tip contact part, gradually narrows from the first width to the second width, and has a first length smaller than a second length of the probe tip contact part. The head portion installation section protrudes out of a lower surface of the probe seat for a length smaller than the sum of the first and second lengths. The vertical probe is great in current withstanding capability, structural strength and life time, and meets the requirement of probing tiny electrically conductive contacts.
PROBE HEAD AND METHOD OF PRODUCING TESTED SEMICONDUCTOR DIE AND VERTICAL PROBE MANUFACTURING METHOD
A probe head includes a probe seat, and vertical probes each having a head portion including a head portion installation section with a first width, and a probe tip section including a probe tip contact part with a second width smaller than the first width and a probe tip gradually narrowing part which is located between the head portion installation section and the probe tip contact part, gradually narrows from the first width to the second width, and has a first length smaller than a second length of the probe tip contact part. The head portion installation section protrudes out of a lower surface of the probe seat for a length smaller than the sum of the first and second lengths. The vertical probe is great in current withstanding capability, structural strength and life time, and meets the requirement of probing tiny electrically conductive contacts.
Detect and differentiate touches from different size conductive objects on a capacitive button
Apparatuses and methods of distinguishing between a finger and stylus proximate to a touch surface are described. One apparatus includes a first circuit to obtain capacitance measurements of sense elements when a conductive object is proximate to a touch surface. The apparatus also includes a second circuit coupled to the first circuit. The second circuit is operable to detect whether the conductive object activates the first sense element, second sense element, or both, in view of the capacitance measurements. To distinguish between a stylus and a finger as the conductive object, the second circuit determines the conductive object as being the stylus when the second sense element is activated and the first sense element is not activated and determines the conductive object as being the finger when the first sense element and the second sense element are activated.
Detect and differentiate touches from different size conductive objects on a capacitive button
Apparatuses and methods of distinguishing between a finger and stylus proximate to a touch surface are described. One apparatus includes a first circuit to obtain capacitance measurements of sense elements when a conductive object is proximate to a touch surface. The apparatus also includes a second circuit coupled to the first circuit. The second circuit is operable to detect whether the conductive object activates the first sense element, second sense element, or both, in view of the capacitance measurements. To distinguish between a stylus and a finger as the conductive object, the second circuit determines the conductive object as being the stylus when the second sense element is activated and the first sense element is not activated and determines the conductive object as being the finger when the first sense element and the second sense element are activated.
Mass flow meter including organic-material covering layers
Mass flow sensors, mass flow meters, and methods of making the same are disclosed. A flow sensor may include one sensor tube, a pair of sensor wires wound around the sensor tube, and a covering layer disposed in the surroundings of the sensor tube and the sensor wires. The covering layer includes a first covering layer disposed in contact with the surface of the sensor tube, a second covering layer disposed in contact with the surface of the sensor wires, a third covering layer disposed in a space surrounded by the first covering layer and the second covering layer, and a fourth covering layer disposed so as to cover the whole of the sensor wires wound around the sensor tube. In variations, the covering layer includes one or two organic materials chosen from polyamide-imide and polyimide, and the film thickness of the first covering layer is 10 micrometers or more.