A testing device for wafer level testing of IC circuits is disclosed. An upper and lower pin (22, 62) are configured to slide relatively to each other and are held in electrically biased contact by an elastomer (80). To prevent rotation of the pins in the pin guide, a walled recess in the bottom of the pin guide engages flanges on the pins. In another embodiment, the pin guide maintains rotational alignment by being fitted around the pin profile or having projections abutting the pin. The pin guide (12) is maintained in alignment with the retainer 14 by establishing a registration corner (506) and driving the guide into the corner by elastomers in at least one diagonally opposite corner.

A testing device for wafer level testing of IC circuits is disclosed. An upper and lower pin (22, 62) are configured to slide relatively to each other and are held in electrically biased contact by an elastomer (80). To prevent rotation of the pins in the pin guide, a walled recess in the bottom of the pin guide engages flanges on the pins. In another embodiment, the pin guide maintains rotational alignment by being fitted around the pin profile or having projections abutting the pin. The pin guide (12) is maintained in alignment with the retainer 14 by establishing a registration corner (506) and driving the guide into the corner by elastomers in at least one diagonally opposite corner.

An electrode includes a conductor, an insulator, and a housing. The insulator is positioned at least partially around the conductor. The housing is positioned at least partially around the conductor. An upper surface of the insulator may be at least partially concave, an outer surface of the housing may have a groove formed therein, or both.

A sensor intermediate part is provided with a physical quantity detection element that has a power source terminal, a ground terminal and an output terminal that outputs a desired output signal, where the physical quantity detection element is capable of adjusting properties of the output signal; a high-capacitance capacitor, which has at least a first terminal and a second terminal, and a jumper wire, one end of which is conducted to either the power source terminal or the second terminal and the other end of which is not conducted. The first terminal is conducted to the ground terminal, and the power source terminal and the second terminal are configured to be electrically connectable by the jumper wire.

The inspection jig includes a rigid substrate, a flexible substrate connected to the rigid substrate, a support for supporting a part of the flexible substrate in a state that the part of the flexible substrate is protruded with respect to the rigid substrate, and a stretchable contactor provided on a protruding portion of the flexible substrate.

The inspection jig includes a rigid substrate, a flexible substrate connected to the rigid substrate, a support for supporting a part of the flexible substrate in a state that the part of the flexible substrate is protruded with respect to the rigid substrate, and a stretchable contactor provided on a protruding portion of the flexible substrate.

An inspection jig includes a rigid substrate, a flexible substrate connected to the rigid substrate, a support supporting a part of the flexible substrate in a state that the part of the flexible substrate is protruded with respect to the rigid substrate in a first direction, a biasing unit configured to bias the support in the first direction with respect to the rigid substrate, and a contactor provided on a protruding portion of the flexible substrate, the protruding portion being protruded with respect to the rigid substrate. The contactor includes a contact housing, and a probe supported on the contact housing. One end of the probe is in contact with a contact portion on the protruding portion.

A current sensor includes a magnetic detection element configured to detect magnetism produced from a current path and a magnetic shield core. The magnetic shield core includes a core portion arranged so as to extend around the current path such that the current path is positioned therein, a gap portion formed by cutting a part of the core portion and in which the magnetic detection element is arranged, and at least a pair of shield portions extending from the core portion toward the outside opposite to the inside of the core portion where the current path is arranged, so as to correspond to the magnetic detection element.

A current sensor includes a magnetic detection element configured to detect magnetism produced from a current path and a magnetic shield core. The magnetic shield core includes a core portion arranged so as to extend around the current path such that the current path is positioned therein, a gap portion formed by cutting a part of the core portion and in which the magnetic detection element is arranged, and at least a pair of shield portions extending from the core portion toward the outside opposite to the inside of the core portion where the current path is arranged, so as to correspond to the magnetic detection element.

A testing arrangement for testing Integrated Circuit (IC) interconnects is provided. In an example, the testing arrangement includes a substrate, and a first interconnect structure. The first interconnect structure may include a first member having a first end to attach to the substrate and a second end opposite the first end, and a second member having a first end to attach to the substrate and a second end opposite the first end. In some examples, the second end of the first member and the second end of the second member are to contact a second interconnect structure of a IC device under test, and the first end of the first member and the first end of the second member are coupled such that the first member and the second member are to transmit, in parallel, current to the second interconnect structure of the IC device under test.