An organic probe substrate structure includes a daughter card; an organic laminate attached to the daughter card; and multiple probes built onto a top surface of the organic laminate.

An organic probe substrate structure includes a daughter card; an organic laminate attached to the daughter card; and multiple probes built onto a top surface of the organic laminate.

A contact pin (100; 10012, 10032) for electrically connecting a first electrical contact area (13), which is arranged on a device under test (300) to be surveyed, and a second electrical contact area (17), which is arranged in a test base (200; 200), has an elongate central region (1) which is mechanically connected to the test base (200; 200), has a first spring arm (21), the first end (41) of which is connected to a first end (5) of the central region (1) and the second end (111) of which has a first contact region (12) for electrical contact-connection to the first electrical contact area (13), and has a second spring arm (31), the first end (61) of which is connected to a first or second end (5, 7) of the central region (1) and the second end (151) of which has a second contact region (16) for electrical contact-connection to the second electrical contact area (17). The first and the second spring arm (21, 31) are each oriented, in the region of their first end (41, 61), at an angle (1, 2) in relation to a longitudinal axis (9) of the central region (1), which angle is smaller than or equal to 90.

A rubber socket comprises a lower film, an upper film, an electrical connection member, and a rubber layer. The lower film comprises a plurality of lower electrode parts coupled to a synthetic resin film. The upper film is arranged in parallel with and spaced apart from the lower film, and comprises a plurality of upper electrode parts. The electrical connection member comprises: a soft substrate, which physically connects the lower electrode parts and the upper electrode parts, has a flat plate shape, and is easily bent by an external force; and a plurality of electrical connection patterns, which are longitudinally formed on one side surface of the soft substrate to electrically connect the lower electrode parts and the upper electrode parts. The rubber layer comprises an elastic material, is disposed between the lower film and the upper film, has all the electrical connection members buried therein, and constantly maintains a distance between the lower film and the upper film.

A rubber socket comprises a lower film, an upper film, an electrical connection member, and a rubber layer. The lower film comprises a plurality of lower electrode parts coupled to a synthetic resin film. The upper film is arranged in parallel with and spaced apart from the lower film, and comprises a plurality of upper electrode parts. The electrical connection member comprises: a soft substrate, which physically connects the lower electrode parts and the upper electrode parts, has a flat plate shape, and is easily bent by an external force; and a plurality of electrical connection patterns, which are longitudinally formed on one side surface of the soft substrate to electrically connect the lower electrode parts and the upper electrode parts. The rubber layer comprises an elastic material, is disposed between the lower film and the upper film, has all the electrical connection members buried therein, and constantly maintains a distance between the lower film and the upper film.

A probe card is disclosed. The probe card includes a first disc, a second disc, an alignment plate and multiple micro probes. One of the micro probes includes a linear segment and a curved segment connected to each other at an angle stop. The first disc includes a recessed area having multiple holes formed therein, wherein one of the holes is configured to receive the linear segment of the micro probe. The second disc includes a recessed area having multiple holes formed therein, wherein one of the holes is configured to receive the curved segment of the micro probe. Placed within the recessed area of the second disc, the alignment plate includes multiple holes formed therein, wherein one of the holes is configured to receive the curved segment of the micro probe.

A probe card is disclosed. The probe card includes a first disc, a second disc, an alignment plate and multiple micro probes. One of the micro probes includes a linear segment and a curved segment connected to each other at an angle stop. The first disc includes a recessed area having multiple holes formed therein, wherein one of the holes is configured to receive the linear segment of the micro probe. The second disc includes a recessed area having multiple holes formed therein, wherein one of the holes is configured to receive the curved segment of the micro probe. Placed within the recessed area of the second disc, the alignment plate includes multiple holes formed therein, wherein one of the holes is configured to receive the curved segment of the micro probe.

Probes are connected to the space transformer via multiple carrier plates. Electrical contacts from the probes to the space transformer are by way of spring tail features on the probes that connect to the space transformer and not to the carrier plates. In other words, the carrier plates are purely mechanical in function. This configuration can significantly reduce probe array fabrication time relative to sequential placement of individual probes on the space transformer. Multiple probe carrier plates can be populated with probes in parallel, and the final sequential assembly of carrier plates onto the space transformer has a greatly reduced operation count. Deviations of the space transformer from flatness can be compensated for.

Probes are connected to the space transformer via multiple carrier plates. Electrical contacts from the probes to the space transformer are by way of spring tail features on the probes that connect to the space transformer and not to the carrier plates. In other words, the carrier plates are purely mechanical in function. This configuration can significantly reduce probe array fabrication time relative to sequential placement of individual probes on the space transformer. Multiple probe carrier plates can be populated with probes in parallel, and the final sequential assembly of carrier plates onto the space transformer has a greatly reduced operation count. Deviations of the space transformer from flatness can be compensated for.

A wafer test machine is disclosed. The wafer test machine comprises a main body having a chamber defined therein, wherein a probe card is disposed at an upper portion of the chamber; a chuck for fixing a wafer in the chamber; a moving unit for moving the chuck in the chamber, thus making a contact between the probe card and the wafer; and a laser cleaning apparatus for cleaning the probe card in the chamber using a laser beam, when the probe card does not contact the wafer.