A sensor that detects the state of a fluid more appropriately includes a first electrode, a second electrode, a first opposing-side resin portion, and a second opposing-side resin portion. The first and second electrodes are arranged parallel to each other. The first opposing-side resin portion covers an area of a peripheral face of the first electrode, the area opposing the second electrode. The second opposing-side resin portion covers an area of a peripheral face of the second electrode, the area opposing the first electrode.

An electrical contact that employs a common compressible layer for all contacts, wherein the compressible layer is fashioned with ducts that contain bridges within them. The bridges are formed of the compressible layer. This bridge serves as a compressible member for a first and second member in electrical contact with each other, and that interact with each other such that a compression force acted on the first and second members will cause them to maintain electrical contact whilst compressing the bridge. When the compressive force is released, the bridge, acting like a spring, expands thus pushing the first and second members apart, but still in electrical contact with each other.

An electrical contact that employs a common compressible layer for all contacts, wherein the compressible layer is fashioned with ducts that contain bridges within them. The bridges are formed of the compressible layer. This bridge serves as a compressible member for a first and second member in electrical contact with each other, and that interact with each other such that a compression force acted on the first and second members will cause them to maintain electrical contact whilst compressing the bridge. When the compressive force is released, the bridge, acting like a spring, expands thus pushing the first and second members apart, but still in electrical contact with each other.

One example includes a device that is comprised of a plurality of printed circuit boards, a plurality of vias, and a plurality of castellations. The plurality of printed circuit boards are laminated together, at least some of the plurality of printed circuit boards including a dielectric panel and a plurality of conductor pads. The plurality of vias, through the plurality of conductor pads, include a conductive material to respectively electrically couple the plurality of conductor pads with each other. The plurality of castellations, on at least one side of the plurality of printed circuit boards, to electrically couple each of a plurality of contact pins of an integrated circuit socket with respective contact pads of the plurality of conductor pads.

One example includes a device that is comprised of a plurality of printed circuit boards, a plurality of vias, and a plurality of castellations. The plurality of printed circuit boards are laminated together, at least some of the plurality of printed circuit boards including a dielectric panel and a plurality of conductor pads. The plurality of vias, through the plurality of conductor pads, include a conductive material to respectively electrically couple the plurality of conductor pads with each other. The plurality of castellations, on at least one side of the plurality of printed circuit boards, to electrically couple each of a plurality of contact pins of an integrated circuit socket with respective contact pads of the plurality of conductor pads.

High-efficiency, ultra-low power gas sensors are provided. In one aspect, a gas detector device is provided which includes: at least one gas sensor having a plurality of fins; a conformal resistive heating element on the fins; a conformal barrier layer on the resistive heating element; and a conformal sensing layer on the barrier layer. A method of forming a gas sensor as well as a method for use thereof in gas detection are also provided.

High-efficiency, ultra-low power gas sensors are provided. In one aspect, a gas detector device is provided which includes: at least one gas sensor having a plurality of fins; a conformal resistive heating element on the fins; a conformal barrier layer on the resistive heating element; and a conformal sensing layer on the barrier layer. A method of forming a gas sensor as well as a method for use thereof in gas detection are also provided.

A current sensor includes: a magnetic core member including a core main body obtained by forming a slit-shaped gap portion along a tube axis direction in a tube that surrounds a conductive member, which is an object to be energized, on an inner side with a clearance, the magnetic core member being configured to generate a magnetic flux corresponding to a current flowing through the conductive member; a magnetic sensor configured to output a signal corresponding to magnetic flux density in the gap portion; and a magnetic shield member including a shield main body that surrounds the core main body from an outer side of the core main body with a clearance, the magnetic shield member being configured to block magnetism between inside and outside of the shield main body by the shield main body.

A current sensor includes: a magnetic core member including a core main body obtained by forming a slit-shaped gap portion along a tube axis direction in a tube that surrounds a conductive member, which is an object to be energized, on an inner side with a clearance, the magnetic core member being configured to generate a magnetic flux corresponding to a current flowing through the conductive member; a magnetic sensor configured to output a signal corresponding to magnetic flux density in the gap portion; and a magnetic shield member including a shield main body that surrounds the core main body from an outer side of the core main body with a clearance, the magnetic shield member being configured to block magnetism between inside and outside of the shield main body by the shield main body.

Testing probe and semiconductor testing fixture, and their fabrication methods are provided. A plurality of first testing pins is formed on the substrate, each first testing pin including a first testing terminal on a top and a first connection terminal on a bottom. An insulating layer is formed on a sidewall surface of each first testing pin. A number of second testing pins are formed on the insulating layers, each second testing pin including a second testing terminal on a top thereof and a second connection terminal on a bottom thereof. A first concave surface is formed on a top of the second testing terminal, and surrounds a corresponding first testing pin.