A testing probe is provided. The testing probe includes a first testing tip; an insulation layer formed on a side surface of the first testing tip; and a second testing tip being coaxial with the first testing tip and surrounding the first testing tip formed on a side surface of the insulation layer.

A testing probe is provided. The testing probe includes a first testing tip; an insulation layer formed on a side surface of the first testing tip; and a second testing tip being coaxial with the first testing tip and surrounding the first testing tip formed on a side surface of the insulation layer.

The test system provides an array of test probes. The probes pass through a first or upper probe guide retainer which has a plurality of slot sized to receive the probes in a way that they cannot rotate. A plurality of flex circuits at the different heights engage bottom probe ends at their respective height levels and flex circuits continue the electrical connection from the probes to a load board. The test probes are bonded to the flex circuits by ring shaped flowable conductive material. The flex circuits are biased against a load board by an elastomeric pad of spaced part conical projections.

A method for producing at least one spring contact pin acting as an electrical contact, or a spring contact pin arrangement comprises at least one such spring contact pin. The following steps are provided: producing at least one base part of the spring contact pin, at least one section of said base part being made of plastic, and subsequently metallizing at least the section of the base part that is made of plastic. The invention also relates to a spring contact pin produced to according to said method, or a spring contact pin arrangement having at least one such spring contact pin.

A method for producing at least one spring contact pin acting as an electrical contact, or a spring contact pin arrangement comprises at least one such spring contact pin. The following steps are provided: producing at least one base part of the spring contact pin, at least one section of said base part being made of plastic, and subsequently metallizing at least the section of the base part that is made of plastic. The invention also relates to a spring contact pin produced to according to said method, or a spring contact pin arrangement having at least one such spring contact pin.

A direction detecting device according to an exemplary embodiment of the present invention includes; a structure having at least two through-holes passing through an upper surface and a lower surface thereof; and at least two electrode units inserted into the at least two through-holes and each including a dielectric layer, a first electrode layer disposed on an upper surface of the dielectric layer and exposed at the upper surface of the structure, and a second electrode layer disposed on a lower surface of the dielectric layer and exposed at the lower surface of the structure.

A piezo sensor having an inner conductor having an inner conductor segment, where the inner conductor segment forms a tubular sidewall having a break, and also having an interior surface and an exterior surface; a plurality of individually polarized piezoelectric members, each having an inner face and an outer face, and each inner face contacting the first conductor exterior surface, each piezoelectric member being adjacent to another on the exterior face of the inner conductor, forming sets of adjacent faces; an outer conductor having an outer conductor segment forming a tubular sidewall having a break, the outer conductor having an interior surface and an exterior surface, where the interior surface contacts the outer face of the piezoelectric members; and where the break of the outer conductor segment is alignable with adjacent faces of two of the plurality of piezoelectric members, and further being alignable with the break of the inner conductor segment.

A piezo sensor having an inner conductor having an inner conductor segment, where the inner conductor segment forms a tubular sidewall having a break, and also having an interior surface and an exterior surface; a plurality of individually polarized piezoelectric members, each having an inner face and an outer face, and each inner face contacting the first conductor exterior surface, each piezoelectric member being adjacent to another on the exterior face of the inner conductor, forming sets of adjacent faces; an outer conductor having an outer conductor segment forming a tubular sidewall having a break, the outer conductor having an interior surface and an exterior surface, where the interior surface contacts the outer face of the piezoelectric members; and where the break of the outer conductor segment is alignable with adjacent faces of two of the plurality of piezoelectric members, and further being alignable with the break of the inner conductor segment.

An integrated circuit die includes a stack of a substrate and multiple layers extending in parallel to the substrate. A number of integrated electronic components is formed in the stack, and connected to form an electronic circuit. The electronic circuit comprises a first electric contact, a second electric contact, and a coupling which couples the electric strips electrically to each other. The coupling includes a circuit via which extends through at least two of the layers. The die further includes an integrated current sensor having a coil arrangement for sensing a current flowing through a part of the electronic circuit. The coil arrangement is magnetically coupled to the circuit via over at least a part of a length of the circuit via to sensing a magnetic flux through the circuit via. A measurement unit can measure a parameter of the coil arrangement representative of a current flowing through the circuit via.

An integrated circuit die includes a stack of a substrate and multiple layers extending in parallel to the substrate. A number of integrated electronic components is formed in the stack, and connected to form an electronic circuit. The electronic circuit comprises a first electric contact, a second electric contact, and a coupling which couples the electric strips electrically to each other. The coupling includes a circuit via which extends through at least two of the layers. The die further includes an integrated current sensor having a coil arrangement for sensing a current flowing through a part of the electronic circuit. The coil arrangement is magnetically coupled to the circuit via over at least a part of a length of the circuit via to sensing a magnetic flux through the circuit via. A measurement unit can measure a parameter of the coil arrangement representative of a current flowing through the circuit via.