A mounting structure includes a PCB on which first and second conductive patterns are formed, and a shunt resistor mounted on one surface of a substrate via a conductive bonding material. Each of the first and second conductive patterns includes: a first/second lead-out portion and a first/second pull-out portion which is pulled out to the outside of a region of the shunt resistor from the first/second lead-out portion. A resistance value of the shunt resistor is detected between the first pull-out portion and the second pull-out portion. A bonding material flow-out preventing resist is disposed at a portion of a surface of at least one of the first lead-out portion and the second lead-out portion, and a fillet of the bonding material terminates at a position corresponding to a position where the bonding material flow-out preventing resist is disposed.

A mounting structure includes a PCB on which first and second conductive patterns are formed, and a shunt resistor mounted on one surface of a substrate via a conductive bonding material. Each of the first and second conductive patterns includes: a first/second lead-out portion and a first/second pull-out portion which is pulled out to the outside of a region of the shunt resistor from the first/second lead-out portion. A resistance value of the shunt resistor is detected between the first pull-out portion and the second pull-out portion. A bonding material flow-out preventing resist is disposed at a portion of a surface of at least one of the first lead-out portion and the second lead-out portion, and a fillet of the bonding material terminates at a position corresponding to a position where the bonding material flow-out preventing resist is disposed.

Provided is a resistor including a first electrode, a second electrode, and a resistive element disposed between the first and second electrodes. Each of the first and second electrodes includes a main electrode portion and a narrow electrode portion with a narrower width than that of the main electrode portion. The resistive element is disposed between the two narrow electrode portions.

Provided is a resistor including a first electrode, a second electrode, and a resistive element disposed between the first and second electrodes. Each of the first and second electrodes includes a main electrode portion and a narrow electrode portion with a narrower width than that of the main electrode portion. The resistive element is disposed between the two narrow electrode portions.

In manufacturing method of shunt resistor according to the present invention, at least one of first and second conductors that is thicker than a resistance alloy plate member includes a joining surface abutted to the resistance alloy plate member with their edges on one side in a plate-thickness direction being aligned with each other, a first inclined surface that is gradually located on one side in the plate-thickness direction from the joining surface toward the side opposite to the resistance alloy plate member in the plate-surface direction, and a first plate surface extending to the side opposite to the resistance alloy plate member in the plate-surface direction from the first inclined surface. Electron beams or laser is emitted to the joining surfaces of the conductor having the larger thickness and the resistance alloy plate member from one side in the plate-thickness direction to weld the joining surfaces.

In manufacturing method of shunt resistor according to the present invention, at least one of first and second conductors that is thicker than a resistance alloy plate member includes a joining surface abutted to the resistance alloy plate member with their edges on one side in a plate-thickness direction being aligned with each other, a first inclined surface that is gradually located on one side in the plate-thickness direction from the joining surface toward the side opposite to the resistance alloy plate member in the plate-surface direction, and a first plate surface extending to the side opposite to the resistance alloy plate member in the plate-surface direction from the first inclined surface. Electron beams or laser is emitted to the joining surfaces of the conductor having the larger thickness and the resistance alloy plate member from one side in the plate-thickness direction to weld the joining surfaces.

Systems and methods for testing and/or operating remote devices are disclosed. The embodiments provide cost-effective, convenient, and flexible means for the sensing and/or probing of remote devices. Signals generated by remote devices may be received, analyzed, logged, and displayed, i.e., enhancements to the functionalities of an oscilloscope are achieved. Signals to remote devices may be provided, i.e. enhancements to the functionalities of a wave generator, logic analyzers, bus analyzers, and the like are achieved. More particularly, enhancements to the operability, capabilities, and functionality of such previously available testing equipment, are provided, via the operation of a remote, portable, and lightweight test bed. The test bed may be operated and controlled remotely via a user-computing device. The test bed senses, probes, and/or controls a remote device and test data is generated and/or acquired. The test data is provided to the user-computing device for analysis, visualization, and test report generation.

Systems and methods for testing and/or operating remote devices are disclosed. The embodiments provide cost-effective, convenient, and flexible means for the sensing and/or probing of remote devices. Signals generated by remote devices may be received, analyzed, logged, and displayed, i.e., enhancements to the functionalities of an oscilloscope are achieved. Signals to remote devices may be provided, i.e. enhancements to the functionalities of a wave generator, logic analyzers, bus analyzers, and the like are achieved. More particularly, enhancements to the operability, capabilities, and functionality of such previously available testing equipment, are provided, via the operation of a remote, portable, and lightweight test bed. The test bed may be operated and controlled remotely via a user-computing device. The test bed senses, probes, and/or controls a remote device and test data is generated and/or acquired. The test data is provided to the user-computing device for analysis, visualization, and test report generation.

To enable in a circuit arrangement (8) with a transformer with center tap the voltage measurement on the secondary side simply and safely, it is provided that at least two series-connected resistors (R3, R4) are connected between the two outer connections (A1, A2) of the secondary side of the transformer (T) to form a measurement point (P) between the two resistors (R3, R4), and a voltage measurement unit (V) is provided to measure the voltage (U.sub.P) between the measurement point (P) and the second output pole (13), which corresponds to the output voltage (U.sub.A).

This invention is referred to a guarantee seal for non-opening electrical energy consumption meters with mechanical seal type padlock, disposable of a single use; for sealing or closing some container, box, door, cabinet, meter, valve, pump, bag, carrier bag, water tank, etc., meanly used for the electricity meters commonly used in countries of North America, Central and South America; whose purpose is protecting and controlling the electricity theft, guarantying its immobility.

Such guarantee seal has a unique shape that fits exactly with the cavities of the meters and it gets in by pressure, therefore if the seal is located outside of such cavity its external manipulation is evident, furthermore, it has a lid, a base, a verification system by continuity and tag or RFID tag to ensure the integrity of such seal.