G01R27/00

Deterioration detection sensor of printed wiring board
10871441 · 2020-12-22 · ·

An object is to provide a deterioration detection sensor of a printed wiring board in which the accuracy of detection is enhanced. A deterioration detection sensor of a printed wiring board is a circuit board which is vertically provided on a printed wiring board, and is soldered to the printed wiring board with a soldering portion at a lower end. The deterioration detection sensor includes a detection surface for detecting a foreign material. The detection surface forms an intersection surface which intersects the planar direction of the printed wiring board. In the deterioration detection sensor as described above, a wiring in the detection surface is broken, and thus the foreign material is detected.

DRIVER CIRCUIT, CONVERTER ELECTRONICS FORMED THEREWITH AND MEASURING SYSTEM FORMED THEREWITH
20200386597 · 2020-12-10 ·

A driver circuit comprises a signal generator having a frequency control input, an amplitude control input and a signal output, an end stage having a signal input and a load output, as well as an amplitude control with an amplitude input, an amplitude output and a voltage measurement input. The signal generator is adapted to output on its signal output an at least at times periodic, electrical, analog signal having a signal frequency predetermined by a frequency control value applied on the frequency control input and a voltage- and/or electrical current amplitude predetermined by an amplitude control value applied on the amplitude control input. The end stage is adapted to drive through an electrical circuit involving the load output a load current having an electrical current level dependent on a signal voltage and/or a signal current of an electrical input signal applied on the signal input as well as to provide on the load output a load voltage having a voltage level dependent on the electrical current level of the load current. Moreover, the amplitude control is adapted, recurringly, to ascertain an amplitude deviation between an amplitude-actual value presiding on the amplitude input and an amplitude desired value. Additionally, the amplitude control is adapted, recurringly, to ascertain an indicator value, which signals whether a magnitude of a measurement voltage applied on the voltage measurement input is too high, namely whether the magnitude of a threshold value has been exceeded, and, with application of the indicator value, to ascertain an amplitude control value, in such a manner that in the case of a too high magnitude of the measurement voltage sequentially following amplitude control values of the amplitude control sequence are lessened, as well as to output on the amplitude output an amplitude control sequence of time sequentially calculated, amplitude control values. The signal output of the signal generator is, in turn, electrically connected with the signal input of the end stage and its load output is electrically connected with the voltage measurement input of the amplitude control. Moreover, the amplitude output of the amplitude control is electrically connected with the amplitude control input of the signal generator.

CIRCUIT ARRANGEMENT AND METHOD FOR RESISTANCE MEASUREMENT
20200363458 · 2020-11-19 ·

A circuit arrangement for resistance measurement comprises a capacitor coupled between a first potential node and a second potential node, a pair of terminals that comprises a first terminal and a second terminal, the first and second terminals being coupleable to one of the at least one resistor. The circuit arrangement further comprises a set of circuit branches comprising a first circuit branch, a second circuit branch, a third circuit branch and a fourth circuit branch, each comprising a switch switchable between a conductive state and an insulating state. The circuit arrangement further comprises the first terminal being coupled to the first potential node via the first circuit branch and the second circuit branch being connected in parallel. The circuit arrangement further comprises the second terminal being coupled to the second potential node via the third circuit branch and the fourth circuit branch being connected in parallel.

Classifying and identifying materials based on permittivity features

Systems and methods are provided for remotely identifying and classifying materials based on their respective complex permittivity features. Materials of interest to be identified in later inspections are cataloged according to their respective complex permittivity features by applying electromagnetic fields to them and determining their complex permittivity features. That library of features is used to compare field measurements taken during an inspection to determine the presence of a material of interest and to identify it.

Classifying and identifying materials based on permittivity features

Systems and methods are provided for remotely identifying and classifying materials based on their respective complex permittivity features. Materials of interest to be identified in later inspections are cataloged according to their respective complex permittivity features by applying electromagnetic fields to them and determining their complex permittivity features. That library of features is used to compare field measurements taken during an inspection to determine the presence of a material of interest and to identify it.

Self-contained metrology wafer carrier systems

Self-contained metrology wafer carrier systems and methods of measuring one or more characteristics of semiconductor wafers. The wafer carrier system may include a housing configured for transport within the automated material handling system. A support is configured to support a semiconductor wafer within a housing. A metrology system is disposed within the housing. The metrology system is operable to measure at least one characteristic of the wafer. The metrology system may include a sensing unit and a computing unit operably connected to the sensing unit.

Self-contained metrology wafer carrier systems

Self-contained metrology wafer carrier systems and methods of measuring one or more characteristics of semiconductor wafers. The wafer carrier system may include a housing configured for transport within the automated material handling system. A support is configured to support a semiconductor wafer within a housing. A metrology system is disposed within the housing. The metrology system is operable to measure at least one characteristic of the wafer. The metrology system may include a sensing unit and a computing unit operably connected to the sensing unit.

Apparatuses and methods for monitoring tendons of steerable catheters
10814101 · 2020-10-27 · ·

Methods and apparatuses for detecting tension on a tendon and/or mechanical deformation (e.g., breakage) of one or more steering tendon of a steerable and flexible articulating device. Theses apparatuses may have one or more tendons that are each electrically conductive and configured to steer the apparatus when tension is applied to the proximal end of the tendon. Tension and/or breakage (or other deformation) of one or more of these tendons may be detected by monitoring the electrical resistance of the tendons.

Vector network analyzer enabling device

A system and method for analyzing a device under test is provided. The system includes a signal source for generating an incident signal. The incident signal is routed to one or more inputs of the device under test. The system further includes signal separation and routing circuitry for measuring a portion of the incident signal to provide a reference signal and for separating the incident signal and a reflected signal at the one or more inputs of the device under test. The signal separation circuitry for separating the incident signal and the reflected signal at the input of the device under test is accomplished by a resistive device. The system may further include sampling device operationally coupled to the resistive device. The system and method may further include a signal switching mechanism for sequentially routing time slices of two or more signals to be coherently compared.

Method and systems relating to construction material assessment

Hundreds of thousands of concrete bridges, buildings etc. and hundreds of billions of tons of concrete require characterization throughout the process from manufacture to pouring and curing and on throughout service life. The characterization may relate to initial concrete properties, projected concrete properties, framework removal, corrosion, failure etc. Accordingly, a variety of measurements such as water content, electrical resistivity, and half-cell corrosion potential for example would be beneficially implemented as easy to use field test equipment or embedded sensors allowing lifetime monitoring to be performed rather than discrete assessments when issues become evident.