A method for manufacturing a multi-stage compound eye lens includes the steps of manufacturing a micropillar array using a photoetching method, then sputtering ZnO on the surface of the micropillar array, jet printing an ultraviolet curing adhesive onto gaps in the micropillar array using a micro jet printing machine, and controlling the morphology of microlens using the number of droplet dropping instances to obtain a microlens array; further respectively dissolving hexamethyl tetramine and zinc nitrate in deionized water, then pouring the hexamethyl tetramine solution into the zinc nitrate solution to obtain a mixed solution, placing the microlens array into the mixed solution, and placing is in a water bath kettle for a water bath, and finally, removing the microlens array from the mixed solution, rinsing it with deionized water, and drying same to obtain the multi-stage compound eye lens.

The present disclosure relates to a device for contactless optical imaging of features of a hand, wherein the device comprises an illumination arrangement for illuminating a measuring site with light of substantially a first wavelength and with light of at least substantially a second wavelength. The device further comprising a camera comprising a detector and objective configured for imaging the measuring site on the detector. Within the measuring site a region of depth of field of the objective with respect to the first wavelength overlaps with a region of depth of field of the objective with respect to the second wavelength.

An optical sensing module and an electronic device are provided. The optical sensing module includes a substrate, a plurality of optical sensing elements, and a light-blocking element. The substrate has a sensing region and a non-sensing region around the sensing region. The plurality of optical sensing elements is disposed on the sensing region. The light-blocking element is disposed on the non-sensing region and a portion of the sensing region. The light-blocking element overlaps a portion of the plurality of optical sensing elements in a normal direction of the substrate.

A method for manufacturing a roll mold by cutting a roll, includes generating a control waveform based on a signal corresponding to a rotary position of the roll, and making a plurality of cuts on a surface of the roll by, while the roll is rotated, reciprocating a cutting blade in a radial direction of the roll in accordance with the control waveform. Making the plurality of cuts includes at each of a plurality of predetermined locations, making a predetermined number of cuts of predetermined depth based on the control waveform. Generating the control waveform includes generating a control waveform dictating that, when multiple cuts are made at a predetermined location, each subsequent cut will have a smaller depth than a preceding cut.

A decrease in image quality is suppressed. A solid-state imaging apparatus according to an embodiment includes: a photoelectric conversion unit (PD) including a material having a smaller band gap energy than silicon; and a circuit board joined to the photoelectric conversion unit, the circuit board including: a pixel signal generation circuit that generates a pixel signal having a voltage value corresponding to a charge generated in the photoelectric conversion unit; and a thermometer circuit that detects a temperature of the circuit board.

According to examples, a system for designing optical components to provide passive athermalization and aberration correction is described. The system may include a processor and a memory storing instructions. The processor, when executing the instructions, may cause the system to select one or more optical elements to be included in the optical component based on the received design specifications, select one or more optical element configurations based on the selected one or more optical elements and implement an optimization function to optimize the selected one or more optical element configurations. The processor, when executing the instructions, may then determine if the one or more optical element configurations meet one or more initial specifications, enable one or more adjustment(s) to the one or more optical element configurations and determine if an optical element configuration meet one or more additional specifications.

According to examples, a system for designing optical components to provide passive athermalization and aberration correction is described. The system may include a processor and a memory storing instructions. The processor, when executing the instructions, may cause the system to select one or more optical elements to be included in the optical component based on the received design specifications, select one or more optical element configurations based on the selected one or more optical elements and implement an optimization function to optimize the selected one or more optical element configurations. The processor, when executing the instructions, may then determine if the one or more optical element configurations meet one or more initial specifications, enable one or more adjustment(s) to the one or more optical element configurations and determine if an optical element configuration meet one or more additional specifications.

Color mixing between pixels of different colors is suppressed. A solid-state imaging device includes: a semiconductor layer including a plurality of photoelectric conversion sections partitioned by an isolation region; a shared on-chip lens arranged on a light incident surface side of the semiconductor layer, the shared on-chip lens being shared by the photoelectric conversion sections adjacent to each other with the isolation region interposed between the photoelectric conversion sections, and having a condensing point positioned in the isolation region; and a concave portion provided in an upper portion of the photoelectric conversion sections that share the shared on-chip lens on the light incident surface of the semiconductor layer.

A beam intensity uniformizing element includes an optical base, a first lens array disposed at a front surface of the optical base; and a second lens array disposed at a back surface of the optical base. The first lens array includes first mold lens cells arranged in different directions along the front surface of the optical base. The first mold lens cells have surfaces constituting the front surface of the optical base. The surfaces of the first mold lens cells have first linear marks thereon extending in a first direction. The second lens array includes second mold lens cells arranged in different directions along the back surface of the optical base. The second mold lens cells have surfaces constituting the back surface of the optical base. The surfaces of the second mold lens cells have second linear marks thereon extending in a second direction different from the first direction. This element suppresses generation of an interference pattern and reduces cost.

A beam intensity uniformizing element includes an optical base, a first lens array disposed at a front surface of the optical base; and a second lens array disposed at a back surface of the optical base. The first lens array includes first mold lens cells arranged in different directions along the front surface of the optical base. The first mold lens cells have surfaces constituting the front surface of the optical base. The surfaces of the first mold lens cells have first linear marks thereon extending in a first direction. The second lens array includes second mold lens cells arranged in different directions along the back surface of the optical base. The second mold lens cells have surfaces constituting the back surface of the optical base. The surfaces of the second mold lens cells have second linear marks thereon extending in a second direction different from the first direction. This element suppresses generation of an interference pattern and reduces cost.