A light irradiation apparatus includes a plurality of light sources, a plurality of light transmission paths capable of selectively transmitting lights from the plurality of light sources, respectively, and an optical fiber path provided with a plurality of light incidence ends receiving respective lights from the plurality of light transmission paths, and a single light exit end. The optical fiber path has a plurality of optical fiber bundles. Incidence ends of the plurality of optical fiber bundles configures the plurality of light incidence ends, and exit ends of the plurality of optical fiber bundles configure the single light exit end by combining themselves. A lot of optical fibers constitute the plurality of optical fiber bundles. The optical fibers of the plurality of optical fiber bundles are dispersedly arranged with each other in uniform at the single light exit end.

An optical see-through glass type display device comprises: an image projector projecting a virtual image; a first optical element configured to guide light of the virtual image; and a second optical element having a first reflection surface for reflecting back light coming through the front surface of the second optical element and a second reflection surface for retro-reflecting light coming through the rear surface of the second optical element. The second optical element is switchable between a first state in which the reflection on the first and second reflection surfaces is enabled and a second state in which the reflection on the first and second reflection surfaces is disabled.

Illumination devices are described for illuminating a target area, e.g., floors of a room, using solid-state light sources. In general, an illumination device includes a first light guide extending along a first plane, the first light guide to receive light from first light emitting elements (LEEs) and guide the light in a first direction in the first plane; a second light guide extending along the first plane, the second light guide to receive light from second LEEs and guide the light in a second direction in the first plane opposite to the first direction; a first redirecting optic to receive light from the first light guide and direct the light in first and second angular ranges; and a second redirecting optic to receive light from the second light guide and direct the light in third and fourth angular ranges, where the first, second, third and fourth angular ranges are different.

Illumination devices are described for illuminating a target area, e.g., floors of a room, using solid-state light sources. In general, an illumination device includes a first light guide extending along a first plane, the first light guide to receive light from first light emitting elements (LEEs) and guide the light in a first direction in the first plane; a second light guide extending along the first plane, the second light guide to receive light from second LEEs and guide the light in a second direction in the first plane opposite to the first direction; a first redirecting optic to receive light from the first light guide and direct the light in first and second angular ranges; and a second redirecting optic to receive light from the second light guide and direct the light in third and fourth angular ranges, where the first, second, third and fourth angular ranges are different.

This disclosure generally relates to high-speed fiber optic networks that use light signals to transmit data over a network. The disclosed subject matter includes devices and methods relating to header subassemblies and/or optoelectronic subassemblies. In some aspects, the disclosed devices and methods may relate to a header subassembly that can include: a substrate with a substrate top and a substrate bottom; at least one optoelectronic transducer on the substrate top; at least one top electrical component on the substrate top, the electrical component can be operably coupled with the optoelectronic transducer; and at least one bottom electrical component on the substrate bottom, the bottom electrical component can be operably coupled with the optoelectronic transducer.

This disclosure generally relates to high-speed fiber optic networks that use light signals to transmit data over a network. The disclosed subject matter includes devices and methods relating to header subassemblies and/or optoelectronic subassemblies. In some aspects, the disclosed devices and methods may relate to a header subassembly that can include: a substrate with a substrate top and a substrate bottom; at least one optoelectronic transducer on the substrate top; at least one top electrical component on the substrate top, the electrical component can be operably coupled with the optoelectronic transducer; and at least one bottom electrical component on the substrate bottom, the bottom electrical component can be operably coupled with the optoelectronic transducer.

A multi-channel receiver optical subassembly (ROSA) such as an arrayed waveguide grating (AWG), with outputs directly optically coupled to respective photodetectors such as photodiodes. In one embodiment, the photodetectors are mounted on a photodetector mounting bar that includes a multiple conductive photodetector pads (PD pads). Each of the PD pads may be configured to receive a photodetector, and the PD pads are electrically isolated from ground such that the photodetectors are floating. The photodetector bar further includes multiple conductive transimpedance amplifier pads (TIA pads). Each of the TIA pads may be configured to receive a TIA, associated with one of the photodetectors, and to be electrically coupled to one or more ground ports of the TIA. The TIA pads are electrically connected to a common ground shared be each of said TIAs.

A multi-channel receiver optical subassembly (ROSA) such as an arrayed waveguide grating (AWG), with outputs directly optically coupled to respective photodetectors such as photodiodes. In one embodiment, the photodetectors are mounted on a photodetector mounting bar that includes a multiple conductive photodetector pads (PD pads). Each of the PD pads may be configured to receive a photodetector, and the PD pads are electrically isolated from ground such that the photodetectors are floating. The photodetector bar further includes multiple conductive transimpedance amplifier pads (TIA pads). Each of the TIA pads may be configured to receive a TIA, associated with one of the photodetectors, and to be electrically coupled to one or more ground ports of the TIA. The TIA pads are electrically connected to a common ground shared be each of said TIAs.

Examples herein relate to semiconductor devices having contacts that provide low contact resistance for both p-type and n-type materials. An example semiconductor device includes a semiconductor device layer having at least one of a p-type material or a n-type material. A contact is manufactured on the semiconductor device layer with a complementary metal-oxide-semiconductor process. The contact includes a first layer having palladium coupled with a surface of the semiconductor device layer, a conducting second layer coupled with the first layer, and a third layer having germanium coupled with the second conducting layer.

A radiation curable secondary coating composition for optical fiber is described and claimed. This radiation curable secondary coating composition includes component (A) which is a urethane (meth)acrylate and component (B) which is a (meth)acrylate compound with two or more ethylenically unsaturated groups and one or more bisphenol structures; wherein the content of component (B) in the composition is 60-300 mass parts per 100 mass parts of component (A). The liquid secondary coating has a viscosity at 25° C. of from about 0.1 Pa.Math.s to about 15 Pa.Math.s. Films obtained by curing the liquid radiation curable secondary coating composition of the present invention have a Young's modulus of from about 600 MPa to about 500 MPa and the breaking elongation of the cured film is from about to 5% to about 50%.