A detection apparatus including a plurality of detection systems arranged spaced apart from each other so as to detect, of a plurality of marks provided on an object held by a stage, marks different from each other, and a processing unit configured to perform a first process of obtaining a first detection value by detecting the plurality of marks by one or more detection systems in a first state in which the stage is arranged at a first rotation angle, and a second process of obtaining a second detection value by detecting the plurality of marks by two or more detection systems in a second state in which the stage is arranged at a second rotation angle, and obtain a difference between the first detection value and the second detection value for each of the plurality of marks.

A method including: determining recipe consistencies between one substrate measurement recipe of a plurality of substrate measurement recipes and each other substrate measurement recipe of the plurality of substrate measurement recipes; calculating a function of the recipe consistencies; eliminating the one substrate measurement recipe from the plurality of substrate measurement recipes if the function meets a criterion; and reiterating the determining, calculating and eliminating until a termination condition is met. Also disclosed herein is a substrate measurement apparatus, including a storage configured to store a plurality of substrate measurement recipes, and a processor configured to select one or more substrate measurement recipes from the plurality of substrate measurement recipes based on recipe consistencies among the plurality of substrate measurement recipes.

A metrology method relating to measurement of a structure on a substrate, the structure being subject to one or more asymmetric deviation. The method includes obtaining at least one intensity asymmetry value relating to the one or more asymmetric deviations, wherein the at least one intensity asymmetry value includes a metric related to a difference or imbalance between the respective intensities or amplitudes of at least two diffraction orders of radiation diffracted by the structure; determining at least one phase offset value corresponding to the one or more asymmetric deviations based on the at least one intensity asymmetry value; and determining one or more measurement corrections for the one or more asymmetric deviations from the at least one phase offset value.

A calibration system includes a plate, a fixed alignment mark, and a variable diffraction grating. The plate is adjacent to a wafer alignment mark disposed on a wafer. The fixed alignment mark is disposed on the plate and is configured to act as a reference mark for an initial calibration of the calibration system. The variable diffraction grating is disposed on the plate and includes a plurality of unit cells configured to form a plurality of variable alignment marks. The variable diffraction grating is configured to calibrate a shift-between-orders of one of the variable alignment marks and the fixed alignment mark.

Disclosed herein is a substrate stack comprising a plurality of substrates, wherein: each substrate in the substrate stack comprises at least one alignment opening set; the at least one alignment opening set in each substrate is aligned for a light beam to pass through corresponding alignment openings in each substrate; and each substrate comprises at least one alignment opening that has a smaller diameter than the corresponding alignment openings in the other substrates.

Methods and apparatuses related to fiducial designs for fiducial markers on glass substrates, or other transparent or translucent substrates, are disclosed. Example fiducial designs can facilitate visual recognition by enhancing edge detection in visual perception. In example fiducial designs, optical features on glass substrates can re-direct light so as to present a bright image region. Such optical features can include surface relief patterns formed in a coating on the surface of glass substrates. An exemplary method for manufacturing the fiducial markers can involve transfers of a fiducial design across a master mold or plate, a submaster mold or plate, and a target glass substrate. A fiducial marker can facilitate the use of the substrate in a variety of applications, including machine vision systems that facilitate automated performance of manufacturing processes on input working material.

Disclosed is a method for modeling measurement data over a substrate area and associated apparatus. The method comprises obtaining measurement data relating to a first layout; modeling a second model based on said first layout; evaluating the second model on a second layout, the second layout being more dense than said first layout; and fitting a first model to this second model according to the second layout.

An imprint lithography apparatus having a first frame to be mounted on a floor, a second frame mounted on the first frame via a kinematic coupling, an alignment sensor mounted on the second frame, to align an imprint lithography template arrangement with a target portion of a substrate, and a position sensor to measure a position of the imprint lithography template arrangement and/or a substrate stage relative to the second frame.

A drawing apparatus according to the embodiment includes a chamber configured to house a processing target; a drawing part configured to draw a predetermined pattern on the processing target with a charged particle beam; a resistance measuring part configured to measure a resistance value of the processing target via a grounding member grounding the processing target in the chamber; a receiver configured to receive earthquake information; a controller configured to stop a drawing process in the chamber when the receiver receives the earthquake information; and an arithmetic processor configured to determine whether the processing target is grounded on a basis of the resistance value from the resistance measuring part, wherein the controller resumes the drawing process when the arithmetic processor determines that the processing target is grounded after the drawing process is stopped.

A drawing apparatus according to the embodiment includes a chamber configured to house a processing target; a drawing part configured to draw a predetermined pattern on the processing target with a charged particle beam; a resistance measuring part configured to measure a resistance value of the processing target via a grounding member grounding the processing target in the chamber; a receiver configured to receive earthquake information; a controller configured to stop a drawing process in the chamber when the receiver receives the earthquake information; and an arithmetic processor configured to determine whether the processing target is grounded on a basis of the resistance value from the resistance measuring part, wherein the controller resumes the drawing process when the arithmetic processor determines that the processing target is grounded after the drawing process is stopped.