A voltage power switch includes circuitry configured to output a known voltage. The voltage power switch includes a lock circuit configured to output a known state and a voltage level shifter configured to receive an input, the input being based on the known state output by the lock circuit. The voltage power switch, using an output circuit, is configured to output a known voltage level based on an output of the voltage level shifter, wherein the known voltage is one of a high voltage V.sub.HI for a fuse programing period or a first non-zero intermediate voltage V.sub.MID1 for a non-fuse programming period.

According to an embodiment, a semiconductor device includes a substrate, a connector, a volatile semiconductor memory element, multiple nonvolatile semiconductor memory elements, and a controller. A wiring pattern includes a signal line that is formed between the connector and the controller and that connects the connector to the controller. On the opposite side of the controller to the signal line, the multiple nonvolatile semiconductor memory elements are aligned along the longitudinal direction of the substrate.

One embodiment of the present disclosure describes a memory system that may include one or more memory devices that may store data. The memory devices may receive command signals to access the stored data as a loopback signal. The memory devices may operate in a normal operational mode, a loopback operational mode, a retrieval operational mode, a non-inverting pass-through operational sub-mode, and an inverting pass-through operational sub-mode. The operational modes facilitate the transmission of the loopback signal for the purpose of monitoring of memory device operations. A selective inversion technique, which uses the operational modes, may protect the loopback signal integrity during transmission.

One embodiment of the present disclosure describes a memory system that may include one or more memory devices that may store data. The memory devices may receive command signals to access the stored data as a loopback signal. The memory devices may operate in a normal operational mode, a loopback operational mode, a retrieval operational mode, a non-inverting pass-through operational sub-mode, and an inverting pass-through operational sub-mode. The operational modes facilitate the transmission of the loopback signal for the purpose of monitoring of memory device operations. A selective inversion technique, which uses the operational modes, may protect the loopback signal integrity during transmission.

A system that includes a non-volatile memory subsystem having non-volatile memory. The system also includes a plurality of memory modules that are separate from the non-volatile memory subsystem. Each memory module can include a plurality of random access memory packages where each first random access memory package includes a primary data port and a backup data port. Each memory module can include a storage interface circuit coupled to the backup data ports of the random access memory packages. The storage interface circuit offloads data from the memory module in the event of a power loss by receiving data from the backup data ports of the random access memory packages and transmitting the data to the non-volatile memory subsystem.

Methods of operating a memory device are disclosed. A method may include receiving a write command, and in response to the write command, performing a write operation without precharging a local input/output line subsequent to receipt of the write command and prior to performing the write operation. Another method may include receiving a read command, performing a read operation in response to the read command, and receiving an additional command without precharging the local input/output line subsequent to performing the read operation and prior to receiving the additional command. Memory devices and systems are also disclosed.

Disclosed is a highly reliable physically unclonable function technology. In a tunneling-based memory device disclosed herein, a conductive layer (e.g., Al.sub.2O.sub.3) is stacked on a bottom electrode, an oxide layer (e.g., TiOx) is stacked on the conductive layer, and a top electrode is stacked on the oxide layer. The tunneling-based memory device has a structure of a memristor crossbar array and has a current-voltage characteristic independent of a temperature that is an external environmental variable due to a tunneling mechanism when constructing an unpredictable physically unclonable function (PUF) of hardware as a memory semiconductor array.

In a conventional memory subsystem, a memory controller issues explicit refresh commands to a DRAM memory device to maintain integrity of the data stored in the memory device when the memory device is in an auto-refresh mode. A significant amount of power may be consumed to carry out the refresh. To address this and other issues, it is proposed to allow a partial refresh in the auto-refresh mode in which the refreshing operation may be skipped for a subset of the memory cells. Through such selective refresh skipping, the power consumed for auto-refreshes may be reduced. Operating system kernels and memory drivers may be configured to determine areas of memory for which the refreshing operation can be skipped.

A system that includes a non-volatile memory subsystem having non-volatile memory. The system also includes a plurality of memory modules that are separate from the non-volatile memory subsystem. Each memory module can include a plurality of random access memory packages where each first random access memory package includes a primary data port and a backup data port. Each memory module can include a storage interface circuit coupled to the backup data ports of the random access memory packages. The storage interface circuit offloads data from the memory module in the event of a power loss by receiving data from the backup data ports of the random access memory packages and transmitting the data to the non-volatile memory subsystem.

A data storage device including a first printed circuit board (PCB) and a second PCB. The first PCB includes a controller, an interface configured to interface with a host device, and a first connector. The second PCB includes a non-volatile memory and a second connector. The second connector is configured to couple to the first connector to establish a communication connection between the controller and the non-volatile memory.