G11C7/00

Memory device having planes
11514976 · 2022-11-29 · ·

The present technology includes a memory device which includes a plurality of planes in which data is stored, a peripheral circuit configured to perform operations on the plurality of planes, micro-control circuits configured to control the peripheral circuit so that the operations on the plurality of planes are independently performed, and a memory manager including a control memory in which different control codes for controlling the peripheral circuit are stored, and configured to output the control codes to the micro-control circuits, wherein the memory manager is configured to sequentially output a selected control code among the control codes to the micro-control circuits respectively corresponding to the planes.

Identify the programming mode of memory cells based on cell statistics obtained during reading of the memory cells

Systems, methods and apparatus to determine a programming mode of a set of memory cells without having bit values stored in the memory cells to include an identifier of the programming mode. During the test of which of the memory cells in the set is in a lowest voltage region, which is a common operation for reading the memory cells programmed in different mode, the statistics of the memory cells found to be in the lowest voltage region can be compared to the known, different behaviors of the memory cell set programmed in different modes. A match with the behavior of one of the modes can be used to identify the matching mode as the programming mode of the set of memory cells.

Read assist circuitry for a memory device

A memory device is provided which comprises an array of bitcells and a plurality of wordlines. Each bitcell of the array of bitcells is selectively coupled to a wordline of the plurality of wordlines and access to a selected bitcell of the array of bitcells requires an asserted voltage on a selected wordline with which the selected bitcell is associated. Read assist circuitry is provided, which is configured, when read access to the selected bitcell is carried out, to implement a reduction in the asserted voltage on the selected wordline, and wherein the read assist circuitry is configured to implement the reduction in the asserted voltage by selective connection of the selected wordline to a further wordline of the plurality of wordlines.

Read assist circuitry for a memory device

A memory device is provided which comprises an array of bitcells and a plurality of wordlines. Each bitcell of the array of bitcells is selectively coupled to a wordline of the plurality of wordlines and access to a selected bitcell of the array of bitcells requires an asserted voltage on a selected wordline with which the selected bitcell is associated. Read assist circuitry is provided, which is configured, when read access to the selected bitcell is carried out, to implement a reduction in the asserted voltage on the selected wordline, and wherein the read assist circuitry is configured to implement the reduction in the asserted voltage by selective connection of the selected wordline to a further wordline of the plurality of wordlines.

Semiconductor device
09837138 · 2017-12-05 · ·

A semiconductor device may be provided. The semiconductor device may include an input signal generator configured to enable an input signal although a reset signal is disabled after a clock enable signal is enabled. The semiconductor device may include a self-refresh enable signal generator configured to generate a self-refresh enable signal based on the input signal.

Apparatuses and methods for deactivating a delay locked loop update in semiconductor devices

A semiconductor device may include a delay locked loop (DLL) control circuit coupled to an update trigger generator and a DLL update circuit. The DLL control circuit may receive an update trigger signal and an internal refresh signal and configured to activate the DLL update circuit responsive to an update trigger in the update trigger signal and deactivate the DLL update circuit responsive to an active internal refresh signal. The DLL update circuit may perform DLL update to one or more memory cell arrays when activated and not perform DLL update to the memory cell arrays when deactivated. The DLL control circuit may reactivate the DLL update circuit once the internal refresh signal becomes inactive. In other scenarios, once the DLL update circuit is deactivated, the DLL update circuit stays deactivated until the next update trigger in the update trigger signal.

Magnetic field programming of electronic devices on a wafer
09824774 · 2017-11-21 · ·

A system for programming integrated circuit (IC) dies formed on a wafer includes a magnetic field transmitter that outputs a digital test program as a magnetic signal. At least one digital magnetic sensor (e.g., Hall effect sensor) is formed with the IC dies on the wafer. The digital magnetic sensor detects and receives the magnetic signal. A processor formed on the wafer converts the magnetic signal to the digital test program and the digital test program is stored in memory on the wafer in association with one of the IC dies. The magnetic field transmitter does not physically contact the dies, but can flood an entire surface of the wafer with the magnetic signal so that all of the IC dies are concurrently programmed with the digital test program.

Memory with adjustable TSV delay

Memory devices and systems with adjustable through-silicon via (TSV) delay, and associated methods, are disclosed herein. In one embodiment, an apparatus includes a plurality of memory dies and a TSV configured to transmit signals to or receive signals from the plurality of memory dies. The apparatus further includes circuitry coupled to the TSV and configured to introduce propagation delay onto signals transmitted to or received from the TSV. In some embodiments, the apparatus includes additional circuitry configured to activate, deactivate, adjust at least a portion of the circuitry, or any combination thereof, to alter the propagation delay. In this manner, the apparatus can align internal timings of memory dies of the plurality of memory dies.

Semiconductor memory device and weak cell detection method thereof
09824776 · 2017-11-21 · ·

A semiconductor memory device includes: a plurality of memory blocks; a plurality of bit-line sense amplifiers shared by neighboring memory blocks among the plurality of the memory blocks, and suitable for sensing and amplifying data read from memory cells coupled to activated word lines through bit lines, and outputting the amplified data through a plurality of segment data lines; a word line driver suitable for activating word lines of memory blocks that do not share the bit-line sense amplifiers during a test mode; and a weak cell detection circuit suitable for compressing the amplified data transferred through the plurality of the segment data lines for generating compressed data and detecting a weak cell based on the compressed data during the test mode.

Memory controller and operating method thereof

A memory controller may include: a request checker identifying memory devices corresponding to requests received from a host among the plurality of memory devices and generating device information on the identified memory devices to perform operations corresponding to the requests; a dummy manager outputting a request for controlling a dummy pulse to be applied to channels of selected memory devices according to the device information among the plurality of channels; and a dummy pulse generator sequentially applying the dummy pulse to the channels coupled to the selected memory devices, based on the request for controlling the dummy pulse. A memory controller may include an idle time monitor outputting an idle time interval of the memory device and a clock signal generator generating a clock signal based on the idle time interval and outputting the clock signal to the memory device through the channel to perform a current operation.